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24LC08B-I/PG

产品描述电可擦除可编程只读存储器 1kx8 - 2.5V Lead Free Package
产品类别存储    存储   
文件大小233KB,共25页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
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24LC08B-I/PG概述

电可擦除可编程只读存储器 1kx8 - 2.5V Lead Free Package

24LC08B-I/PG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码DIP
包装说明0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
针数8
Reach Compliance Codecompliant
ECCN代码EAR99
最大时钟频率 (fCLK)0.4 MHz
数据保留时间-最小值200
耐久性1000000 Write/Erase Cycles
I2C控制字节1010XMMR
JESD-30 代码R-PDIP-T8
JESD-609代码e3
长度9.27 mm
内存密度8192 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数1024 words
字数代码1000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源3/5 V
认证状态Not Qualified
座面最大高度5.334 mm
串行总线类型I2C
最大待机电流0.000001 A
最大压摆率0.003 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
最长写入周期时间 (tWC)5 ms
写保护HARDWARE
Base Number Matches1

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24AA08/24LC08B
8K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA08
24LC08B
Note 1:
V
CC
Range
1.8-5.5
2.5-5.5
Max Clock
Frequency
400 kHz
(1)
400 kHz
Temp
Ranges
I
I, E
Description
The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low voltage
design permits operation down to 1.8V, with standby
and active currents of only 1
µA
and 1 mA,
respectively. The 24XX08 also has a page write
capability for up to 16 bytes of data. The 24XX08 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP and MSOP packages and is also
available in the 5-lead SOT-23 package.
100 kHz for V
CC
<2.5V
Features
• Single supply with operation down to 1.8V
• Low-power CMOS technology
- 1 mA active current typical
- 1
µA
standby current typical (I-temp)
• Organized as 4 blocks of 256 bytes (4 x 256 x 8)
• 2-wire serial interface bus, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (<2.5V) and 400 kHz (≥2.5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 16 bytes
• 2 ms typical write cycle time for page write
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• 5-lead SOT-23 package
• Standard and Pb-free finishes available
• Available for extended temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Package Types
PDIP/SOIC/TSSOP/MSOP
A0 1
8 Vcc
SCL
Vss
SOT-23-5
1
2
3
5
WP
24XX08
24XX08
A1 2
A2 3
Vss 4
Note:
7 WP
6 SCL
5 SDA SDA
4
Vcc
Pins A0, A1 and A2 are not used by the
24XX08. (No internal connections).
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SDA
SCL
YDEC
V
CC
V
SS
Sense Amp.
R/W Control
*24XX08 is used in this document as a generic part number for the 24AA08/24LC08B devices.
2003 Microchip Technology Inc.
DS21710C-page 1

24LC08B-I/PG相似产品对比

24LC08B-I/PG 24LC08BT-I-STG 24AA08T-I-SNG 24LC08B-I-MSG 24LC08BT-I/MSG 24LC08BT-I/OTG 24LC08B-I/STG 24AA08-I/SNG 24LC08B-I/SNG
描述 电可擦除可编程只读存储器 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 1.8V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package 电可擦除可编程只读存储器 1kx8 - 1.8V Lead Free Package 电可擦除可编程只读存储器 1kx8 - 2.5V Lead Free Package
是否无铅 不含铅 - - - 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 - - - 符合 符合 符合 符合 符合
零件包装代码 DIP - - - MSOP SOT-23 TSSOP SOIC SOIC
包装说明 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 - - - ROHS COMPLIANT, PLASTIC, MSOP-8 ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN 4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, TSSOP-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
针数 8 - - - 8 5 8 8 8
Reach Compliance Code compliant - - - compliant compliant compliant compliant compliant
ECCN代码 EAR99 - - - EAR99 EAR99 EAR99 EAR99 EAR99
最大时钟频率 (fCLK) 0.4 MHz - - - 0.4 MHz 0.4 MHz 0.4 MHz 0.1 MHz 0.4 MHz
数据保留时间-最小值 200 - - - 200 200 200 200 200
耐久性 1000000 Write/Erase Cycles - - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010XMMR - - - 1010XMMR 1010XMMR 1010XMMR 1010XMMR 1010XMMR
JESD-30 代码 R-PDIP-T8 - - - S-PDSO-G8 R-PDSO-G5 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 - - - e3 e3 e3 e3 e3
长度 9.27 mm - - - 3 mm 2.9 mm 4.4 mm 4.9 mm 4.9 mm
内存密度 8192 bit - - - 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit
内存集成电路类型 EEPROM - - - EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 - - - 8 8 8 8 8
功能数量 1 - - - 1 1 1 1 1
端子数量 8 - - - 8 5 8 8 8
字数 1024 words - - - 1024 words 1024 words 1024 words 1024 words 1024 words
字数代码 1000 - - - 1000 1000 1000 1000 1000
工作模式 SYNCHRONOUS - - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C - - - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C - - - -40 °C -40 °C -40 °C -40 °C -40 °C
组织 1KX8 - - - 1KX8 1KX8 1KX8 1KX8 1KX8
封装主体材料 PLASTIC/EPOXY - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP - - - TSSOP LSSOP TSSOP SOP SOP
封装等效代码 DIP8,.3 - - - TSSOP8,.19 TSOP5/6,.11,37 TSSOP8,.25 SOP8,.25 SOP8,.25
封装形状 RECTANGULAR - - - SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE - - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
并行/串行 SERIAL - - - SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED - - - 260 260 260 260 260
电源 3/5 V - - - 3/5 V 3/5 V 3/5 V 2/5 V 3/5 V
认证状态 Not Qualified - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.334 mm - - - 1.1 mm 1.45 mm 1.2 mm 1.75 mm 1.75 mm
串行总线类型 I2C - - - I2C I2C I2C I2C I2C
最大待机电流 0.000001 A - - - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A
最大压摆率 0.003 mA - - - 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
最大供电电压 (Vsup) 5.5 V - - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.5 V - - - 2.5 V 2.5 V 2.5 V 1.7 V 2.5 V
标称供电电压 (Vsup) 5 V - - - 5 V 5 V 5 V 2.5 V 5 V
表面贴装 NO - - - YES YES YES YES YES
技术 CMOS - - - CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL - - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 THROUGH-HOLE - - - GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 2.54 mm - - - 0.65 mm 0.95 mm 0.65 mm 1.27 mm 1.27 mm
端子位置 DUAL - - - DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED - - - 40 40 40 40 40
宽度 7.62 mm - - - 3 mm 1.55 mm 3 mm 3.9 mm 3.9 mm
最长写入周期时间 (tWC) 5 ms - - - 5 ms 5 ms 5 ms 5 ms 5 ms
写保护 HARDWARE - - - HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches 1 - - - 1 1 1 1 1
湿度敏感等级 - - - - 1 1 1 1 1

 
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