Intel
®
RealSense
TM
D400 Series Product Family
Datasheet
Intel
®
RealSense™ Vision Processor D4, Intel
®
RealSense™ Vision
Processor D4 Board, Intel
®
RealSense™ Depth Module D400, Intel
®
RealSense™ Depth Module D410, Intel
®
RealSense™ Depth Module D415,
Intel
®
RealSense™ Depth Camera D415, Intel
®
RealSense™ Depth Module
D420, Intel
®
RealSense™ Depth Module D430, Intel
®
RealSense™ Depth
Camera D435, Intel® RealSense™ Depth Camera D435i
Revision 005
January 2019
Document Number: 337029-005
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®
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®
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*Other names and brands may be claimed as the property of others.
© 2019 Intel Corporation. All rights reserved.
2
337029-005
Description and Features
Contents
1
2
Description and Features .................................................................................. 11
Introduction .................................................................................................... 12
2.1
2.2
2.3
2.4
2.5
2.6
3
3.1
3.2
3.3
Purpose and Scope of this Document .......................................................
Terminology .........................................................................................
Stereo Vision Depth Technology Overview................................................
Camera System Block Diagram ...............................................................
Intel
®
RealSense™ Depth Module D400 series Product SKUs ......................
Intel
®
RealSense™ Depth Camera D400 series Product SKUs .....................
12
12
13
15
16
17
Component Specification .................................................................................. 18
Vision Processor D4 Camera System Components ..................................... 18
Host Processor ..................................................................................... 18
Intel
®
RealSense™ Vision Processor D4 ................................................... 18
3.3.1
Vision Processor D4 Features .................................................... 18
3.3.2
Vision Processor D4 Signal Description ....................................... 19
3.3.3
Vision Processor D4 Package Mechanical Attributes ...................... 24
3.3.4
Vision Processor D4 Power Requirements.................................... 30
3.3.5
Vision Processor D4 Power Sequencing ....................................... 30
3.3.6
Vision Processor D4 Spec Code .................................................. 31
3.3.7
Vision Processor D4 Storage and Operating Conditions ................. 31
3.3.8
Vision Processor D4 Thermals ................................................... 32
Clock ................................................................................................... 32
Serial (SPI) Flash Memory ...................................................................... 32
Stereo Depth Module ............................................................................. 32
3.6.1
Left and Right Imagers ............................................................. 34
3.6.2
Infrared Projector .................................................................... 35
3.6.3
Color Sensor ........................................................................... 36
3.6.4
Depth Module Connector .......................................................... 37
3.6.5
Stereo Depth Module Label ....................................................... 37
3.6.6
Stiffener ................................................................................. 38
3.6.7
Temperature Sensor ................................................................ 38
3.6.8
Other Stereo Depth Module Components .................................... 38
3.6.9
Mechanical Dimensions............................................................. 39
3.6.10 Stereo Depth Module Power Sequence........................................ 40
3.6.11 Stereo Depth Module Storage and Operating Conditions ............... 40
Intel
®
RealSense™ Vision Processor D4 Board .......................................... 41
3.7.1
Mechanical Dimensions............................................................. 42
3.7.2
Depth Module Receptacle .......................................................... 42
3.7.3
Flex and Rigid Interposer Interconnect ....................................... 42
3.7.4
External Sensor Sync Connector ................................................ 47
3.7.5
USB Peripheral Connector – Type-C ........................................... 47
3.7.6
Color Image Signal Processor (ISP) ............................................ 49
3.7.7
Vision Processor D4 Board Power Requirements .......................... 49
3.7.8
Vision Processor D4 Board Thermals .......................................... 49
3.7.9
Vision Processor D4 Board Storage and Operating Conditions ........ 50
3.7.10 Intel
®
RealSense™ Vision Processor D4 Board Product Identifier and
Material Code .......................................................................... 50
®
RealSense™ Depth Camera D400 Series ......................................... 50
Intel
3.4
3.5
3.6
3.7
3.8
337029-005
3
3.8.1
Depth Camera D400 Series Mechanical Dimensions ..................... 51
3.8.2
Depth Camera D400 Series Thermals ......................................... 52
3.8.3
Depth Camera D400 Series Storage and Operating Conditions ...... 52
(1) Controlled conditions should be used for long term storage of product. (2)
Short exposure represents temporary max limits acceptable for
transportation conditions. ......................................................... 53
3.8.4
Depth Camera D400 Series Product Identifier and Material Code ... 53
3.8.5
Camera Lens Cleaning Procedure ............................................... 53
4
Functional Specification .................................................................................... 54
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
5
5.1
5.2
6
7
6.1
7.1
7.2
Vendor Identification (VID) and Device Identification (DID) ........................
Vision Processor D4 Data Streams ..........................................................
Depth Field of View (FOV) ......................................................................
Depth Field of View at Distance (Z) .........................................................
Invalid Depth Band ...............................................................................
Minimum-Z Depth .................................................................................
Depth Quality Specification ....................................................................
Measured Power ...................................................................................
Depth Start Point (Ground Zero Reference) ..............................................
4.9.1
Depth Origin X-Y Coordinates ....................................................
Depth Camera Functions ........................................................................
Color Camera Functions .........................................................................
IMU Specifications.................................................................................
54
54
57
57
58
60
60
62
63
65
66
67
68
Firmware ........................................................................................................ 69
Update ................................................................................................ 69
5.1.1
Update Limits .......................................................................... 69
Recovery ............................................................................................. 69
Intel
®
RealSense™ Software Development Kit 2.0 ..................................... 70
System Level Block Diagram ..................................................................
Vision Processor D4 System Integration ...................................................
7.2.1
Vision Processor D4 Board ........................................................
7.2.2
Vision Processor D4 on Motherboard ..........................................
D4 Camera System Power Delivery .........................................................
Vision Processor D4 Board for Integrated Peripheral ..................................
7.4.1
USB 3.1 Gen 1 Receptacle ........................................................
7.4.2
USB 3.1 Gen 1 High Speed Cable Assembly ................................
7.4.3
Transmit to Receive Crossover ..................................................
7.4.4
Motherboard Receptacle ...........................................................
7.4.5
Vision Processor D4 Board for Integrated Peripheral Power
Requirements..........................................................................
Thermals .............................................................................................
Stereo Depth Module Flex ......................................................................
Stereo Depth Module Mounting Guidance .................................................
7.7.1
Screw Mount ...........................................................................
7.7.2
Bracket Mount .........................................................................
7.7.3
Stereo Depth Module Air gap.....................................................
Thermal Interface Material .....................................................................
Heat Sink .............................................................................................
71
71
71
72
73
74
74
74
75
76
76
76
78
78
78
79
81
81
81
Software......................................................................................................... 70
System Integration .......................................................................................... 71
7.3
7.4
7.5
7.6
7.7
7.8
7.9
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Description and Features
7.10
7.11
7.12
7.13
7.14
7.15
8
8.1
8.2
Cover Design and Material Guidance .......................................................
Gaskets ...............................................................................................
7.11.1 Optical Isolation ......................................................................
7.11.2 Dust Protection .......................................................................
Firmware Recovery ...............................................................................
Calibration Support ...............................................................................
Multi-Camera Hardware Sync .................................................................
Handling Conditions ..............................................................................
81
82
83
84
84
85
85
86
Platform Design Guidelines ............................................................................... 87
Vision Processor D4 on Motherboard ....................................................... 87
Kaby Lake U and Kaby Lake Y platforms .................................................. 88
8.2.1
Kaby Lake Platform Introduction ................................................ 88
8.2.2
Supported PCB Stack-Up and Routing Geometries ....................... 88
8.2.3
Vision Processor D4 on Motherboard with USB Host Interface ........ 89
8.2.4
Vision Processor D4 on Motherboard with MIPI Host Interface ....... 90
8.2.5
Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1
Host to Vision Processor D4 Routing) ......................................... 92
8.2.6
USB2.0 Design Guidelines (USB2 Host to Vision Processor D4
Routing) ................................................................................. 93
Cherry Trail T4 Platform......................................................................... 94
8.3.1
Cherry Trail T4 Platform Introduction ......................................... 94
8.3.2
Vision Processor D4 Platform Design Guidelines ........................... 94
System Laser Compliance ......................................................................
9.1.1
Certification Statement.............................................................
9.1.2
Explanatory Label ....................................................................
9.1.3
Cautionary Statements .............................................................
9.1.4
Manufacturer’s Information .......................................................
9.1.5
US FDA Accession Number ........................................................
9.1.6
NRTL Statement ......................................................................
Ecology Compliance ..............................................................................
9.2.1
China RoHS Declaration ............................................................
9.2.2
Waste Electrical and Electronic Equipment (WEEE) .......................
95
95
95
95
96
96
96
97
97
98
8.3
9
Regulatory Compliance ..................................................................................... 95
9.1
9.2
10
11
12
13
Mechanical Drawings ........................................................................................ 99
Connector Drawings ........................................................................................ 107
Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 109
12.1
Power Delivery .................................................................................... 116
Appendix B- Cover Material .............................................................................. 119
Figures
Figure
Figure
Figure
Figure
Figure
2-1.
2-2.
2-3.
3-1.
3-2.
Active Infrared (IR) Stereo Vision Technology .........................................................
Depth Measurement (Z) versus Range (R) ..............................................................
Vision Processor D4 Camera System Block Diagram ................................................
Vision Processor D4 Package Drawing ....................................................................
Vision Processor D4 Ball-out .................................................................................
14
14
15
26
27
337029-005
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