cExpress-SL
COM Express Compact Size Type 6 Module with
6th Gen Intel
®
Core™ and Celeron
®
Processors
Features
●
●
●
New
6th Generation Intel
®
Core™ and Celeron
®
Processors
Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz
Two DDI channels, one LVDS (build option 4 lanes eDP),
supports up to 3 independent displays
GbE, up to 6 PCIe x1 (build option)
Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
Supports Smart Embedded Management Agent (SEMA
®
) functions
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
●
●
●
●
Specifications
●
Core System
CPU
6th Generation Intel
®
Core™ and Celeron
®
Processors - Mobile 14nm process
(formerly “Skylake-U”)
Core™ i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2)
Core™ i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2)
Core™ i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2)
Celeron
®
3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1)
Supports: Intel
®
VT, Intel
®
TXT, Intel
®
SSE4.2, Intel
®
HT Technology, Intel
®
64
Architecture, Execute Disable Bit, Intel
®
Turbo Boost Technology 2.0, Intel
®
AVX2, Intel
®
AES-NI, PCLMULQDQ Instruction, Intel
®
Secure Key and Intel
®
TSX.
Note: Availability of features may vary between processor SKUs.
●
Video
Intel
®
Generation 9 LP Graphics Core Architecture, supporting 3 independent
and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP
outputs
Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX
11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL 5.0, 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
GPU Feature Support
Digital Display Interface
DDI1/2 supporting DisplayPort/HDMI/DVI
Memory
Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual
SODIMM socket
LVDS
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP
4 lane support build option, in place of LVDS
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 11.0 support
(AMT support available on Core™ i7/i5 only)
®
●
Audio
Chipset
Intel
®
HD Audio integrated in SOC
Cache
4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron®
Expansion Busses
Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build
option)
Note: Gen3 for Core™ i7/i5/i3, Gen2 for Celeron
®
LPC bus, SMBus (system) , I
2
C (user)
Audio Codec
On carrier Express-BASE6 (ALC886 standard support)
●
Ethernet
Intel
®
MAC/PHY: i219LM with AMT 11.0 support
Interface: 10/100/1000 GbE connection
Supports : Voltage/current monitoring, power sequence debug support,
AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I
2
C, failsafe BIOS (dual BIOS ), watchdog timer and fan
control
SEMA Board Controller
●
I/O Interfaces
USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)
SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron
®
supports two ports
only
Serial: 2 UART ports with console redirection
GPIO: 4 GPO and 4 GPI from BMC
Debug Headers
40-pin multipurpose flat cable connector for use with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power
testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
Note:
“build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
●
Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
●
Mechanical and Environmental
Form Factor: PICMG COM.0: Rev 2.1 Type 6
Dimension: Compact size: 95 mm x 95 mm
●
TPM
Chipset: Atmel AT97SC3204
Type: TPM 1.2
Operating Temperature
Standard: 0°C to 60°C
Extreme Rugged™: -40°C to +85°C (build option)
●
Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 5-20V / 5Vsb ±5% or AT = 5-20V
Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4,
WOL S3/S4/S5)
ECO mode: support deep S5 mode for power saving
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
●
Operating Systems
Standard Support
Windows 7 32/64-bit, Windows 10/8.1 64-bit, Linux 64-bit
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Extended Support (BSP)
WES7 32/64-bit, Linux 64-bit
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Ordering Information
●
Accessories
Heat Spreaders
●
cExpress-SL-i7-6600U
Compact COM Express
®
Type 6 module with Intel
®
Core™ i7-
6600U and GT2 graphics
cExpress-SL-i5-6300U
Compact COM Express
®
Type 6 module with Intel
®
Core™ i5-
6300U and GT2 graphics
cExpress-SL-i3-6100U
Compact COM Express
®
Type 6 module with Intel
®
Core™ i3-
6100U and GT2 graphics
cExpress-SL-3955U
Compact COM Express
®
Type 6 module with Intel
®
Celeron
®
3955U and GT1 graphics
●
HTS-cSL-B
Heatspreader for cExpress-SL with threaded standoffs for
bottom mounting
HTS-cSL-BT
Heatspreader for cExpress-SL with through hole standoffs for
top mounting
●
●
●
Passive Heatsinks
●
THS-cSL-B
Low profile heatsink for cExpress-SL with threaded standoffs
for bottom mounting
THS-cSL-BT
Low profile heatsink for cExpress-SL with through hole
standoffs for top mounting
THSH-cSL-B
High profile heatsink for cExpress-SL with threaded standoffs
for bottom mounting
Starter Kit
●
●
COM Express Type 6 Starter Kit Plus
COM Express formfactor starter kit with Express-BASE6 board,
power supply, and accessory kit
●
Active Heatsink
●
THSF-cSL-B
High profile heatsink with Fan for cExpress-SL with threaded
standoffs for bottom mounting
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Updated Oct. 14, 2016. ©2016 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
