General characteristics ............................................................................................................................................ 6
System efficiency .................................................................................................................................................. 23
Standby power ...................................................................................................................................................... 23
Digital demodulation ............................................................................................................................................ 23
Two-way communication ...................................................................................................................................... 23
Device Information ................................................................................................................................. 24
Product features overview .................................................................................................................................... 24
Pin function description ........................................................................................................................................ 26
WCT101XADS, Rev. 0, 09/2016
2
NXP Semiconductors
4.5
4.6
Ordering information ............................................................................................................................................ 37
Software library and API description ..................................................................................................................... 38
Revision History ....................................................................................................................................... 42
WCT101XADS, Rev. 0, 09/2016
NXP Semiconductors
3
1 Absolute Maximum Ratings
1.1 Electrical operating ratings
Table 1. Absolute maximum electrical ratings (V
SS
= 0 V, V
SSA
= 0 V)
Characteristic
Supply Voltage Range
Analog Supply Voltage Range
ADC High Voltage Reference
Voltage difference V
DD
to V
DDA
Voltage difference V
SS
to V
SSA
Digital Input Voltage Range
Input Voltage Range
Oscillator Input Voltage Range
Analog Input Voltage Range
Input clamp current, per pin (V
IN
< V
SS
– 0.3 V)
Output clamp current, per pin
4
2, 3
Symbol
V
DD
V
DDA
V
REFHx
ΔV
DD
ΔV
ss
V
IN
V
IN_RESET
V
OSC
V
INA
V
IC
V
OC
I
Icont
V
OUT
V
OUTOD
V
OUTOD_RESET
V
OUT_DAC
T
A
T
STG
Notes
1
Min.
–0.3
–0.3
–0.3
–0.3
–0.3
Max.
4.0
4.0
4.0
0.3
0.3
5.5
4.0
4.0
4.0
–5.0
±
20.0
25
4.0
5.5
4.0
4.0
105
150
Unit
V
V
V
V
V
V
V
V
V
mA
mA
mA
V
V
V
V
°
C
°
C
Pin Group 1
Pin Group 2
Pin Group 4
Pin Group 3
–0.3
–0.3
–0.4
–0.3
–
–
–25
Contiguous pin DC injection current—regional limit
sum of 16 contiguous pins
Output Voltage Range (normal push-pull mode)
Output Voltage Range (open drain mode)
Output Voltage Range
DAC Output Voltage Range
Ambient Temperature
Storage Temperature Range
1.
Pin Group 1,2
Pin Group 1
Pin Group 2
Pin Group 5
–0.3
–0.3
–0.3
–0.3
–40
–55
2.
3.
4.
Default Mode:
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2:
Pin Group 3: ADC and Comparator Analog Inputs
Pin Group 4: XTAL, EXTAL
Pin Group 5: DAC analog output
Continuous clamp current.
All 5 volt tolerant digital I/O pins are internally clamped to
V
SS
through an ESD protection diode. There is no diode connection to
V
DD
.
If VIN greater than VDIO_MIN (=V
SS
–0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this
limit cannot be observed, then a current limiting resistor is required.
I/O is configured as push-pull mode.
WCT101XADS, Rev. 0, 09/2016
4
NXP Semiconductors
1.2 Thermal handling ratings
Table 2. Thermal handling ratings
Symbol
T
STG
T
SDR
1.
2.
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
–
Max.
150
260
Unit
°
C
°
C
Notes
1
2
Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices.
1.3 ESD handling ratings
Table 3. ESD handling ratings
Characteristic
1
Min.
-2000
-200
-500
-100
Max.
+2000
+200
+500
+100
Unit
V
V
V
mA
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
Latch-up current at TA= 85° (I
LAT
)
C
1.
Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions unless
otherwise noted.
1.4 Moisture handling ratings
Table 4. Moisture handling ratings
Symbol
MSL
1.
Description
Moisture sensitivity level
Min.
–
Max.
3
Unit
–
Notes
1
Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
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