电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MIS-038-01-L-D

产品描述Board Stacking Connector, 76 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT
产品类别连接器    连接器   
文件大小670KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准  
下载文档 详细参数 全文预览

MIS-038-01-L-D在线购买

供应商 器件名称 价格 最低购买 库存  
MIS-038-01-L-D - - 点击查看 点击购买

MIS-038-01-L-D概述

Board Stacking Connector, 76 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

MIS-038-01-L-D规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1643045349
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
Country Of OriginCosta Rica, Malaysia
ECCN代码EAR99
Factory Lead Time6 weeks
Samacsys ManufacturerSAMTEC
Samacsys Modified On2020-05-11 10:21:24
YTEOL8.45
主体/外壳类型SOCKET
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD
联系完成终止Tin (Sn) - with Nickel (Ni) barrier
触点性别FEMALE
触点材料PHOSPHOR BRONZE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距0.635 mm
端接类型SURFACE MOUNT
触点总数76

文档预览

下载PDF文档
F-219 SUPPLEMENT
MIS–019–01–F–D
®
MIS–057–01–L–D
MIS–038–01–F–D
(0.635 mm) .025"
MIS SERIES
MIXED TECHNOLOGY SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
MIT
Standoffs:
SO
Integral metal plane
for power or ground
Polarized
• Mixed
technology
footprint
HIGH-SPEED CHANNEL PERFORMANCE
MIT/MIS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
28
G b p s
76 signal lines
per linear inch
MIS
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–019, –038, –057
(38 total positions per bank)
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–F
–L
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–K
ALSO AVAILABLE
(MOQ Required)
• 11 mm, 16 mm, 18.75 mm
and 22 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
= 10 µ" (0.25 µm)
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
= Tape &
Reel
–TR
(No. of Positions/19) x (12.70) .500 + (12.70) .500
(12.70) .500
(6.22)
.245
(0.635)
.025
(1.32)
.052
(0.69) .027
(0.15)
.006
01
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area, Matte Tin
over 50 µ" (1.27 µm) min Ni
on all solder tails
*Note:
–C Plating passes 10 year MFG testing
–C*
02
MATED HEIGHT*
(3.43)
.135
(7.49)
.295
(3.63)
.143
(0.18)
.007
MIS
LEAD
STYLE
MIT LEAD
STYLE
–01
–02
–01
(5.00) (8.00)
.197 .315
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Note:
Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
Due to technical progress, all designs, specifications and components are subject to change without notice.
*Processing conditions
will affect mated height.
See SO Series for board
space tolerances.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
答题赢好礼|世健探索:烟雾探测赋能智能建筑
烟雾探测器可以挽救生命。在美国,每五起与火灾有关的死亡中,有三起发生在没有烟雾探测器的房产中。只有正确使用烟雾探测器,才可以挽救生命。在装有烟雾探测器的房产中,近四分之一(23%)的死 ......
EEWORLD社区 传感器
基于MSP430的简易逻辑分析仪设计
信号直接用信号发生器,以MSP430为核心的简易逻辑分析仪,求电路,求指导...
xf790331082 微控制器 MCU
Ez430-RF2500开发套件应用(只谈应用)
要开发板干嘛?当然是用啦!学习用!或者了解芯片的性能!以下为收集整理的部分应用实例,希望对新手和闲置板子的人有所帮助,欢迎拍砖!!Ez430-RF2500结合了超低功耗MSP430微控制器与无线通信 ......
cadence1314 微控制器 MCU
FRDM-K64F开发板资源
FRDM-K64F开发板资源 开发板网站 FFRDM-K64F 用户指南 FRDM-K64F快速入门资源包 FRDM-K64F Mbed平台 MQX 4.1.0 RTOS 原理图(版本C) 原理图(版本D1) 原理图(版本E3) PCB文件 ......
dcexpert NXP MCU
Todd Gillenwater 谈为何看好 UWB 技术
在今年一月,Qorvo 宣布收购注于精确定位和连接应用的爱尔兰无晶圆厂半导体公司 Decawave。在我们看来,这单交易将增强 Qorvo 在产品和技术方面的领先地位,同时扩大我们在移动,汽车和物联网领 ......
石榴姐 机器人开发
LPC2103
本人为ARM初学者,想以LPC2103入手,哪位有这方面的程序,希望给点分享一下啊!将不甚感激。...
472283165 ARM技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 587  1802  953  582  2464  29  8  46  28  48 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved