F-219 SUPPLEMENT
MIT–019–01–F–D
MIT–038–01–F–D
®
MIT–057–01–L–D
(0.635 mm) .025"
MIT SERIES
MIXED TECHNOLOGY HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIT
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
MIS
Standoffs:
SO
Integral metal plane
for power or ground
76 signal lines
per linear inch
Choice of
mated heights
• Mixed
technology
footprint
HIGH-SPEED CHANNEL PERFORMANCE
MIT/MIS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
28
G b p s
Polarized
MIT
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–019, –038, –057
(38 total positions per bank)
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–F
–L
ALSO AVAILABLE
(MOQ Required)
• 11 mm, 16 mm, 18.75 mm
and 22 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–K
= 10 µ" (0.25 µm) Gold on
Signal Pins and Ground Plane,
Matte Tin on tails
LEAD
STYLE
= Tape &
Reel
–TR
A
(4.27) .168
(7.26) .286
–01
–02
(No. of Positions/19) x (12.70) .500 + (11.43) .450
(12.70)
.500
02
(7.11)
.280
(0.635)
.025
(1.40)
.055
(0.58) .023 x (0.38) .015
(0.20)
.008
01
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins
in contact area, 10 µ" (0.25 µm)
min Au over 50 µ" (1.27 µm) Ni
on Ground Plane in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
*Note:
–C Plating passes 10 year MFG testing
–C*
(5.97)
.235
MATED HEIGHT*
(7.11)
.280
MIS
LEAD
STYLE
MIT LEAD STYLE
–01
(5.00)
.197
–02
(8.00)
.315
A
(0.38)
.015
–01
*Processing conditions will affect
mated height. See SO Series for
board space tolerances.
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Note:
Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Samtec
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