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QTH-120-04-F-D-A

产品描述板对板与夹层连接器 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
产品类别连接器    连接器   
文件大小1000KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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QTH-120-04-F-D-A概述

板对板与夹层连接器 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip

QTH-120-04-F-D-A规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
Factory Lead Time2 weeks
其他特性ELP, POLARIZED
板上安装选件PEG
主体宽度0.235 inch
主体深度0.6 inch
主体长度3.15 inch
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD FLASH OVER NICKEL (50)
联系完成终止Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别MALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点样式CENTRONIC
DIN 符合性NO
滤波功能NO
IEC 符合性NO
绝缘体颜色BLACK
JESD-609代码e3
MIL 符合性NO
插接触点节距0.02 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距6.1722 mm
电镀厚度FLASH inch
额定电流(信号)2 A
可靠性COMMERCIAL
端子节距0.5 mm
端接类型SURFACE MOUNT
触点总数240

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F-219
QTH–090–01–C–D–A
®
(0.50 mm) .0197"
QTH–060–07–F–D–A
QTH–030–01–L–D–A
QTH SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
10 YEAR MFG
WITH 50 µ" GOLD
Integral metal plane for
power or ground
Standard Stack Heights
from 5 mm to 25 mm
POWER/SIGNAL
APPLICATION
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-060)
(0.15 mm) .006" max (090)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
25
G b p s
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
(60 total pins per bank = –D)
–030, –060, –090
–020, –040, –060
(20 pairs per bank = –D–DP)
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-Ended
–D
–L
= Differential Pair
(–01 only)
–D–DP
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
–K
–D = (No. of Pins per Row/30) x (20.00) .7875
–DP = (No. of Pairs per Row/20) x (20.00) .7875
(20.00) .7875
01
STANDARDS
• PISMO
1
Visit www.samtec.com/standards
for more information.
(7.11)
.280
02
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0.50)
.0197
(0.20)
.008
A
–01 & –02
–03 thru –09
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins in
contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
A
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
= Tape & Reel
(–090 positions
maximum)
–TR
–L
QTH
LEAD
STYLE
A
(4.27)
.168
(7.26)
.286
(10.27)
.404
(15.25)
.600
(18.26)
.718
(24.24)
.954
(13.26)
.522
HEIGHT
WITH
QSH*
(5.00)
.197
(8.00)
.315
(11.00)
.433
(16.00)
.630
(19.00)
.748
(25.00)
.984
(14.00)
.551
–01
–02
–03
–04
–05
–07
–09
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP)
& –090)
(0.76)
.030
(0.89)
.035
DIA
(0.64)
.025
–L
*Processing conditions
will affect mated height.
See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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