A S111 6
6 4 L ED Dr iv e r w i th De t a ile d E r r o r D et e c tio n
1 General Description
The AS1116 is a compact LED driver for 64 single LEDs or 8 digits of
7-segments. The devices can be programmed via an SPI compatible
3-wire interface.
Every segment can be individually addressed and updated sepa-
rately. Only one external resistor (R
SET
) is required to set the cur-
rent. LED brightness can be controlled by analog or digital means.
The devices include an integrated BCD code-B/HEX decoder, multi-
plex scan circuitry, segment and display drivers, and a 64-bit mem-
ory. Internal memory stores the shift register settings, eliminating the
need for continuous device reprogramming.
Additionally the AS1116 offers a diagnostic mode for easy and fast
production testing and allows the use of the AS1116 for critical appli-
cations. The diagnostic allows to detect individual open or shorted
LEDs.
The AS1116 features a low shutdown current of typically 200nA, and
an operational current of typically 350µA. The number of digits can
be programmed, the devices can be reset by software, and an exter-
nal clock is also supported.
The device is available in a QSOP-24 and TQFN(4x4)-24 package.
2 Key Features
10MHz SPI-Compatible Interface
Open and Shorted LED Error Detection
- Global or Individual Error Detection
Hexadecimal- or BCD-Code for 7-Segment Displays
200nA Low-Power Shutdown Current (typ; data retained)
Individual Digit Brightness Control
Digital and Analog Brightness Control
Display Blanked on Power-Up
Drive Common-Cathode LED Displays
Supply Voltage Range: 2.7 to 5.5V
Software Reset
Optional External Clock
Package:
- QSOP-24 and TQFN(4x4)-24
3 Applications
The AS1116 is ideal for seven-segment or dot matrix displays in pub-
lic information displays at subway, train or bus stations, at airports
and also at displays in public transportation like buses or trains
mobile phones, personal electronic and toys.
Figure 1. AS1116 - Typical Application Diagram
V
DD
2.7V to 5.5V
9.53kΩ
8
SEGA to G,
SEG DP
DIG0 to
DIG7
8
GND
8
8
8
ISET
SDI
AS1116
SDO SDI
AS1116
LD
SDO
I/O
SDI
AS1116
LD
SDO
SCL
µP
I/O
I/O
I/O
LD
SCL
SCL
Diagnostic readback: open & shorted LEDs
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AS1116
Datasheet - P i n o u t
4 Pinout
Pin Assignments
Figure 2. Pin Assignments (Top View)
SEGD
SCL
SEGDP
18
SEG E
17
SEGC
16
V
DD
15
SEGG
14
SEGB
13
SEGF
7
8
9
10 11 12
DIG1
DIG0
22 SEGDP
21 SEG E
18 SEGG
23 SEGD
20 SEGC
17 SEGB
15 SEGA
16 SEGF
24 SDO
19 VDD
14 SCL
13 I
SET
24 23 22 21 20 19
DIG2
1
DIG3
2
GND
3
AS1116
DIG7 10
DIG0 2
DIG1 3
DIG2 4
DIG3 5
GND 6
DIG4 7
DIG5 8
DIG6 9
N/C 12
SDI 1
LD 11
DIG4
4
DIG5
5
N/C
6
AS1116
SDO
SDI
Pin Descriptions
Table 1. Pin Descriptions
Pin Name
SDI
DIG0:DIG7
GND
LD
N/C
I
SET
QSOP-24
1
2-5, 7-10
6
11
12
13
TQFN(4x4)-24
22
Description
Serial-Data Input.
Data is loaded into the internal 16-bit shift register on the rising edge
of pin SCL.
SCL
SEGA:SEGG,
SEGDP
VDD
SDO
14
15-18,
20-23
19
24
-
1, 2, 4, 5, 7, 8, 23,
Digit Drive Lines.
Eight digit drive lines that sink current from the display cathode.
24
3
Ground.
Load.
Serial Data is loaded into the shift register while this pin is low. The last 16 bits of
9
serial data are latched on the rising edge of this pin.
6
Not Connected.
Set Segment Current.
Connect to V
DD
or a reference voltage through R
SET
to set the
10
peak segment current (see
Selecting RSET Resistor Value and Using
External Drivers on page 17).
Serial-Clock Input.
10MHz maximum rate. Data is shifted into the internal shift register
11
on the rising edge of this pin. Data is clocked out of pin SDO on the rising edge of this
pin.
Seven Segment and Decimal Point Drive Lines.
8 seven-segment drives and
12-15,
17-20
decimal point drive that source current to the display.
16
Positive Supply Voltage.
Connect to +2.7 to +5.5V supply.
21
Exposed Pad
Serial-Data Output.
