16-bit Microcontrollers with R8C CPU Core (Non Promotion), LQFP, /Tray
| 参数名称 | 属性值 |
| Brand Name | Renesas |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| Objectid | 1422258308 |
| 零件包装代码 | LQFP |
| 包装说明 | QFP, QFP80,.64SQ |
| 针数 | 80 |
| 制造商包装代码 | PLQP0080JA |
| Reach Compliance Code | compliant |
| Samacsys Description | The R8C/L38C Group is supported only for customers who have already adopted these products. The RL78/L13, RL78/L1C Groups are recommended for new designs.The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation pro |
| Samacsys Manufacturer | Renesas Electronics |
| Samacsys Modified On | 2023-10-24 19:30:29 |
| YTEOL | 5.79 |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 16 |
| CPU系列 | R8C |
| 最大时钟频率 | 20 MHz |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G80 |
| 长度 | 10 mm |
| I/O 线路数量 | 68 |
| 端子数量 | 80 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP80,.64SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| RAM（字节） | 6144 |
| ROM（单词） | 49152 |
| ROM可编程性 | FLASH |
| 速度 | 20 MHz |
| 最大压摆率 | 15 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
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