Features and benefits ....................................................................................................................................................................5 - 6
Comparison with high density D-Sub ............................................................................................................................................ 7
Comparison with micro-D .................................................................................................................................................................. 8
Technical Features ........................................................................................................................................................................ 9 -1
Ordering information ..........................................................................................................................................................................1
Mating dimensions and contact position .....................................................................................................................................1
Under development ..........................................................................................................................................................................40
3
microComp
®
Series
Overview
Description
To respond to miniaturization and weight saving trends in aeronautical and defense
applications SOURIAU has developed an innovative high density connector range:
microComp
®
is the alternative to High Density (HD), D-Sub and micro-D.
• Very light: shell in composite (or aluminum). Up to 66% lighter than HD/D-Sub
• Very high density up to 40% smaller than HD D-Sub
• With crimp removable contacts for wire AWG 24 to 28
• Temperature up to 1
75°C
• High vibration and shock withstanding
• Standard MIL-STD 8351 accessories
3
• Compatible with high speed data rates (Gigabit Ethernet...)
Applications
For civil aviation, military aircraft, rotorcraft, UAV and military equipment:
• Radar
• Engine Control Unit
• Missiles & Weapon systems
• Flight test equipment
• Data acquisition equipment
• Cockpit equipment & Avionics
• In Flight Entertainment Systems
• Displays
• Infrared cameras
• Battery management system
... and any electronic device with space
and weight constraints
For space applications please consult our dedicated Space Grade
microComp
®
catalog
4
microComp
®
Series
Features and benefits
Composite Shell Benefit
microComp
®
shells are available in strengthened fiber glass material for a maximum mechanical resistance. Composite
shells are up to 36% lighter than aluminum shells.
The advanced «Nickel over composite» plating process used on microComp
®
has been qualified on SOURIAU
MIL-DTL-38999 product range (technology selected by Boeing and Airbus, provides optimized shielding and
shell-to-shell continuity.
1
microComp
®
104 contacts = 1 gr
HD D-Sub plug 78 contacts = 31 gr
microComp
®
male contacts are protected
microComp
®
male connectors are tamper proof. On HD D-Sub and D-Sub male contacts are the fragile parts of the
connector because they can easily be bent. On
microComp
®
male contacts are fully shrouded by the insulator: they are
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