CAPA500
3.5" Embedded SBC with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 Processor,
LVDS/VGA/HDMI, Dual GbE LANs and Audio
Features
●
LGA1151 7th/6th gen Intel® Core™ i7/i5/i3 processor
(Kaby Lake/Skylake)
●
Intel® H110 chipset (Q170 optional)
●
1 DDR4 SO-DIMM, up to 16GB
●
3 USB 3.0 and 3 USB 2.0
●
1 COM port
●
Intel® AMT 11 supported (optional)
Audio
LVDS
+12V power input
COM 1
SATA-3
USB 2.0 2/3
VGA
USB 3.0 1/2
Ethernet 1/2 USB 3.0 3 + USB 2.0 1
DDR4 SO-DIMM
Full-size PCI Express
Mini Card slot with
mSATA supported
HDMI
DDR4
PCIe Mini
TripleView
DDR4
PCIe Mini
+12V
AiRD
Full Solid
Cap Design
Core System
CPU
System Memory
Chipset
BIOS
SSD
Watchdog Timer
Expansion Interface
LGA1151 7th/6th gen Intel® Core™ i7/i5/i3 processor
(TDP up to 35W)
1 x 260-pin DDR4-2400 SO-DIMM, up to 16GB
Intel® H110
Intel® Q170 (optional)
AMI
N/A
255 levels, 1 ~ 255 sec.
1 x full-size PCI Express Mini Card slot with mSATA
supported
1 x USB, 1 x PCIe x1, 1 x LPC, 1 x SMBus through a ZIO
connector (optional)
Lithium 3V/220mAH
2 x 2-pin connector
+12V DC-in only
AT Auto Power On function supported
146 x 104 mm
1.6 mm
-20°C ~ +60°C (-4°F ~ +140°F), operation
10% ~ 95% relative humidity, non-condensing
Assembly View
Rear view
ZIO connector
(1 x PCIe x1,
1 x USB, 1 x LPC,
1 x SMBus)
Packing List
Standard
Quick installation guide, user's manual/utility CD and cable
Accessories
Part Number
59380880250E
59312260020E
59382631000E
5078E880100E
Battery Lithium
Power Input
Description
COM port cable DB9-9x1P L=250 mm P=1.25 mm
Audio cable w/ bracket P=1.25 mm L=450 mm
2 x USB 2.0 wafer cable w/ bracket 180 mm
Heatsink w/ fan
Qty
1
1
1
1
Size
Board Thickness
Temperature
Relative Humidity
Ordering Information
3.5" embedded SBC with LGA1151 socket 7th/6th gen
Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset,
VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box
CAPA500VHGGA-Q170
3.5" embedded SBC with LGA1151 socket 7th/6th gen
(E38E500102)
Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset,
VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box
CAPA500VHGGA-H110-ZI0 3.5" embedded SBC with LGA1151 socket 7th/6th gen
(P/N: E38E500101)
Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset,
VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector
CAPA500VHGGA-Q170-ZI0 3.5" embedded SBC with LGA1151 socket 7th/6th gen
(P/N: E38E500100)
Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset,
VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector
Optional
AX93262
(P/N: E393262100)
AX93285
(P/N: E393285100)
AX93291
(P/N: E393291100)
AX93295
(P/N: E393295100)
Standard
CAPA500VHGGA-H110
(P/N: E38E500103)
I/O
MIO
SATA
Hardware Monitoring
Ethernet
1 x RS-232/422/485; with +5V/+12V powered
1 x SATA-600
Detect CPU/system temperature, voltage and fan speed
1 port 10/100/1000 Mbps supports Wake-on-LAN, PXE Boot
ROM with Intel® i211AT
1 port 10/100/1000 Mbps supports Wake-on-LAN, PXE Boot
ROM with Intel® i219LM
HD Codec audio as MIC-in/Line-in/Line-out with Realtek
ALC662
3 x USB 3.0
3 x USB 2.0
System Management Bus for advanced monitoring/control
8 channels in/out programmable
Audio
USB
SMBus
Digital I/O
Display
Chipset
Memory Size
Display Interface
Intel® integrated Gfx graphic engine
Share system memory
1 x VGA
1 x LVDS; 18/24-bit single/dual channel
1 x HDMI
ZIO module for 2 x RS-232/422/485, 2 x RS-232,
1 x PCI Express Mini Card slot
ZIO module for 2 x RS-232, 32-bit programmable DIO
ZIO module for 2 x RS-232, 2 x GbE LAN
ZIO module for 2 x isolated RS-232, 2 x USB 3.0
63
Updated Feb. 21, 2018. * All specifications and photos are subject to change without notice.