电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TW-07-12-L-D-755-230

产品描述板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount
产品类别连接器    连接器   
文件大小949KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

TW-07-12-L-D-755-230在线购买

供应商 器件名称 价格 最低购买 库存  
TW-07-12-L-D-755-230 - - 点击查看 点击购买

TW-07-12-L-D-755-230概述

板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount

TW-07-12-L-D-755-230规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
Factory Lead Time2 weeks
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD (15) OVER NICKEL (50)
联系完成终止Tin (Sn) - with Nickel (Ni) barrier
触点性别MALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2 mm
端接类型SOLDER
触点总数14
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
F-219
TW–25–02–F–S–260–SM
TW–10–04–L–D–300–SM
(2.00 mm) .0787"
TW–20–07–T–D–550–SM
TW SERIES
SMT BOARD STACKERS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?TW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating:
4.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
RoHS Compliant:
Yes
Board Mates:
CLT, SQT, SQW, ESQT,
TLE, SMM, MMS
Cable Mates:
TCSD
Available with
optional
pick & place
pads
OTHER SOLUTIONS
• Stacker height
ranges and standard
part numbers on
double row.
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.15 mm) .006" max*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(2.00 mm)
.0787" pitch
Available
with optional
alignment pins
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
TW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
below.
(2.00)
.0787
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
SM
OTHER
OPTIONS
02 thru 36
FILE NO. E111594
= Gold flash
on post,
Matte Tin
on tail
–F
= Single
Row
–S
–“XXX”
= Stacker
Height
in inches
(0.13 mm)
.005"
increments
= Polarized Position
–“XXX”
–A
No. of positions
x (2.00) .0787
= 10 µ"
(0.25 µm)
Gold on post,
Matte Tin
on tail
–L
= Double
Row
–D
Example:
–250
= (6.35 mm)
.250"
= Alignment Pin
(Metal or plastic
at Samtec discretion)
(4.83 mm) .190" min.
board space
(–D only)
ALSO AVAILABLE
(MOQ Required)
• Other Platings
• End shrouds with or
without guide post
36
(2.00)
02
.0787
01
72
= Matte Tin
(4.00)
.1574
–T
A
(5.33)
.210
ROW
OPTION
= Pick & Place Pad
(1.91 mm) .075" min.
post height
(04-36 only)
–P
A
(5.08) .200
(6.35) .250
01
(1.27) .050 TYP
(0.00)
(0.51)
.000 MIN
.020 SQ
STACKER
HEIGHT OAL
(4.32)
.170
MIN
71
LEAD
STYLE
OAL
(7.85) .309
(11.86) .467
(12.37) .487
(15.37) .605
(17.35) .683
(9.86) .388
–S
–D
Notes:
For added mechanical
stability, Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–02
–03
–04
–06
–07
–09
–P OPTION
= Tape & Reel
Packaging
(–07 lead style
not available)
(–06 lead style with
–P option not available
as a standard)
–TR
(1.27)
.050
(1.09)
.043
DIA
(1.50)
.059
(2.00)
.0787
–A OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
想请教大家如何选择光耦
公司选择了一种光电开关,资料如下:434474想问一下大家这个怎么选择光耦啊? 434480可以问一下大家光耦怎么选择啊? ...
沈婷婷 分立器件
串口通信
我在ARM7上开发,用UART0进行串口通信,我想了解下数据发送的原理,即如何发送,中断之类如何触发的具体原理?刚毕业什么都不懂,大家见谅啊。。...
liyananliy 嵌入式系统
菜鸟求助编译选项问题
环境: linux 2.4.20 gcc编译器 要编译一个powerpc下的驱动。发现源码的makefile里有两个编译选项-mmultiple -mstring 不去掉编译会报错。 还有一个选项-r2 不去掉会一直报warning。 哪位大 ......
njzgw 嵌入式系统
近来画的3D库
129916129904129905129906129907129908129909129917129914129915129916129910129911129912 3D元件封装 本帖最后由 青叶漂零 于 2013-9-24 16:37 编辑 ]...
青叶漂零 DIY/开源硬件专区
配置AD芯片完成后,断电AD,还需要重新配置吗?
配置AD芯片完成后,断电AD,还需要重新配置吗? eeworldpostqq...
尘海月 FPGA/CPLD
北电3G疲劳症爆发 将全力准备4G
“3G技术的成熟期太长了,我们将全力准备4G。”在上任后的首次媒体见面会上,北电大中国区总裁吴振生透露了这家通信业百年老店的重大战略调整。   吴振生是8月16日正式接过北电中国帅印的,他 ......
liudong2008lldd 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2130  779  2016  1722  324  39  20  7  51  42 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved