(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated V
R
, T
J
= 25°C)
Symbol
V
RRM
V
RWM
V
R
I
O
I
FRM
I
FSM
T
stg
, T
C
T
J
dv/dt
Value
40
Unit
V
2.0
4.0
25
−55
to +150
−55
to +150
10,000
A
A
A
°C
°C
V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
Symbol
R
qJL
R
qJA
Value
18
78
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
see Figure 2
(I
F
= 2.0 A)
(I
F
= 4.0 A)
Maximum Instantaneous Reverse Current (Note 3)
see Figure 4
(V
R
= 40 V)
(V
R
= 20 V)
Symbol
V
F
T
J
= 25°C
0.43
0.54
I
R
T
J
= 25°C
2.0
0.5
Value
T
J
= 125°C
0.375
0.55
T
J
= 100°C
60
40
mA
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2.0%.
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2
MBRS240LT3G, NRVBS240LT3G
TYPICAL CHARACTERISTICS
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
10
1
1
T
J
= 125°C
25°C
85°C
0.1
0
0.1
0.2
0.3
- 40°C
0.4
0.5
0.6
0.7
0.8
T
J
= 125°C
85°C 25°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
-40°C
V
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
IR , MAXIMUM REVERSE CURRENT (AMPS)
100E-3
IR , REVERSE CURRENT (AMPS)
100E-3
100°C
10E-3
10E-3
T
J
= 125°C
1.0E-3
85°C
1.0E-3
25°C
100E-6
25°C
10E-6
0
10
20
30
40
100E-6
10E-6
0
10
20
30
40
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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MBRS240LT3G, NRVBS240LT3G
TYPICAL CHARACTERISTICS
IO , AVERAGE FORWARD CURRENT (AMPS)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
100
SQUARE WAVE
dc
Freq = 20 kHz
R
qJL
= 18°C/W
PFO , AVERAGE POWER DISSIPATION (WATTS)
1.6
dc
1.4
1.2
1.0
Ipk/Io = 10
0.8
0.6
0.4
0.2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Ipk/Io = 20
SQUARE WAVE
Ipk/Io =
p
Ipk/Io = 5.0
110
120
130
140
150
T
L
, LEAD TEMPERATURE (°C)
Figure 5. Current Derating
1000
T
J
= 25°C
SURGE CURRENT (AMPS)
C, CAPACITANCE (pF)
1000
Figure 6. Forward Power Dissipation
100
100
10
1.0
0
5.0
10
15
20
25
30
35
40
V
R
, REVERSE VOLTAGE (VOLTS)
10
1.0
10
100
PULSE WIDTH (mSEC)
1000
10000
Figure 7. Capacitance
Figure 8. Maximum Non−Repetitive
Forward Surge Current
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0E+00
50%
20%
10%
5.0%
2.0%
1.0%
1.0E-01
1.0E-02
1.0E-03
R
tjl(t)
= R
tjl*r(t)
1.0E-04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 9. Thermal Response
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MBRS240LT3G, NRVBS240LT3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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