0.4/0.5mm Pitch 1.5mm Height High Speed Transmission (5 Gbps) FPC Connectors
FH55/FH55M Series
Dimensions : 40 pos
23.
4mm (depth)
+
4m
m(
FH
5
5)/
19.
3m
m(
FH
5
5M
)
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
1.5mm
Fig.1
■
Features
1. High-Speed Transmission(5 Gbps) FPC Connectors
Capable of transmitting high-speed differential
signals by arranging signal contacts (S) and ground
+
contacts (G) in the sequence of GSSG. (5 Gbps)
(The GSSG layout utilizes differential signals, but
the contacts can also be designated for other uses
other than differential signals.)
+
FH55 differential impedance
50 ps rise time (20-80%)
2. Impedance Matched-Contact Design
The signal contacts were designed with impedance
control in mind and to realize superior high-speed
transmission feature.(Fig.
2
)
Fig.2
3. Fully Enclosed Molded Structure (Over molding Structure)
Board space under the connector can be utilized in
patterning since the bottom of the connector is
covered with resin and enhances PCB flexibility.
FH55 eye diagram (5 Gbps)
0.6
Eye_Probe_Rx.Density
0.4
4. Flip-Lock System Provides Reliability and FPC Security
The Flip-lock (one-touch rotational lock) ZIF
structure allows for a reliable and simple to secure
FPC connection operation. Utilizing a clear clicking
feeling at the time of locking prevents an
incomplete lock.
0.2
0.0
-0.2
-0.4
-0.6
0
50
100
150
200
250
300
350
400
5. Easy FPC insertion
The FPC guiding system utilizes guide tabs that
enable a temporary hold while FPC is inserted and
accurately determines mating location all while
ensuring a consistent connection.
time, psec
Fig.3
FPC Insertion
Actuator open
6. Compatible with 0.3mm Thick FPC
This connector utilizes 0.3mm thick FPC, which is
the standard thickness of a 0.5mm pitch connector
(Appropriate stiffness with reinforcing board
prevents FPC deformation, preventing troubles at
times of insertion and mating).
FPC
Fig.4
7. Automatic Mounting Option Available
Emboss packaging makes automatic mounting
possible (5,000 pcs/reel).
Locked
8. Halogen-free
Chlorine and bromine are not used in amounts that
exceed the standard values in these connectors.
* Defined according to IEC 61249-2-21
Br : 900ppm or below ; CI : 900pm or below ; Br + Cl :
1,500ppm or below
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
Fig.5
2015.12
③
1
FH55/FH55M Series●0.4/0.5mm Pitch 1.5mm Height High Speed Transmission (5 Gbps) FPC Connectors
+
■Product
Specifications
Ratings
Curren
ratingt
0.5A (0.5mm pitch products)(Note 1) Operating
Storage temperature -10 to +50°C
-55 to +85°C (Note 2)
0.4A (0.4mm pitch products)(Note 1) temperature range
range
(Note 3)
RH 90% or less (no
condensation)
Storage humidity
range
RH 90% or less
(no condensation)
Voltage AC 50V rms (0.5mm pitch products) Operating
rating
AC 40V rms (0.4mm pitch products) humidity range
Suitable FPC/FFC
contact specifications
Items
t = 0.3 ± 0.03 gold-plated
Specifications
500Mø min
No flashover or breakdown
100mø max
* Including FPC conductor resistance
100mø max
No breakage, cracking, or loosening to parts
No electric outage of 1µ or greater
Contact resistance : 100mø max
No breakage, cracking, or loosening to parts
No electric outage of 1µ or greater
Contact resistance : 100mø max
No breakage, cracking, or loosening to parts
Conditions
Measured at DC 100V
AC 150Vrms applied for 1 minute
Measured at 1mA
20 times
10 cycles in each of three directions at frequency
10-55 Hz, half amplitude 0.75mm
Acceleration of 981m/s
2
; duration 6ms, sine half-
wave, 3 cycles in each of the 3 axes each in both
directions
96 hours at temperature 40°C and humidity 90-95%
Temperature : -55°C
➝
+15°C to +35°C
➝
+85°C
➝
+ 15° to +35°C
Time : 30
➝
2 to 3
➝
30
➝
2 to 3 minutes
5 cycles with the above conditions
1) Reflow : Peak temperature MAX 250°C, 230°C or
greater for 60 seconds
2) Soldering iron : 350±10°C for 5 seconds
1.Insulation Resistance
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
2.Withstanding Voltage
3.Contact Resistance
4.Repeat Performance
5.Vibration Resistance
6.Shock Resistance
Contact Resistance : 100mø max
7.Humidity Resistance in
Insulation Resistance : 50Mø min
Steady State
No breakage, cracking, or loosening to parts
8.Temperature Cycle
Contact Resistance : 100mø max
Insulation Resistance : 50Mø min
No breakage, cracking, or loosening to parts
No marked instability in contacts, or
appearance of deformation.
