Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ....................................... -40°C to +150°C
Storage Temperature Range ............................ -40°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Package Thermal Characteristics
(Note 1)
WLP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........52°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
CC
= 4.5 to 5.5V, T
A
= -40°C to +85°C unless otherwise noted. Typical values are at V
CC
= 5V, T
A
= +25°C.) (Note 2)
PARAMETER
V
CC
Supply Voltage Range
V
CC
Quiescent Current
V
CC
Operating Current
V
CC
Undervoltage Lockout
(UVLO)
V
CC
UVLO Hysteresis
eGaN GATE DRIVER
LO Output Low
LO Output High
HO Output Low
HO Output High
Peak Source Current ON
Peak Sink Current OFF
LO
OUT_LOW
LO
OUT_HIGH
HO
OUT_LOW
HO
OUT_HIGH
I
LO
= 100mA
I
LO
= 100mA
I
HO
= 100mA
I
HO
= 100mA, V
BS
= V
HB
- V
HS
<0.1
V
CC
– 0.5V
<0.1
V
BS
– 0.5V
1
5
V
V
V
V
A
A
V
CC
I
Q
I
CC
V
CC_UVLO
V
CC_ UVLOHYS
INH = 0V
f = 13.56MHz, C
L
= 47pF
V
CC
Rising
V
CC
Falling
3.1
4.5
6
35
3.6
0.1
3.8
5.5
13
V
mA
mA
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
www.maximintegrated.com
Maxim Integrated
│
2
MAX20307
High-Frequency Optimized
Configurable eGaN Driver
DC Electrical Characteristics (continued)
(V
CC
= 4.5 to 5.5V, T
A
= -40°C to +85°C unless otherwise noted. Typical values are at V
CC
= 5V, T
A
= +25°C.) (Note 2)
PARAMETER
Input High Threshold
Input Hysteresis
Input Pull Down
Input High Threshold
Input Low Threshold
Input Leakage Current
Output High Leakage Current
Output Low
PD
INH
V
IH
V
IL
I
LEAK
I
LEAKOUT
V
OL
V
IO
= 5.5V
I
LDTY_
= 10mA
INH rising to LO rising (Note 3),
DTP0 = DTP1 = 0
INH falling to LO falling,
DTP0 = DTP1 = 0
INH rising to HO rising (Note 3),
DTP0 = DTP1 = 0
INH falling to HO falling,
DTP0 = DTP1 = 0
L off to H on
H off and L on
INH input deglitching duty
cycle mismatch 4%
C
L
= 1000pF
C
L
= 1000pF
C
L
= 1000pF
C
L
= 1000pF
(Note 4)
(Note 4)
T
SHDN
T
HYST
-1
-1
80
1.6
0.4
1
1
0.4
DIGITAL IO SIGNALS (DTP0, DTP1, LDTY0, LDTY1)
V
V
µA
µA
V
SYMBOL
V
IH
CONDITIONS
Rising Edge
MIN
TYP
52
3
200
370
MAX
UNITS
%V
CC
%V
CC
kΩ
DIGITAL CONTROL INPUT SIGNALS (INL, INH)
TIMING CHARACTERISTICS (FIGURE 1)
L Turn-On Propagation Delay
L Turn-Off Propagation Delay
H Turn-On Propagation Delay
H Turn-Off Propagation Delay
LO HO Delay Matching
HO LO Delay Matching
Minimum Input Signal Length
LO Rise Time
LO Fall Time
HO Rise Time
HO Fall Time
Minimum Output Dead Time
Maximum Output Dead Time
THERMAL PROTECTION
Thermal Shutdown
Thermal Hysteresis
150
20
°C
°C
t
PLON
t
PLOFF
t
PHON
t
PHOFF
t
DMHON
t
DMLON
22
22
22
22
2
2
2
5
1
5
1
0
9
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Note 2:
All devices are 100% production tested at T
A
= +25°C. Limits over the operating temperature range are guaranteed by
design.
Note 3:
The specified propagation delay of a rising edge includes dead time.
Note 4:
See
Table 1
for details on configuring the dead time on MAX20307. The minimum and maximum dead time will vary with
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