Z: Tape and reel packing (picked from the 8/9/10/12-pin side)
–1–
ASCTB15E 201407-T
TX-S
TYPES
1. Standard PC board terminal
Contact
arrangement
Nominal coil
voltage
3 V DC
4.5 V DC
6 V DC
9 V DC
12 V DC
24 V DC
Single side stable
Part No.
TXS2-3V
TXS2-4.5V
TXS2-6V
TXS2-9V
TXS2-12V
TXS2-24V
2 coil latching
Part No.
TXS2-LT-3V
TXS2-LT-4.5V
TXS2-LT-6V
TXS2-LT-9V
TXS2-LT-12V
TXS2-LT-24V
2 Form C
Standard packing: Tube: 40 pcs.; Case: 1,000 pcs.
Note: Please add “-1” to the end of the part number for AgPd contacts (low level load).
2. Surface-mount terminal
1) Tube packing
Contact
arrangement
Nominal coil
voltage
3 V DC
4.5 V DC
6 V DC
9
12
24
V DC
V DC
V DC
Single side stable
Part No.
TXS2SA-3V
TXS2SA-4.5V
TXS2SA-6V
TXS2SA-9V
TXS2SA-12V
TXS2SA-24V
2 coil latching
Part No.
TXS2SA-LT-3V
TXS2SA-LT-4.5V
TXS2SA-LT-6V
TXS2SA-LT-9V
TXS2SA-LT-12V
TXS2SA-LT-24V
2 Form C
Standard packing: Tube: 40 pcs.; Case: 1,000 pcs.
Note: Please add “-1” to the end of the part number for AgPd contacts (low level load).
2) Tape and reel packing
Contact
arrangement
Nominal coil
voltage
3 V DC
4.5 V DC
6 V DC
9 V DC
12 V DC
24 V DC
Single side stable
Part No.
TXS2SA-3V-Z
TXS2SA-4.5V-Z
TXS2SA-6V-Z
TXS2SA-9V-Z
TXS2SA-12V-Z
TXS2SA-24V-Z
2 coil latching
Part No.
TXS2SA-LT-3V-Z
TXS2SA-LT-4.5V-Z
TXS2SA-LT-6V-Z
TXS2SA-LT-9V-Z
TXS2SA-LT-12V-Z
TXS2SA-LT-24V-Z
2 Form C
Standard packing: Tape and reel: 500 pcs.; Case: 1,000 pcs.
Notes: 1. Tape and reel packing symbol “-Z” is not marked on the relay. “X” type tape and reel packing (picked from 1/2/3/4-pin side) is also available.
2. Please add “-1” to the end of the part number for AgPd contacts (low level load). (Ex. TXS2SA-3V-1-Z)
Min. 1,000MΩ (at 500V DC) Measurement at same location as “Initial breakdown voltage” section.
750 Vrms for 1min. (Detection current: 10mA)
1,800 Vrms for 1min. (Detection current: 10mA)
1,000 Vrms for 1min. (Detection current: 10mA)
1,500 V (10×160μs) (FCC Part 68)
2,500 V (2×10μs) (Telcordia)
Max. 50°C
(By resistive method, nominal coil voltage applied to the coil; contact carrying current: 1A.)
Max. 5 ms [Max. 5 ms] (Nominal coil voltage applied to the coil, excluding contact bounce time.)
Max. 5 ms [Max. 5 ms] (Nominal coil voltage applied to the coil, excluding contact bounce time.)
(without diode)
Min. 750 m/s
2
(Half-wave pulse of sine wave: 6 ms; detection time: 10μs.)
Min. 1,000 m/s
2
(Half-wave pulse of sine wave: 6 ms.)
10 to 55 Hz at double amplitude of 3.3 mm (Detection time: 10μs.)
