模数转换器 - ADC 14-Bit, 10Msps Low Power ADC
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | HVQCCN, |
| 针数 | 32 |
| 制造商包装代码 | 05-08-1693 |
| Reach Compliance Code | compliant |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 1953323 |
| Samacsys Pin Count | 33 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Quad Flat No-Lead |
| Samacsys Footprint Name | 32-Lead Plastic QFN |
| Samacsys Released Date | 2020-02-10 02:41:14 |
| Is Samacsys | N |
| 最大模拟输入电压 | 1.9 V |
| 最小模拟输入电压 | 1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N32 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 最大线性误差 (EL) | 0.0244% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 14 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 采样速率 | 10 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| LTC2245IUH#PBF | LTC2245IUH#TR | LTC2245IUH | LTC2245IUH#TRPBF | LTC2245CUH#TR | LTC2245CUH#TRPBF | LTC2245CUH#PBF | |
|---|---|---|---|---|---|---|---|
| 描述 | 模数转换器 - ADC 14-Bit, 10Msps Low Power ADC | Analog to Digital Converters - ADC LTC2245 - 14-Bit, 10Msps Low Power 3V ADC | Analog to Digital Converters - ADC LTC2245 - 14-Bit, 10Msps Low Power 3V ADC | Analog to Digital Converters - ADC 14-Bit, 10Msps Low Power ADC | Analog to Digital Converters - ADC LTC2245 - 14-Bit, 10Msps Low Power 3V ADC | 模数转换器 - ADC 14-Bit, 10Msps Low Power ADC | 模数转换器 - ADC 14-Bit, 10Msps Low Power ADC |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | HVQCCN, | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | HVQCCN, | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | HVQCCN, | HVQCCN, |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | not_compliant | compliant | compliant |
| Is Samacsys | N | N | N | N | N | N | N |
| 最大模拟输入电压 | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小模拟输入电压 | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 |
| JESD-609代码 | e3 | e0 | e0 | e3 | e0 | e3 | e3 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 235 | 235 | 260 | 235 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 20 | 20 | 30 | 20 | 30 | 30 |
| 宽度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Brand Name | Analog Devices Inc | - | - | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | - | - | 含铅 | - | 含铅 | 含铅 |
| 针数 | 32 | - | - | 32 | - | 32 | 32 |
| 制造商包装代码 | 05-08-1693 | - | - | 05-08-1693 | - | 05-08-1693 | 05-08-1693 |
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