NXP Semiconductors
Data Sheet
WCT101XDS
Features
•
•
•
•
•
•
•
•
•
•
•
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Compliant with the latest version Wireless Power
Consortium (WPC) power class 0 specification power
transmitter design
Supports wide transmitter DC input voltage range of 5
V to 24 V
Integrated digital demodulation
Supports two-way communication, transmitter to
receiver by FSK and receiver to transmitter by ASK
Supports Q factor detection and calibrated power loss
based Foreign Object Detection (FOD) framework
Supports low standby power
Uses rail voltage control, phase difference control or
duty cycle control with the fixed operation frequency
to alleviate EMI in the EMI sensitive system
Supports operation frequency dithering technology to
eliminate interference with specific frequency band
electronic devices
Supports CAN/IIC/SCI/SPI interfaces
LED for system status indication
Over-voltage/current/temperature protection
Software based solution to provide maximum design
freedom and product differentiation
Document Number:
WCT101XDS
Rev. 1.2 ,05/2019
The WCT101x is a wireless power transmitter controller
that integrates all required functions for WPC “Qi”
compliant wireless power transmitter design. It is an
intelligent device that works with the NXP touch sensing
technology or uses periodically analog PING to detect a
mobile device for charging while gaining super low standby
power. Once the mobile device is detected, the WCT101x
controls the power transfer by adjusting the rail voltage, the
phase difference, or the duty cycle of the power stage
according to message packets sent by the mobile device.
To maximize the design freedom and product
differentiation, the WCT101x supports the extended power
profile industrial/consumer power transmitter design (WPC
MP-Ax types, MP-Bx types or customization) using the
fixed operation frequency control methods such as rail
voltage control, phase difference control or duty cycle
control etc. by software based solution, which can support
wireless charging with both extended power profile power
receiver and baseline power profile power receiver. In
addition, the easy-to-use FreeMASTER GUI tool has
configuration, calibration and debugging functions to
provide the user-friendly design experience and reduce
time-to-market.
The WCT101x includes a digital demodulation module to
reduce the external components, an FSK modulation
module to support two-way communication, a protection
module to handle the over-voltage/current/temperature
protection, an FOD module to protect from overheating by
misplaced metallic foreign objects, and general
CAN/IIC/SCI/SPI interfaces for external communications.
It also handles any abnormal condition and operational
status and provides comprehensive indicator outputs for
robust system design.
Applications
•
Industrial/Consumer Extended Power Profile Power
Transmitter
o
WPC compliant or customer properties
Overview Description
Wireless Charging System Functional Diagram
Contents
1
1.1
1.2
1.3
1.4
Absolute maximum ratings ..................................................................................................................... 4
Electrical operating ratings .................................................................................................................................. 4
Thermal handling ratings ..................................................................................................................................... 5
ESD handling ratings ............................................................................................................................................ 5
Moisture handling ratings .................................................................................................................................... 5
2
2.1
2.2
2.3
Electrical characteristics.......................................................................................................................... 6
General characteristics ........................................................................................................................................ 6
Device characteristics .......................................................................................................................................... 8
Thermal operating characteristics ...................................................................................................................... 22
3
3.1
3.2
3.3
3.4
3.5
Typical Performance Characteristics ............................................................................................... 23
System efficiency............................................................................................................................................... 23
Standby power .................................................................................................................................................. 23
Digital demodulation ......................................................................................................................................... 23
Two-way communication .................................................................................................................................. 23
Foreign object detection .................................................................................................................................... 23
4
4.1
4.2
4.3
4.4
Device Information ................................................................................................................................. 24
Functional block diagram................................................................................................................................... 24
Product features overview................................................................................................................................. 24
Pinout diagram .................................................................................................................................................. 26