10 to 55 Hz at double amplitude of 5 mm
Min. 5×10
7
(at 180 cpm)
Min. 2×10
5
(1 A 30 V DC resistive) (at 20 cpm)
Ambient temperature: –40°C to +70°C
–40°F to +158°F;
Humidity: 5 to 85% R.H. (Not freezing and condensing at low temperature)
20 cpm
Approx. 2 g
.071 oz
Contact
Rating
Temperature rise (at 20°C
68°F)
Operate time [Set time] (at 20°C
68°F)
Release time [Reset time] (at 20°C
68°F)
Functional
Destructive
Functional
Vibration resistance
Destructive
Shock resistance
Mechanical
Electrical (Standard contact)
Conditions for operation, transport and storage*
2
Max. operating speed (at rated load)
Unit weight
Mechanical
characteristics
Expected life
Conditions
Notes: *1 This value can change due to the switching frequency, environmental conditions, and desired reliability level, therefore it is recommended to check this with the
actual load. AgPd contact type is available for low level load switching (10V DC, 10mA max. level).
*2 Refer to “AMBIENT ENVIRONMENT” in GENERAL APPLICATION GUIDELINES.
REFERENCE DATA
1. Maximum switching capacity
2. Life curve
3. Mechanical life
Tested sample: TXS2-4.5V, 10 pcs.
Operating speed: 180 cpm
Ratio against the rated voltage, %V
100
90
80
70
60
50
40
30
20
10
30
100
200
Contact voltage, V
0
0.5
1.0
Switching current, A
0
10
100
1,000 5,000
No. of operations,
×10
4
Drop-out voltage
Max.
Min.
Pick-up voltage
Max.
Min.
No. of operations
×10
4
Contact current, A
DC resistive load
(cos
φ
= 1)
1.0
100
30V DC
resistive load
0.5
0.4
0.3
0.2
10
–3–
ASCTB15E 201407-T
TX-S
4. Electrical life (1 A 30 V DC resistive load)
Tested sample: TXS2-4.5V, 6 pcs.
Operating speed: 20 cpm
5-(1). Coil temperature rise
Change of contact resistance
100
Contact resistance, mΩ
90
80
70
60
50
40
30
Min.
Max.
Temperature rise,
°C
Change of pick-up and drop-out voltage
Ratio against the rated voltage, %V
100
90
80
70
60
50
40
30
20
10
0
0
5
10
15
20
Drop-out voltage
Max.
Min.
Pick-up voltage
Max.
Min.
Tested sample: TXS2-4.5V, 6 pcs.
Point measured: Inside the coil
Ambient temperature: 25°C
77°F,
70°C
158°F
30
Room temperature :x
+70°C
+158°F
:x
20
10
1A
1A
0A
0A
20
10
0
0
5
10
15
20
0
90
100 110
120
130
140 150 160
No. of operations,
×10
4
No. of operations,
×10
4
Coil applied voltage, %V
5-(2). Coil temperature rise
Tested sample: TXS2-24V, 6 pcs.
Point measured: Inside the coil
Ambient temperature: 25°C
77°F,
70°C
158°F
30
Room temperature :x
+70°C
+158°F
:x
Temperature rise,
°C
6-(1). Operate and release time (with diode)
Tested sample: TXS2-4.5V, 10 pcs.
6-(2). Operate and release time (without diode)
Tested sample: TXS2-4.5V, 10 pcs.
7
Operate and release time, ms
6
5
4
3
2
1
Max.
Min.
Max.
Min.
Operate and release time, ms
Operate time
Release time
7
6
5
4
3
2
1
80
100
90
110 120
Coil applied voltage, %V
0
Max.
Min.
Max.
Min.
Operate time
Release time
20
1A
1A
0A
10
0A
0
0
90 100 110
120
130
140 150
160
Coil applied voltage, %V
80
90
100
110
120
Coil applied voltage, %V
7. Ambient temperature characteristics
Tested sample: TXS2-4.5V, 5 pcs.
8-(1). High frequency characteristics
(Isolation)
Tested sample: TXS2-4.5V, 2 pcs.
8-(2). High frequency characteristics
(Insertion loss)
Tested sample: TXS2-4.5V, 2 pcs.