The data into pin SDI is valid at pin SDO 16 clock cycles later. This
pin is used to daisy-chain several devices and is never high-impedance.
Exposed Pad.
This pin also functions as a heat sink. Solder it to a large pad or to the
circuit-board ground plane to maximize power dissipation.
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Revision 1.09
SEGA
DIG6
DIG7
I
SET
LD
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AS1116
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Section 6 Electrical Characteristics on page 4
is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
V
DD
to GND
Input Voltage Range
All other pins to GND
DIG0:DIG7 Sink Current
SEGA:SEGG, SEGDP
±100
1000
1000
88
30.5
+150
-55
+150
-0.3
-0.3
7
7 or
V
DD
+ 0.3
500
100
V
V
mA
mA
mA
V
V
ºC/W
ºC/W
°C
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Represents a max. floor life time of unlimited
Represents a max. floor life time 168h
Norm: JEDEC 78
Min
Max
Units
Notes
Current
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge
Thermal Information
Thermal Resistance
Θ
JA
Temperature Ranges and Storage Conditions
Junction Temperature
Storage Temperature
Digital outputs
All other pins
Norm: MIL 833 E method 3015
on PCB, QSOP-24 package
on PCB, TQFN(4x4)-24 package
Package Body Temperature
+260
ºC
Humidity non-condensing
Moisture Sensitive Level
QSOP-24 package
TQFN(4x4)-24 package
5
1
3
85
%
%
%
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AS1116
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
V
DD
= 2.7 to 5.5V, R
SET
= 9.53kΩ,
Typical values are at
T
AMB
= +25°C,
V
DD
= 5.0V
(unless otherwise specified).
All limits are guaranteed. The
parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods.
Table 3. Electrical Characteristics
Symbol
T
AMB
T
J
V
DD
I
DDSD
Parameter
Operating Temperature Range
Operating Junction Temperature
Operating Supply Voltage
Shutdown Supply Current
All digital inputs at V
DD
or GND,
T
AMB
= +25ºC
R
SET
= open circuit.
I
DD
f
OSC
I
DIGIT
I
SEG
∆I
SEG
I
SEG
Operating Supply Current
Display Scan Rate
Digit Drive Sink Current
Segment Drive Source Current
Segment Drive Current Matching
Segment Drive Source Current
All segments and decimal point on;
I
SEG
= -40mA.
8 digits scanned
V
OUT
= 0.65V
V
DD
= 5.0V, V
OUT
= (V
DD
-1V)
Average Current
0.6
320
-37
-42
3
47
-47
Conditions
Min
-40
-40
2.7
0.2
0.35
335
0.8
1.2
Typ
Max
+85
+125
5.5
2
0.6
mA
kHz
mA
mA
%
mA
Unit
°C
°C
V
µA
Table 4. Logic Inputs/Outputs Characteristics
Symbol
I
IH
, I
IL
V
IH
V
IL
Parameter
Input Current SDI, SCL, LD
Logic High Input Voltage
Logic Low Input Voltage
Conditions
V
IN
= 0V or V
DD
4.5V < V
DD
< 5.5V
2.7V < V
DD
< 4.5V
V
DD
= 5.0V
V
DD
= 3.0V
SDO, I
SOURCE
= -1mA,
V
DD
= 5.0V
SDO, I
SOURCE
= -1mA,
V
DD
= 3.0V
SDO, I
SINK
= 1mA
SDI, SCL, LD
0.7x
V
DD
0.05x V
DD
1
0.75x
V
DD
0.1x
V
DD
0.8x
V
DD
0.15x
V
DD
V
DD
- 1
V
V
DD
- 0.5
0.4
V
V
V
V
Min
-1
0.6 x V
DD
0.7 x V
DD
0.8
0.6
Typ
Max
1
Unit
µA
V
V
V
V
OH
V
OL
∆V
I
Output High Voltage
Output Low Voltage
Hysteresis Voltage
Open Detection Level Threshold
Short Detection Level Threshold
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AS1116
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 5. SPI Timing Characteristics
Symbol
t
CP
t
CH
t
CL
t
CSS
t
CSH
t
DS
t
DH
t
DO
t
LDCK
t
CSW
t
DSPD
Parameter
SCL Clock Period
SCL Pulse Width High
SCL Pulse Width Low
LD to SCL Rise Setup Time
SCL Rise to LD Rise Hold Time
SDI Setup Time
SDI Hold Time
Output Data Propagation Delay
LD Rising Edge to SCL Rising Edge
Minimum LD Pulse High
Data-to-Segment Delay
Conditions
Min
100
20
20
25
10
0
5
20
20
2.25
Typ
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
C
LOAD
= 50pF
25
See
Figure 19 on page 10
for more information.
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