NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6ULLIEC
Rev. 1.2, 11/2017
MCIMX6Y0CVM05AA
MCIMX6Y1CVM05AA
MCIMX6Y1CVK05AA
MCIMX6Y2CVM05AA
MCIMX6Y2CVM08AA
MCIMX6Y2CVK08AB
MCIMX6Y0CVM05AB
MCIMX6Y1CVM05AB
MCIMX6Y1CVK05AB
MCIMX6Y2CVM05AB
MCIMX6Y2CVM08AB
i.MX 6ULL Applications
Processors for Industrial
Products
Package Information
Plastic Package
MAPBGA 14 x 14 mm, 0.8 mm pitch
MAPBGA 9 x 9 mm, 0.5 mm pitch
Ordering Information
See
Table 1 on page 3
1
i.MX 6ULL Introduction
The i.MX 6ULL processors represent NXP’s latest
achievement in integrated multimedia-focused products
offering high performance processing with a high degree
of functional integration, targeted towards the growing
market of connected devices.
The i.MX 6ULL is a high performance, ultra efficient
processor family with featuring NXP’s advanced
implementation of the single Arm Cortex®-A7 core,
which operates at speeds of up to 792 MHz. i.MX 6ULL
includes integrated power management module that
reduces the complexity of external power supply and
simplifies the power sequencing. Each processor in this
family provides various memory interfaces, including
LPDDR2, DDR3, DDR3L, Raw and Managed NAND
flash, NOR flash, eMMC, Quad SPI, and a wide range of
other interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, displays, and camera
sensors.
1. i.MX 6ULL Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 18
3.2. Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21
4.2. Power Supplies Requirements and Restrictions . 31
4.3. Integrated LDO Voltage Regulator Parameters . . 32
4.4. PLL’s Electrical Characteristics . . . . . . . . . . . . . . . 34
4.5. On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 36
4.6. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 37
4.7. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40
4.8. Output Buffer Impedance Parameters . . . . . . . . . 43
4.9. System Modules Timing . . . . . . . . . . . . . . . . . . . . 46
4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 57
4.11. General-Purpose Media Interface (GPMI) Timing 58
4.12. External Peripheral Interface Parameters . . . . . . . 66
4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 103
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 103
5.2. Boot Device Interface Allocation . . . . . . . . . . . . . 104
6. Package Information and Contact Assignments . . . . . 111
6.1. 14 x 14 mm Package Information . . . . . . . . . . . . 111
6.2. 9 x 9 mm Package Information . . . . . . . . . . . . . . 124
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
© 2016-2017 NXP B.V.
i.MX 6ULL Introduction
The i.MX 6ULL processors are specifically useful for applications such as:
• Telematics
• Audio playback
• Connected devices
• IoT Gateway
• Access control panels
• Human Machine Interfaces (HMI)
• Portable medical and health care
• IP phones
• Smart appliances
• eReaders
The features of the i.MX 6ULL processors include:
• Single-core Arm Cortex-A7—The single core A7 provides a cost-effective and power-efficient
solution.
• Multilevel memory system—The multilevel memory system of processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processor supports
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, NAND Flash (MLC and SLC), OneNAND™, Quad SPI, and managed NAND, including
eMMC up to rev 4.4/4.41/4.5.
• Smart speed technology—Power management implemented throughout the IC that enables
multimedia features and peripherals to consume minimum power in both active and various low
power modes.
• Dynamic voltage and frequency scaling—The power efficiency of devices by scaling the voltage
and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of processor is enhanced by a multilevel
cache system, NEON™ MPE (Media Processor Engine) co-processor, a programmable smart
DMA (SDMA) controller, an asynchronous audio sample rate converter, an Electrophoretic
Display (EPD) controller, and a Pixel processing pipeline (PXP) to support 2D image processing,
including color-space conversion, scaling, alpha-blending, and rotation.
• 2x Ethernet interfaces—2x 10/100 Mbps Ethernet controllers.
• Human-machine interface—Each processor supports one digital parallel display interface.
• Interface flexibility—Each processor supports connections to a variety of interfaces: two
high-speed USB on-the-go with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), two 12-bit ADC modules with up to 10 total input channels and two CAN ports.
• Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, AES-128
encryption, SHA-1, SHA-256 HW acceleration engine, and secure software downloads. The
security features are discussed in the
i.MX 6ULL Security Reference Manual
(IMX6ULLSRM).
i.MX 6ULL Applications Processors for Industrial Products, Rev. 1.2, 11/2017
2
NXP Semiconductors
i.MX 6ULL Introduction
•
Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
For a comprehensive list of the i.MX 6ULL features, see
Section 1.2, “Features"”.
1.1
Ordering Information
Table 1. Ordering Information
Part Number
Feature
Package
Junction
Temperature T
j
(C)
-40 to +105
Table 1
provides examples of orderable part numbers covered by this data sheet.
MCIMX6Y0CVM05AA
MCIMX6Y0CVM05AB
Features supports:
• 528 MHz, industrial grade for general purpose
• No security
• No LCD/CSI
• No CAN
• Ethernet x1
• USB OTG x1
• ADC x1
• UART x4
• SAI x1
• No ESAI
• Timer x2
• PWM x4
• I2C x2
• SPI x2
Features supports:
• 528 MHz, industrial grade for general purpose
• Basic security
• No LCD/CSI
• CAN x1
• Ethernet x1
• USB OTG x2
• ADC x1
• UART x8
• SAI x3
• ESAI x1
• Timer x4
• PWM x8
• I2C x4
• SPI x4
14 x 14 mm, 0.8 pitch
MAPBGA
MCIMX6Y1CVM05AA
MCIMX6Y1CVM05AB
14 x 14 mm, 0.8 pitch
MAPBGA
-40 to +105
i.MX 6ULL Applications Processors for Industrial Products, Rev. 1.2, 11/2017
NXP Semiconductors
3
i.MX 6ULL Introduction
Table 1. Ordering Information
Part Number
Feature
Package
Junction
Temperature T
j
(C)
-40 to +105
MCIMX6Y1CVK05AA
MCIMX6Y1CVK05AB
Features supports:
• 528 MHz, industrial grade for general purpose
• Basic security
• No LCD/CSI
• CAN x1
• Ethernet x1
• USB OTG x2
• ADC x1
• UART x8
• SAI x3
• ESAI x1
• Timer x4
• PWM x8
• I2C x4
• SPI x4
Features supports:
• 528 MHz, industrial grade for general purpose
• Basic security
• With LCD/CSI
• CAN x2
• Ethernet x2
• USB OTG x2
• ADC x2
• UART x8
• SAI x3
• ESAI x1
• Timer x4
• PWM x8
• I2C x4
• SPI x4
9 x 9 mm, 0.5 pitch
MAPBGA
MCIMX6Y2CVM05AA
MCIMX6Y2CVM05AB
14 x 14mm, 0.8 pitch
MAPBGA
-40 to +105
i.MX 6ULL Applications Processors for Industrial Products, Rev. 1.2, 11/2017
4
NXP Semiconductors
i.MX 6ULL Introduction
Table 1. Ordering Information
Part Number
Feature
Package
Junction
Temperature T
j
(C)
-40 to +105
MCIMX6Y2CVM08AA
MCIMX6Y2CVM08AB
Features supports:
• 792 MHz, industrial grade for general purpose
• Basic security
• With LCD/CSI
• CAN x2
• Ethernet x2
• USB OTG x2
• ADC x2
• UART x8
• SAI x3
• ESAI x1
• Timer x4
• PWM x8
• I2C x4
• SPI x4
Features supports:
• 792 MHz, industrial grade for general purpose
• Basic security
• With LCD/CSI
• CAN x2
• Ethernet x2
• USB OTG x2
• ADC x2
• UART x8
• SAI x3
• ESAI x1
• Timer x4
• PWM x8
• I2C x4
• SPI x4
14 x 14 mm, 0.8 pitch
MAPBGA
MCIMX6Y2CVK08AB
9 x 9 mm, 0.5 pitch
MAPBGA
-40 to +105
Figure 1
describes the part number nomenclature so that the users can identify the characteristics of the
specific part number they have (for example, cores, frequency, temperature grade, fuse options, and silicon
revision). The primary characteristic which describes which data sheet applies to a specific part is the
temperature grade (junction) field.
• The i.MX 6ULL Applications Processors for Industrial Products Data Sheet (IMX6ULLIEC)
covers parts listed with a “C (Industrial temp)”
Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field
and matching it to the proper data sheet. If there will be any questions, visit the web page
NXP.com/imx6series or contact a NXP representative for details.
i.MX 6ULL Applications Processors for Industrial Products, Rev. 1.2, 11/2017
NXP Semiconductors
5
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