电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

QTE-014-01-H-D-DP-A-TR

产品描述板对板与夹层连接器 0.80 mm Q Strip High-Speed Ground Plane Terminal Strip
产品类别连接器    连接器   
文件大小997KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

QTE-014-01-H-D-DP-A-TR在线购买

供应商 器件名称 价格 最低购买 库存  
QTE-014-01-H-D-DP-A-TR - - 点击查看 点击购买

QTE-014-01-H-D-DP-A-TR概述

板对板与夹层连接器 0.80 mm Q Strip High-Speed Ground Plane Terminal Strip

QTE-014-01-H-D-DP-A-TR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time3 weeks
板上安装选件LOCATING POSTS
主体宽度0.235 inch
主体深度0.168 inch
主体长度0.787 inch
主体/外壳类型RECEPTACLE
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD OVER NICKEL
联系完成终止Gold (Au) - with Nickel (Ni) barrier
触点性别MALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点电阻18 mΩ
触点样式CENTRONIC
DIN 符合性NO
介电耐压675VAC V
耐用性100 Cycles
滤波功能NO
IEC 符合性NO
绝缘电阻5000000000 Ω
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码e4
MIL 符合性NO
插接触点节距0.031 inch
混合触点NO
安装选项1LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距6.096 mm
电镀厚度30u inch
极化密钥POLARIZED HOUSING
额定电流(信号)2 A
参考标准UL, CSA
可靠性COMMERCIAL
端子节距0.8 mm
端接类型SURFACE MOUNT
触点总数28

文档预览

下载PDF文档
F-219
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Integral metal plane
for power or ground
Standard stack heights
from 5 mm to 25 mm
POWER/SIGNAL
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
QTE-D/QSE-D or QTE-DP/QSE-DP
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com
QTE-D/QSE-D
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
14 28
G b p s
G b p s
QTE-DP/QSE-DP
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
1-DH1
(40 total pins per bank = –D)
–020, –040, –060
–014, –028, –042
(14 pairs per bank = –D–DP)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-Ended
–D
–L
= Differential Pair
(–01 only)
–D–DP
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–K
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
• 56 (-DP), 80, 100
positions per row
• Retention Option
01
–D = (No. of Positions per Row/20)
x (20.00) .7875
(20.00) .7875
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–TR
(5.97)
.235
02
(0.80)
.0315
(0.20)
.008
A
= Electro-Polished
Selective
(7.11)
.280
50 µ" (1.27 µm) min
Au over 150µ"
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
= Latching
Option
(N/A on –042 &
–060 positions)
QTE
LEAD
STYLE
–L
A
(4.27) .168
(7.26) .286
HEIGHT
WITH QSE*
(5.00) .197
(8.00) .315
(0.76)
.030
(0.89)
.035 DIA
(0.64)
.025
–01
–02
–03
–04
–05
–07
–09
(10.27) .404 (11.00) .433
(15.25) .600 (16.00) .630
(18.26) .718 (19.00) .748
(24.24) .954 (25.00) .984
(13.26) .522 (14.00) .551
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
–L
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
【项目外包】光电检测器设计
概述: 把2路光信号转换为电信号,经过信号放大后通过A/D转换器采样出来。 功能要求: 1、 RS232串口通讯; 2、 采样灯的开关控制; 3、 开灯采样数据的读取; 4、 关灯采样数据的读取; ......
hzxfy 医疗电子
Orcad创建原理图封装疑问
使用Orcad创建原理图封装,是将所有的封装放到一个OLB库里面好一点呢,还是一个封装生成一个OLB库好一点? 如图:606910 ...
elec32156 PCB设计
【MSP430共享】基于电量芯片 A T T 7 0 2 2 B的动态无功补偿器
介绍了电能计量芯片A T 1 7 ( Y 2 2 B和1 1 公司生产的MS P 4 3 0 F 4 4 9 , 并结合在油井用动态无功补偿器项目中对各项电力参数采集的应用,给出了M S P 4 3 0 F 4 4 9和 A T r 7 0 2 2 B的硬 ......
鑫海宝贝 微控制器 MCU
还有3个机会参与DIY应急灯项目,有兴趣请提交方案
本次应急灯项目,目前还有三个机会,可以参与到项目中来, 你需要做的: 1、使用MAXIM芯片DIY应急灯,提交方案及原理图; 2、在MAXIM官方申请样片,注明 EEWORLD DIY应急灯; 3、分享制 ......
soso DIY/开源硬件专区
那位高手能告诉:电压调节器从低功耗唤醒的时间。
STANDBY的唤醒延时应=电压调节器从低功耗唤醒的时间+HSIRC唤醒时间。后者HSI振荡器启动时间tsu=1-2μs。前者最大到底要多少时间?STM32F103_6_8_B.PDF中没有找到。...
ye12 stm32/stm8
pxa270 + spi + wifi 问题!!!急!!!!在线等!!!!!
现在用岭仪的WIFI 硬件平台为PXA270 接口为SPI 目前系统初始化完SPI,然后读WIFI的ID可以正常通过 但是到加载固件时 函数static int sbi_download_wlan_fw_image(const u8 *firmware, in ......
shortt 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2828  2056  1898  1544  809  33  46  14  34  32 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved