电可擦除可编程只读存储器 10MS 8 EIAJ AUTO TEMP 2.7V
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.209 INCH, GREEN, EIAJ, PLASTIC, SOIC-8 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 10 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 5.29 mm |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.16 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.000003 A |
| 最大压摆率 | 0.01 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.24 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| AT25128AW-10SU-2.7 | AT25256AW-10SU-18 | AT25128A-10TU-18 | AT25256AN-10SU-18 | AT25256AU2-10UU-18 | AT25128A-10TU-2.7 | AT25128A-10PU-1.8 | AT25128AW-10SU-1.8 | AT25128AN-10SU-2.7 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 电可擦除可编程只读存储器 10MS 8 EIAJ AUTO TEMP 2.7V | EEPROM EIAJ AUTO GRD 2.7V - 10MS 8 EIAJ 1.8V | EEPROM 128K SPI 100K CYCLES - 10MS 1.8V | EEPROM 8 AUTO NIPDAU 2.7V - 10MS 1.8V | EEPROM Serial EEPROM | 电可擦除可编程只读存储器 128K SPI 100K CYCLES - 10MS 2.7V | 电可擦除可编程只读存储器 128K SPI 100K CYCLES - 10MS 1.8V | 电可擦除可编程只读存储器 10MS 8 EIAJ IND TEMP 1.8V | 电可擦除可编程只读存储器 128K SPI 100K CYCLES - 10MS 2.7V |
| 是否Rohs认证 | 符合 | - | - | - | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Atmel (Microchip) | - | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | SOIC | - | - | - | - | TSSOP | DIP | SOIC | SOIC |
| 包装说明 | 0.209 INCH, GREEN, EIAJ, PLASTIC, SOIC-8 | - | - | - | - | 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 | 0.209 INCH, GREEN, EIAJ, PLASTIC, SOIC-8 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 针数 | 8 | - | - | - | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | - | - | - | - | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | - | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 10 MHz | - | - | - | - | 10 MHz | 5 MHz | 5 MHz | 10 MHz |
| 数据保留时间-最小值 | 100 | - | - | - | - | 100 | 100 | 100 | 100 |
| 耐久性 | 100000 Write/Erase Cycles | - | - | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | - | - | - | - | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | - | - | - | - | e3 | e3 | e3 | e3 |
| 长度 | 5.29 mm | - | - | - | - | 4.4 mm | 9.271 mm | 5.29 mm | 4.9 mm |
| 内存密度 | 131072 bit | - | - | - | - | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| 内存集成电路类型 | EEPROM | - | - | - | - | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | - | - | - | - | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 1 | - | - | - | - | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | - | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | - | - | - | - | 8 | 8 | 8 | 8 |
| 字数 | 16384 words | - | - | - | - | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | - | - | - | - | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | SYNCHRONOUS | - | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16KX8 | - | - | - | - | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | - | - | - | TSSOP | DIP | SOP | SOP |
| 封装等效代码 | SOP8,.3 | - | - | - | - | TSSOP8,.25 | DIP8,.3 | SOP8,.3 | SOP8,.25 |
| 封装形状 | RECTANGULAR | - | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | - | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | - | - | - | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | - | - | - | - | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 3/5 V | - | - | - | - | 3/5 V | 2/5 V | 2/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.16 mm | - | - | - | - | 1.2 mm | 5.334 mm | 2.16 mm | 1.75 mm |
| 串行总线类型 | SPI | - | - | - | - | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.000003 A | - | - | - | - | 0.000003 A | 0.000003 A | 0.000003 A | 0.000003 A |
| 最大压摆率 | 0.01 mA | - | - | - | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | - | - | - | - | 2.7 V | 1.8 V | 1.8 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | - | - | - | - | 5 V | 2.7 V | 2.7 V | 5 V |
| 表面贴装 | YES | - | - | - | - | YES | NO | YES | YES |
| 技术 | CMOS | - | - | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | - | - | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | - | - | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | - | - | - | - | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | - | - | - | 40 | NOT SPECIFIED | 40 | 40 |
| 宽度 | 5.24 mm | - | - | - | - | 3 mm | 7.62 mm | 5.24 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | - | - | - | - | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE/SOFTWARE | - | - | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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