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MIS-076-01-F-D

产品描述板对板与夹层连接器 .025" Mixed Technology Socket
产品类别连接器    连接器   
文件大小670KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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MIS-076-01-F-D概述

板对板与夹层连接器 .025" Mixed Technology Socket

MIS-076-01-F-D规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time2 weeks
主体/外壳类型SOCKET
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD FLASH
联系完成终止MATTE TIN
触点性别FEMALE
触点材料PHOSPHOR BRONZE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
制造商序列号MIS
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距0.635 mm
端接类型SURFACE MOUNT
触点总数152

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F-219 SUPPLEMENT
MIS–019–01–F–D
®
MIS–057–01–L–D
MIS–038–01–F–D
(0.635 mm) .025"
MIS SERIES
MIXED TECHNOLOGY SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
MIT
Standoffs:
SO
Integral metal plane
for power or ground
Polarized
• Mixed
technology
footprint
HIGH-SPEED CHANNEL PERFORMANCE
MIT/MIS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
28
G b p s
76 signal lines
per linear inch
MIS
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–019, –038, –057
(38 total positions per bank)
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–F
–L
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–K
ALSO AVAILABLE
(MOQ Required)
• 11 mm, 16 mm, 18.75 mm
and 22 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
= 10 µ" (0.25 µm)
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
= Tape &
Reel
–TR
(No. of Positions/19) x (12.70) .500 + (12.70) .500
(12.70) .500
(6.22)
.245
(0.635)
.025
(1.32)
.052
(0.69) .027
(0.15)
.006
01
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area, Matte Tin
over 50 µ" (1.27 µm) min Ni
on all solder tails
*Note:
–C Plating passes 10 year MFG testing
–C*
02
MATED HEIGHT*
(3.43)
.135
(7.49)
.295
(3.63)
.143
(0.18)
.007
MIS
LEAD
STYLE
MIT LEAD
STYLE
–01
–02
–01
(5.00) (8.00)
.197 .315
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Note:
Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
Due to technical progress, all designs, specifications and components are subject to change without notice.
*Processing conditions
will affect mated height.
See SO Series for board
space tolerances.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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