HPERC-IBR-HH
Rugged System with 3rd Gen Intel
®
Core™ i7 Processor
and MIL-DTL-38999 High Speed Connectors
Features
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High speed eSATA, USB 3.0
VITA 75 mount with passive cooling
Intel
®
Core™ i7 dual or quad core Processor
Soldered DDR3L 8GB, up to 16GB RAM
Quad Gigabit Ethernet
Available GPGPU on 16-lane 3rd Generation PCI Express
Dual independent displays (HDMI/DVI/VGA)
Simple user expansion and configuration
Rugged temperature: -40°C to +70°C
Tested to MIL-STD-810G and MIL-STD-461F standards;
IP67 rating
OS support: VxWorks 6.9, Ubuntu, Windows
®
7 and WES7
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Specifications
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Core System
CPU
Intel
®
Core™ i7-3517UE 1.7GHz, dual-core
Intel
®
Core™ i7-3612QE 2.1GHz, quad-core
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Standard I/O
Video
2x DVI, 1x HDMI and 1x VGA (only 2 display outputs supported concurrently)
Chipset
Intel QM77 Express Chipset
®
Audio
1x amplified stereo output
1x stereo input
GPGPU
MXM NVIDIA GeForce GT 745M / GTX 950M with 2GB 128-bit GDDR5
(optional)
LAN Chipset
4x Intel
®
I210 Ethernet controller
Memory
16GB DDR3L-1333 ECC
8GB soldered down, 8GB SODIMM
LAN Speed
10/100/1000 Mbps
eSATA
2x SATA 3Gb/s (non-powered)
BIOS
AMI EFI
USB
2x USB 3.0
4x USB 2.0
Expansion Busses
MXM (3rd Generation PCIe x16)
PCI/104 Express
®
Type 2 (PCIe Gen2)
PCI Express Mini Card (PCIe Gen2)
Serial
7x RS-232/422
GPIO
8x digital IO
Specifications
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Internal Storage
Removable SATA: 2x 2.5” SLC/MLC SSD on SATA 6 Gb/s (up to 1 TB)
RAID: 0/1 supports up to 12Gb/s
Removable: 1x SDHC - SLC (up to 64 GB)
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Environmental
Immersion
IEC 529 - IP-67
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Security
TPM
Atmel AT97SC3204-U1A190
Salt Spray
RTCA/DO-160G, Section 14, Category S
Altitude
0 to 50K ft.
Secure Erase
Hardware input triggered
Software triggered
Humidity
95% at +60°C non-condensing
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Power
Input: 10-36VDC
Performance: S-States S3, S4
Shock
MIL-STD-810G - 516.6 Procedures I and V
Vibration
MIL-STD-810G - 514.6 Procedure I
Categories 4, 9, 11, 21
EMI/EMC: MIL-STD-461F
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Thermal
Internal Transfer
Passive conduction to body
-55°C to +85°C
Temperature
MIL-STD-810G - 501.5 Procedure II
MIL-STD-810G - 502.5, Procedure 1 and 2
Storage Temperature
Ambient Temperature
-40°C to +70°C at 1 atm air
Heatsink (free air convection)
VITA 75.21 mount
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Mechanical
Form Factor
VITA-75 Finned Passive Convection
Dimension
304.8(L) x 150(W) x 101.95(H) mm (with mounting brackets)
Weight
3.91 kg
IO Connectors
MIL-DTL-38999 (uniquely-keyed)
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Operating Systeml
OS
Ubuntu 16.04
VxWorks 6.9.3.1 (Please contact ADLINK for other OS support)
Windows
®
7 (64-bit)
WES 7 (64-bit/32-bit)
Functional Diagram
8/16GB ECC
DDR3 RAM
Intel
®
3
rd
Generation
i7 CPU
GPGPU
(NVIDIA
®
)
SDHC
User Expansion slots
Removable Media
Intel
®
PCH
QM77
SSD
PC-104
Express
SSD
Mini PCI
Express
Ordering Information
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HPERC-IBRHH-100XN
Finned-Convection, Intel
®
Core
™
i7 3517UE, 16GB RAM
HPERC-IBRHH-B00XN
Finned-Convection, Intel
®
Core
™
i7 3517UE, 8GB RAM
HPERC-IBRHH-300XN
Finned-Convection, Intel
®
Core
™
i7 3612QE, 16GB RAM
HPERC-IBRHH-D00XN
Finned-Convection, Intel
®
Core
™
i7 3612QE, 8GB RAM
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HPERC Accessories
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HPERC-H-03
HPERC™ breakout cable kit including
MERITEC MIL-STD Nkey & Akey I/O cables, and AC Adapter
M3N745M-JN-A
MXM NVIDIA GeForce GT 745M GPU card, with 2GB 128-bit
GDDR5 memory (must be pre-assembled at ADLINK
factory)
M3N950M-JN1A-A
MXM NVIDIA GeForce GTX 950M GPU card, with 2GB 128-bit
GDDR5 memory (must be pre-assembled at ADLINK factory)
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www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
*Updated Feb. 07, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
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Authorized Distributor
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ADLINK Technology
:
HPERC-IBRHH-B00XN HPERC-IBRHH-D00XN HPERC-IBRHH-100XN HPERC-IBRHH-3011N-1 HPERC-IBRHH-
300XN HPERC-IBRHH-3012N-1