Pin function description ..................................................................................................................................... 27
WCT101XDS, Rev. 1.2, 05/2019
2
NXP Semiconductors
4.5
4.6
Ordering information ........................................................................................................................................ 37
Package outline drawing.................................................................................................................................... 38
5
5.1
5.2
Software library ....................................................................................................................................... 38
Memory map .................................................................................................................................................... 38
Software library and API description .................................................................................................................. 38
6
6.1
6.2
6.3
Design Considerations ........................................................................................................................... 38
Electrical design considerations ......................................................................................................................... 38
PCB layout considerations ................................................................................................................................. 40
Thermal design considerations .......................................................................................................................... 40
7
8
9
9.1
9.2
Links ............................................................................................................................................................. 40
Revision history ....................................................................................................................................... 41
Addendum for MWCT1011VLHSTx ................................................................................................... 41
Ordering information ........................................................................................................................................ 41
Package outline drawing.................................................................................................................................... 41
10
10.1
10.2
Addendum for MWCT1012VLFR .................................................................................................... 41
Ordering information ........................................................................................................................................ 42
Package outline drawing.................................................................................................................................... 42
11
11.1
11.2
Addendum for MWCT1013VLHSTx ............................................................................................... 42
Ordering information ........................................................................................................................................ 42
Package outline drawing.................................................................................................................................... 43
WCT101XDS, Rev. 1.2, 05/2019
NXP Semiconductors
3
1 Absolute maximum ratings
1.1
Electrical operating ratings
Table 1. Absolute maximum electrical ratings (V
SS
= 0 V, V
SSA
= 0 V)
Characteristic
Supply Voltage Range
Analog Supply Voltage Range
ADC High Voltage Reference
Voltage difference V
DD
to V
DDA
Voltage difference V
SS
to V
SSA
Digital Input Voltage Range
RESET
Input Voltage Range
Oscillator Input Voltage Range
Analog Input Voltage Range
Input clamp current, per pin (V
IN
< V
SS
– 0.3 V)
2, 3
Output clamp current, per pin
4
Contiguous pin DC injection current—regional limit
sum of 16 contiguous pins
Output Voltage Range (normal push-pull mode)
Output Voltage Range (open drain mode)
RESET
Output Voltage Range
DAC Output Voltage Range
Ambient Temperature
Storage Temperature Range
1.
Symbol
V
DD
V
DDA
V
REFHx
ΔV
DD
ΔV
ss
V
IN
V
IN_RESET
V
OSC
V
INA
V
IC
V
OC
I
Icont
V
OUT
V
OUTOD
V
OUTOD_RESET
V
OUT_DAC
T
A
T
STG
Pin Group 1,2
Pin Group 1
Pin Group 2
Pin Group 5
Pin Group 1
Pin Group 2
Pin Group 4
Pin Group 3
Notes
1
Min.
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.4
–0.3
–
–
–25
–0.3
–0.3
–0.3
–0.3
–40
–55
Max.
4.0
4.0
4.0
0.3
0.3
5.5
4.0
4.0
4.0
–5.0
±20.0
25
4.0
5.5
4.0
4.0
105
150
Unit
V
V
V
V
V
V
V
V
V
mA
mA
mA
V
V
V
V
°C
°C
2.
3.
4.
Default Mode:
•
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
•
Pin Group 2:
RESET
•
Pin Group 3: ADC and Comparator Analog Inputs
•
Pin Group 4: XTAL, EXTAL
•
Pin Group 5: DAC analog output
Continuous clamp current.
All 5 volt tolerant digital I/O pins are internally clamped to
V
SS
through an ESD protection diode. There is no diode connection to
V
DD
. If VIN greater than VDIO_MIN (=V
SS
–0.3
V) is observed, then there is no need to provide current limiting resistors at the pads.
If this limit cannot be observed, then a current limiting resistor is required.
I/O is configured as push-pull mode.
WCT101XDS, Rev. 1.2, 05/2019
4
NXP Semiconductors
1.2
Thermal handling ratings
Table 2. Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
–
Max.
150
260
Unit
°C
°C
Notes
1
2
1.
2.
Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices.
1.3
ESD handling ratings
Table 3. ESD handling ratings
Characteristic
1
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
Latch-up current at TA= 85°C (I
LAT
)
Min.
-2000
-200
-500
-100
Max.
+2000
+200
+500
+100
Unit
V
V
V
mA
1.
Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions unless
otherwise noted.
1.4
Moisture handling ratings
Table 4. Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
–
Max.
3
Unit
–
Notes
1
1.
Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices.
WCT101XDS, Rev. 1.2, 05/2019
NXP Semiconductors
5
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