9.Solder Heat
Resistance
Note 1 : Use at 70% of the current rating when all pins are energized with current rating.
Note 2 : Temperature rise at the time of electrification is included.
Note 3 : The term “storage” refers to the long-term storage condition of unused products before board mounting. The operating
temperature and humidity ranges apply to non-energized state after board mounting.
■Materials
/ Finish
Part
Insulator
Contact
Metal Parts
Materials
LCP
Phosphor bronze
Brass
Color/finish
Gray
Black
Gold-plating
Pure tin reflow plating
Remarks
UL94V-0
− ー
ー ー
■Product
Number Structure
FH 55 M − 40S − 0.5 SH
❶
❷
❸
❹
❺
❻
❹
Number of contacts : 10 to 61 positions (0.5mm pitch products)
❶
Series name : FH
❷
Series No. : 55
❸
No symbol : 0.5mm pitch products
19 to 79 positions (0.4mm pitch products)
❺
Contact pitch : 0.5mm or 0.4mm
❻
Contact Form
M : 0.4mm pitch products
SH : SMT horizontal mounting type
2
FH55/FH55M Series●0.4/0.5mm Pitch 1.5mm Height High Speed Transmission (5 Gbps) FPC Connectors
+
■Connector
dimensional drawing
●0.5mm/0.4mm
pitch products
A
B
Pin No.: 1
G:GROUND CONTACT
R
S:SIGNAL CONTACT
(0.12)
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
A**
Polarity mark
HRS mark
Cavity No
Number of contacts
°)
(3.8)
(1
15
(0.15)
(C: FPC insertion area dimension)
D
1.1
4
(4.2)
Notes : 1. The dimensions in parentheses ( ) are reference values.
2. The lead co-planarity of connector and reinforcing metal part is MAX 0.1mm.
3. This product is emboss-packaged. See the package specification diagram for details.
4. Dimensions may be changed for sink mark prevention due to improvement, etc.
5. Black dots, etc. may occur in mold resin but do not create a quality problem.
6. This product is the halogen-free product. (Br content rate: 900 ppm or less ; CI content rate : 900ppm
or less; Br + CI total content rate : 1,500ppm or less)
7. See the table below for available pin arrangements.
S : SIGNAL CONTACT G : GROUND CONTACT
* Pins are arranged in the sequence of GSSG to manage high-speed differential signals ; however, all
contacts can be used as signals for normal signals other than high-speed signals. Please contact
our sales representative for any questions.
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70
S G S S G S S G S S G S S G S S G S S G S S G S S G S S G S S G S S G
71 72 73 74 75 76 77 78 79
S S G S S G S S G
Pin assignment G S S G S S G S S G S S G S S G S S G S S G S S G S S G S S G S S G S
Unit : mm
Part No.
FH55-10S-0.5SH
FH55-22S-0.5SH
FH55-31S-0.5SH
FH55-40S-0.5SH
FH55-49S-0.5SH
FH55-61S-0.5SH
FH55M-19S-0.4SH
FH55M-31S-0.4SH
FH55M-40S-0.4SH
FH55M-49S-0.4SH
FH55M-61S-0.4SH
FH55M-79S-0.4SH
HRS No.
