模数转换器 - ADC Quad, 12-Bit, 5Msps/ch Simultaneous Sampling SAR ADC
参数名称 | 属性值 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ADI(亚德诺半导体) |
包装说明 | HVQCCN, |
针数 | 52 |
制造商包装代码 | 05-08-1729 |
Reach Compliance Code | compliant |
最大模拟输入电压 | 2.064 V |
最小模拟输入电压 | -2.034 V |
最长转换时间 | 0.17 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PQCC-N52 |
JESD-609代码 | e3 |
长度 | 8 mm |
最大线性误差 (EL) | 0.0244% |
模拟输入通道数量 | 4 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 52 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出位码 | 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
采样速率 | 5 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 0.8 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7 mm |
LTC2325HUKG-12#PBF | LTC2325IUKG-12#PBF | LTC2325IUKG-12#TRPBF | LTC2325CUKG-12#PBF | LTC2325HUKG-12#TRPBF | |
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描述 | 模数转换器 - ADC Quad, 12-Bit, 5Msps/ch Simultaneous Sampling SAR ADC | Analog to Digital Converters - ADC Quad, 12-Bit, 5Msps/ch Simultaneous Sampling SAR ADC | Quad, 12-Bit + Sign, 5Msps/Ch Simultaneous Sampling ADC | Analog to Digital Converters - ADC Quad, 12-Bit, 5Msps/ch Simultaneous Sampling SAR ADC | Quad, 12-Bit + Sign, 5Msps/Ch Simultaneous Sampling ADC |
Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
针数 | 52 | 52 | 52 | 52 | 52 |
制造商包装代码 | 05-08-1729 | 05-08-1729 | 05-08-1729 | 05-08-1729 | 05-08-1729 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
最大模拟输入电压 | 2.064 V | 2.064 V | 2.064 V | 2.064 V | 2.064 V |
最小模拟输入电压 | -2.034 V | -2.034 V | -2.034 V | -2.034 V | -2.034 V |
最长转换时间 | 0.17 µs | 0.17 µs | 0.17 µs | 0.17 µs | 0.17 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PQCC-N52 | R-PQCC-N52 | R-PQCC-N52 | R-PQCC-N52 | R-PQCC-N52 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
模拟输入通道数量 | 4 | 4 | 4 | 4 | 4 |
位数 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 52 | 52 | 52 | 52 | 52 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 70 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C |
输出位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
采样速率 | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | MATTE TIN |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | - |
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