NXP Semiconductors
Product specification
22 W BTL or 2
11 W
stereo power amplifier
FEATURES
Requires very few external components for Bridge-Tied
Load (BTL) operation
Stereo or BTL application
High output power
Low offset voltage at output (important for BTL
applications)
Fixed gain
Good ripple rejection
Mute/standby switch
Load dump protection
AC and DC short-circuit safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
P
= 0 V)
No switch-on/switch-off plops
Protected against electrostatic discharge
Low thermal resistance
Identical inputs (inverting and non-inverting)
Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA1519C
TDA1519CSP
TDA1519CTD
TDA1519CTH
SIL9P
SMS9P
HSOP20
HSOP20
DESCRIPTION
plastic single in-line power package; 9 leads
plastic surface mounted single in-line power package; 9 leads
plastic, heatsink small outline package; 20 leads
GENERAL DESCRIPTION
TDA1519C
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
VERSION
SOT131-2
SOT354-1
SOT397-1
SOT418-3
plastic, heatsink small outline package; 20 leads; low stand-off height
2004 Jan 28
2
NXP Semiconductors
Product specification
22 W BTL or 2
11 W
stereo power amplifier
PINNING
PIN
SYMBOL
NINV
GND1
RR
OUT1
GND2
OUT2
V
P
M/SS
INV
n.c.
TDA1519C;
TDA1519CSP
1
2
3
4
5
6
7
8
9
TDA1519C
DESCRIPTION
TDA1519CTD
19
20
1
3
5
8
10
11
12
TDA1519CTH
19
20
1
3
5
8
10
11
12
non-inverting input
ground 1 (signal)
supply voltage ripple rejection
output 1
ground 2 (substrate)
output 2
positive supply voltage
mute/standby switch input
inverting input
2, 4, 6, 7, 9 and 13 to 18 2, 4, 6, 7, 9 and 13 to 18 not connected
NINV 1
GND1 2
RR 3
OUT1 4
GND2 5
OUT2 6
V
P
7
M/SS 8
INV 9
mgr561
RR 1
n.c. 2
OUT1 3
n.c. 4
20 GND1
19 NINV
18 n.c.
17 n.c.
16 n.c.
GND1 20
NINV 19
n.c. 18
n.c. 17
n.c. 16
n.c. 15
1
2
3
4
RR
n.c.
OUT1
n.c.
GND2
n.c.
n.c.
OUT2
n.c.
TDA1519C
TDA1519CSP
GND2 5
TDA1519CTH
5
6
7
8
9
TDA1519CTD
n.c. 6
n.c. 7
OUT2 8
n.c. 9
VP 10
mgl937
15 n.c.
14 n.c.
13 n.c.
12 INV
11 M/SS
n.c. 14
n.c. 13
INV 12
M/SS 11
001aaa348
10 V
P
Fig.2
Pin configuration
TDA1519C and
TDA1519CSP.
Fig.3
Pin configuration
TDA1519CTD.
Fig.4
Pin configuration
TDA1519CTH.
2004 Jan 28
5
嵌入式系统
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