
电可擦除可编程只读存储器 16K, 2K X 8 1.8V SERIAL EE, EXT
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | HVSON, SOLCC8,.12,20 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 13 weeks |
| 最长访问时间 | 3500 ns |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010MMMR |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 8 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.12,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 2/5 V |
| 编程电压 | 2.5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 0.8 mm |
| 串行总线类型 | I2C |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |

| 24AA16T-E/MNY | 24AA16-E/MS | 24AA16T-E/MS | 24AA16-E/SN | 24AA16T-E/SN | 24AA16-E/P | |
|---|---|---|---|---|---|---|
| 描述 | 电可擦除可编程只读存储器 16K, 2K X 8 1.8V SERIAL EE, EXT | EEPROM 16K, 2K X 8 1.8V SERIAL EE, EXT | 电可擦除可编程只读存储器 16K, 2K X 8 1.8V SERIAL EE, EXT | 电可擦除可编程只读存储器 16K, 2K X 8 1.8V SERIAL EE, EXT | 电可擦除可编程只读存储器 16K, 2K X 8 1.8V SERIAL EE, EXT | 电可擦除可编程只读存储器 16K, 2K X 8 1.8V SERIAL EE, EXT |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | HVSON, SOLCC8,.12,20 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | 13 weeks | 8 weeks | 12 weeks | 7 weeks | 14 weeks | 6 weeks |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 200 | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR |
| JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609代码 | e4 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 9.46 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | TSSOP | SOP | SOP | DIP |
| 封装等效代码 | SOLCC8,.12,20 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | NOT APPLICABLE |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.1 mm | 1.1 mm | 1.75 mm | 1.75 mm | 4.32 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | NOT APPLICABLE |
| 宽度 | 2 mm | 3 mm | 3 mm | 3.91 mm | 3.91 mm | 7.62 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| 湿度敏感等级 | 1 | 1 | 1 | 3 | 3 | - |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 零件包装代码 | - | TSSOP | TSSOP | SOIC | SOIC | DIP |
| 针数 | - | 8 | 8 | 8 | 8 | 8 |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大待机电流 | - | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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