Rate of change, %
30
20
10
Isolation, dB
x
x
100
Pick-up voltage
20 40 60 80
Ambient
–10 temperature,
°C
–20
–30
Insertion loss, dB
10
100
Frequency, MHz
1,000
Drop-out
voltage
1.0
0.8
0.6
0.4
0.2
10
100
Frequency, MHz
1,000
–40 –20
0
50
9-(1). Malfunctional shock (single side stable)
Tested sample: TXS2-4.5V, 6 pcs.
Z
Z’
Y
Y’
X
X’
9-(2). Malfunctional shock (latching)
Tested sample: TXS2-LT-4.5V, 6 pcs.
Reset state
Set state
10. Thermal electromotive force
Tested sample: TXS2-4.5V, 10 pcs.
20
18
16
Quantity, n
x = 0.30
Y
1000m/s
2
Deenergized condition
Energized condition
Z
Z’
Y
Y’
X
X’
Y
1000m/s
2
X
1000m/s
2
Z
2
1000m/s
X
1000m/s
2
Z
2
1000m/s
14
12
10
8
6
4
1000m/s
2
Z’
1000m/s
2
Y’
1000m/s
2
X’
1000m/s
2
Z’
1000m/s
2
Y’
1000m/s
2
X’
2
0
0
0.15
0.25
0.35
0.45
0.55
Thermal electromotive force,
μV
–4–
ASCTB15E 201407-T
TX-S
11-(1). Influence of adjacent mounting
Tested sample: TXS2-4.5V, 6 pcs.
Rate of change, %
15
ON
10
5
Pick-up voltage
0
Rate of change, %
Rate of change, %
Drop-out voltage
–5
OFF OFF
ON
ON
11-(2). Influence of adjacent mounting
Tested sample: TXS2-4.5V, 6 pcs.
Rate of change, %
15
ON
10
5
Pick-up voltage
0
Drop-out voltage
–5
OFF
OFF
2 4 6 8 10 12 14 16
.079 .157 .236 .315 .394 .472 .551 .630
Inter-relay distance , mm
inch
ON
OFF
ON
11-(3). Influence of adjacent mounting
Tested sample: TXS2-4.5V, 6 pcs.
Rate of change, %
15
ON
10
ON
5
0
Rate of change, %
Drop-out voltage OFF
–5
OFF
OFF
0
OFF
2 4 6 8 10 12 14 16
.079 .157 .236 .315 .394 .472 .551 .630
Inter-relay distance , mm
inch
Pick-up voltage
ON
ON
–10
OFF
0
2 4 6 8 10 12 14 16
.079 .157 .236 .315 .394 .472 .551 .630
Inter-relay distance , mm
inch
–15
–10
–15
–10
–15
0
12. Pulse dialing test
(35 mA 48V DC wire spring relay load)
Tested sample: TXS2-4.5V, 6 pcs.
Change of pick-up and drop-out voltage
Ratio against the rated voltage, %V
100
90
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
Drop-out voltage
Max.
Min.
Pick-up voltage
Max.
Min.
Change of contact resistance
100
Contact resistance, mΩ
90
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
Max.
Min.
0.08
μF
DC48V
+
458Ω
0.08
μF
4
3
–
458Ω
Wire spring relay
No. of operation,
×10
4
No. of operation,
×10
4
Note: Data of surface-mount type are the same as those of PC board terminal type.
DIMENSIONS
(mm
inch)
CAD Data
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Standard PC board terminal and Self clinching terminal
卡巴斯基的安全研究人员称其发现了如何攻击Intel微处理器的远程攻击代码，据传，这一代码可以通过TCP/IP包和JavaScript代码到达用户系统。 目前受影响的系统包括Windows XP，Vista，Windows Server 2003，Windows Server 2008，Linux甚至是BSD和Mac。但所幸大多数错误可以由Intel和BIOS厂商联合进行修复。 卡...[详细]
Microchip MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