Under planning
580-3707-7 00
580-3704-9 00
580-3700-8 00
Under planning
Under planning
Under planning
580-3711-0 00
580-3706-4 00
Under planning
Under planning
Under planning
No. of contacts No. of signal contacts No. of ground contacts
10
22
31
40
49
61
19
31
40
49
61
79
6
14
20
26
32
40
12
20
26
32
40
52
4
8
11
14
17
21
7
11
14
17
21
27
A
8.4
14.4
18.9
23.4
27.9
33.9
10.9
15.7
19.3
22.9
27.7
34.9
B
4.5
10.5
15
19.5
24
30
7.2
12
15.6
19.2
24
31.2
C
5.57
D
7.59
1.5
0.3
11.57 13.59
16.07 18.09
20.57 22.59
25.07 27.09
31.07 33.09
8.07
10.09
12.87 14.89
16.47 18.49
20.07 22.09
24.87 26.89
32.07 34.09
0.4
0.5
The products above without a HRS No. are currently under planning. Please contact our sales representative for questions concerning the number of contacts.
(2.7)
R
3
FH55/FH55M Series●0.4/0.5mm Pitch 1.5mm Height High Speed Transmission (5 Gbps) FPC Connectors
+
Recommended PCB mounting pattern
●FH55
Series
0.65
± 0.03
B
( 0.2 )
0.5
PIN No.1
×NUMBER OF CONTACTS
0.3
± 0.03
0.1 Q
●FH55M
Series
Q
0.65
± 0.03
B
PIN No.1
×NUMBER OF CONTACTS
0.04 Q
0.22
± 0.02
4.3
± 0.05
4.3
± 0.05
( 0.2 )
0.4
Q
1.5
± 0.03
0.7
± 0.03
Ｅ
± 0.05
( A )
1.5
± 0.03
Connector image:underside
Connector image:underside
0.7
± 0.03
0.7
± 0.03
Ｅ
± 0.05
( A)
0.7
± 0.03
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Recommended Stencil pattern
●
FH55 Series
RECOMMENDED STENCIL THICKNESS: t=0.10
●
FH55M Series
0.6
± 0.01
B
0.65
± 0.03
0.5
PIN No.1
S
0.25
± 0.03
B
0.4
PIN No.1
×NUMBER OF CONTACTS
0.02 S
RECOMMENDED STENCIL THICKNESS: t=0.10
S
0.2
± 0.01
×NUMBER OF CONTACTS
0.1 S
4.3
± 0.05
4.3
± 0.02
PCB mounting pattern image
PCB mounting pattern image
1.5
± 0.03
1.5
± 0.01
0.7
± 0.03
Ｅ
± 0.05
( A )
0.7
± 0.03
0.7
± 0.01
Ｅ
± 0.02
( A )
0.7
± 0.01
Recommended FPC dimensional drawing
F±0.1
G±0.05
R±0.07
B±0.03
R±0.07
0.6±0.05
0.35±0.05
1.5±0.05
2×R0.2±0.1
2×R0.2±0.1
2×R0.2±0.1
R±0.03
W±0.03
0.3±0.03
3.5 MIN(Stiffener)
2.5±0.3
2×R0.2±0.1
2×R0.2±0.1
(1MIN)
（2.9）
Ground copper foil
Unit : mm
Part No.
FH55-10S-0.5SH
FH55-22S-0.5SH
FH55-31S-0.5SH
FH55-40S-0.5SH
FH55-49S-0.5SH
FH55-61S-0.5SH
FH55M-19S-0.4SH
FH55M-31S-0.4SH
FH55M-40S-0.4SH
FH55M-49S-0.4SH
FH55M-61S-0.4SH
FH55M-79S-0.4SH
HRS No.
