6N134, 81028, HCPL-563x, HCPL-663x,
HCPL-565x, 5962-98001, HCPL-268K,
HCPL-665x, 5962-90855, HCPL-560x
1
Hermetically Sealed, High Speed, High CMR,
Logic Gate Optocouplers
Data Sheet
1.
See matrix for available extensions.
Description
These units are single, dual and quad channel, hermetically
sealed optocouplers. The products are capable of operation
and storage over the full military temperature range and can
be purchased as either commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the
appropriate DLA Drawing. All devices are manufactured and
tested on a MIL-PRF-38534 certified line and Class H and K
devices are included in the DLA Qualified Manufacturers List
QML-38534 for Hybrid Microcircuits. Quad channel devices are
available by special order in the 16-pin DIP through hole
packages.
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five hermetically sealed package configurations
Performance guaranteed over full military temperature
range: –55°C to +125°C
High speed: 10 Mbd typical
CMR: > 10,000 V/μs typical
1500 Vdc withstand test voltage
2500 Vdc withstand test voltage for HCPL-565x
High radiation immunity
6N137, HCPL-2601, HCPL-2630/31 function compatibility
Reliability data
TTL circuit compatibility
Applications
Military and aerospace
High reliability systems
Transportation, medical, and life critical systems
Line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Isolation for computer, communication, and test
equipment systems
Broadcom
-1-
6N134, 81028, HCPL-563x, HCPL-663x, HCPL-565x, 5962-98001, HCPL-268K, HCPL-665x,
5962-90855, HCPL-560x
Data Sheet
Functional Diagram
Functional Diagram
V
CC
V
E
V
OUT
GND
Multiple channel devices available.
Truth Table (Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
L
H
Output
Each channel contains a GaAsP light emitting diode that is
optically coupled to an integrated high speed photon detector.
The output of the detector is an open collector Schottky
clamped transistor. Internal shields provide a guaranteed
common mode transient immunity specification of 1000 V/μs.
For Isolation Voltage applications requiring up to 2500 Vdc, the
HCPL-5650 family is also available. Package styles for these
parts are 8- and 16-pin DIP through hole (case outlines P and E,
respectively), and 16-pin surface mount DIP flat pack (case
outline F), leadless ceramic chip carrier (case outline 2). Devices
may be purchased with a variety of lead bend and plating
options. See the Selection Guide table for details. Standard
Microcircuit Drawing (SMD) parts are available for each
package and lead style.
Because the same electrical die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are identical for all parts.
Occasional exceptions exist due to package variations and
limitations, and are as noted. Additionally, the same package
assembly processes and materials are used in all devices. These
similarities give justification for the use of data obtained from
one part to represent other parts’ performance for reliability
and certain limited radiation test results.
Single Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
H
H
L
L
Enable
L
H
H
H
Output
NOTE
The connection of a 0.1 μF bypass capacitor
between V
CC
and GND is recommended.
Broadcom
-2-
6N134, 81028, HCPL-563x, HCPL-663x, HCPL-565x, 5962-98001, HCPL-268K, HCPL-665x,
5962-90855, HCPL-560x
Data Sheet
Selection Guide – Package Styles and Lead Configuration Options
Selection Guide – Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Withstand Test Voltage
Avago Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
b
Butt Cut/Gold Plate
a
Gull Wing/Soldered
b
Class H SMD Part #
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
Class K SMD Part #
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
a.
b.
16-Pin DIP
Through Hole
2
V
CC
, GND
1500 Vdc
6N134
6N134/883B
HCPL-268K
Gold Plate
a
Option #200
Option #100
Option #300
8-Pin DIP
Through Hole
1
None
1500 Vdc
HCPL-5600
HCPL-5601
HCPL-560K
Gold Plate
a
Option #200
Option #100
Option #300
8-Pin DIP
Through Hole
2
V
CC
, GND
1500 Vdc
HCPL-5630
HCPL-5631
HCPL-563K
Gold Plate
a
Option #200
Option #100
Option #300
8-Pin DIP
Through Hole
2
V
CC
, GND
2500 Vdc
HCPL-5650
HCPL-5651
Gold Plate
a
Option #200
16-Pin Flat Pack
Unformed Leads
4
V
CC
, GND
1500 Vdc
HCPL-6650
HCPL-6651
HCPL-665K
Gold Plate
a
20-Pad LCCC
Surface Mount
2
None
1500 Vdc
HCPL-6630
HCPL-6631
HCPL-663K
Solder Pads
b
None
8102801EC
8102801EA
8102801UC
8102801UA
8102801TA
5962-
9085501HPC
9085501HPA
9085501HYC
9085501HYA
9085501HXA
None
8102802PC
8102802PA
8102802YC
8102802YA
8102802ZA
None
8102805PC
8102805PA
None
8102804FC
None
81028032A
5962-
9800101KEC
9800101KEA
9800101KUC
9800101KUA
9800101KTA
5962-
9085501KPC
9085501KPA
9085501KYC
9085501KYA
9085501KXA
5962-
9800102KPC
9800102KPA
9800102KYC
9800102KYA
9800102KZA
5962-
9800104KFC
5962-
9800103K2A
Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches.
Solder lead finish: Sn63/Pb37.
Broadcom
-3-
6N134, 81028, HCPL-563x, HCPL-663x, HCPL-565x, 5962-98001, HCPL-268K, HCPL-665x,
5962-90855, HCPL-560x
Data Sheet
Functional Diagrams
Functional Diagrams
16-Pin DIP
Through Hole
2 Channels
1
2
3
4
5
6
7
8
GND
V
O2
V
CC
V
O1
16
15
14
13
12
11
10
9
4
GND
5
2
3
8-Pin DIP
Through Hole
1 Channel
1
V
CC
V
E
V
OUT
6
8
7
8-Pin DIP
Through Hole
2 Channels
1
V
CC
V
O1
V
O2
8
16-Pin Flat Pack
Unformed Leads
4 Channels
1
2
3
6
5
20-Pad LCCC
Surface Mount
2 Channels
15
16
19
V
CC2
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
2
3
4
7
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
13
12
11
10
9
20
4
5
6
7
8
2
3
10
GND
NOTE
All DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 7. LCCC (leadless
ceramic chip carrier) package has isolated channels with separate V
CC
and ground connections. All diagrams are
“top view.”
Outline Drawings
16-Pin DIP, Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Broadcom
-4-
6N134, 81028, HCPL-563x, HCPL-663x, HCPL-565x, 5962-98001, HCPL-268K, HCPL-665x,
5962-90855, HCPL-560x
Data Sheet
Leaded Device Marking (8- and 16-Pin DIPS, Flat Pack)
Leaded Device Marking (8- and 16-Pin
DIPS, Flat Pack)
Avago LOGO
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
X 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
[1] QML PARTS ONLY
Leadless Device Marking (20 LCCC)
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
X XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD
[1]
DLA SMD
[1]
Avago CAGE CODE
[1]
[1] QML PARTS ONLY
Outline Drawings (Continued)
8-Pin DIP, Through Hole, 1 and 2 Channels
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170)
MAX.
5.08 (0.200)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
7.36 (0.290)
7.87 (0.310)
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
8-Pin DIP, Through Hole, 2 Channels,
2500 Vdc Withstand Test Voltage
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Broadcom
-5-
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