Under planning
580-3707-7 00
580-3704-9 00
580-3700-8 00
Under planning
Under planning
Under planning
580-3711-0 00
580-3706-4 00
Under planning
Under planning
Under planning
No. of contacts No. of signal contacts No. of ground contacts
10
22
31
40
49
61
19
31
40
49
61
79
6
14
20
26
32
40
12
20
26
32
40
52
4
8
11
14
17
21
7
11
14
17
21
27
E
7
13
17.5
22
26.5
32.5
9.5
14.3
17.9
21.5
26.3
33.5
F
6.65
12.65
17.15
21.65
26.15
32.15
9.15
13.95
17.55
21.15
25.95
33.15
G
5.5
11.5
16
20.5
25
31
8
12.8
16.4
20
24.8
32
R
W
0.5
0.37
0.4
0.27
The products above without a HRS No. are currently under planning. Please contact our sales representative for questions concerning the number of contacts.
4
FH55/FH55M Series●0.4/0.5mm Pitch 1.5mm Height High Speed Transmission (5 Gbps) FPC Connectors
+
FH55/FH55M Series FPC Material Constitution (Recommended Specifications)
①Cover
lay film
②Cover
adhesive
③Surface
finish (Nickel base + Gold plating)
④Copper
plating (Through-hole copper)
⑤Pattern
copper foil
⑨Ground
copper foil
⑩Copper
plating (Through-hole copper)
⑥Base
adhesive (Thermosetting adhesive)
⑦Base
film
⑧Base
adhesive (Thermosetting adhesive)
⑪Cover
adhesive (Thermosetting adhesive)
⑫Cover
lay film
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
⑬Reinforcement
material adhesive (Thermosetting adhesive)
⑭Stiffener
film
Material Thickness (µm)
Names of Materials
①Cover
lay film
②Cover
adhesive
③Surface
treatment (nickel base + gold plating)
④Copper
plating (through-hole copper)
⑤Pattern
copper foil
⑥Base
adhesive
⑦Base
film
2
Notes 1 : The FPC material
2
LCP
PI
PI
2-layer CCL 2-layer CCL 3-layer CCL
12.5
28
(6)
15
9
-
50
-
9
15
28
12.5
50
125
295.5
12.5
28
(6)
15
18
-
25
-
18
15
28
12.5
50
150
304.5
12.5
28
(6)
15
18
16
25
16
18
15
28
12.5
30
125
291.5
constitution is a
reference example.
Please make the
thickness of FPC
mating area 0.3±0.03
mm by referring
to this material
constitution.
⑧Base
adhesive
⑨Ground
copper foil
⑩Copper
plating (through-hole copper)
⑪Cover
adhesive
⑫Cover
lay film
⑬Reinforcement
material adhesive (Thermosetting adhesive)
⑭Stiffener
film
Total (Mating Area Thickness: Total of
③∼⑧
and
⑪∼⑭)
2
It is a reference
example of the base
film material. LCP
refers to liquid crystal
polymer, and PI for
polyimide.
Temperature Profile
MAX 250℃
250
230℃
200
Temperature (C°)
200℃
Applicable Conditions
Reflow System : Far-infrared, hot-air reflow
Reflow chamber atmosphere : Air
Solder
: Paste type Sn/3.0Ag/0.5 Cu
(M705-221CM5-42-10.5 ;
Senju Metal Industry Co., Ltd.)
Test Board
: Board material and size
Glass epoxy 30 x 60 x 1.0mm
Land dimensions
Contact area: 0.3 x 0.65
Metal part area: 0.7 x 1.5mm
Metal Mask
: Thickness 0.1 mm
Aperture Dimension
Contact area 0.25 x 0.65
Metal part area 0.7 x 1.5mm
The temperature profile shown above is based on
the above applicable conditions.
Due to the changing conditions such as solder paste
types, manufacturers, board size and other
soldering materials, please check to ensure the
proper soldering conditions before use.
150
150℃
100
50
25℃
(60 seconds)
0
Start
Time (second)
90-120 seconds
Preheating time
(60 seconds)
Soldering time
5
FPGA/CPLD
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