电可擦除可编程只读存储器 32K 4KX8 2.5V SER EE IND
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 15 weeks |
| 最大时钟频率 (fCLK) | 5 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 内存密度 | 32768 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| 25LC320AT-I/SN | 25LC320A-E/ST | 25AA320AT-I/MS | 25LC320AT-I/ST | 25AA320A-I/P | 25LC320A-E/P | |
|---|---|---|---|---|---|---|
| 描述 | 电可擦除可编程只读存储器 32K 4KX8 2.5V SER EE IND | 电可擦除可编程只读存储器 32K 4KX8 2.5V SER EE EXT | 电可擦除可编程只读存储器 32K 4KX8 1.8V SER EE IND | 电可擦除可编程只读存储器 32K 4KX8 2.5V SER EE IND | 电可擦除可编程只读存储器 32K 4KX8 1.8V SER EE IND | 电可擦除可编程只读存储器 32K 4KX8 2.5V SER EE EXT |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | MSOP | SOIC | DIP | DIP |
| 包装说明 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MSOP-8 | TSSOP, TSSOP8,.25 | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | DIP, DIP8,.3 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 15 weeks | 6 weeks | 16 weeks | 6 weeks | 5 weeks | 5 weeks |
| 最大时钟频率 (fCLK) | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| 数据保留时间-最小值 | 200 | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.9 mm | 4.4 mm | 3 mm | 4.4 mm | 9.271 mm | 9.271 mm |
| 内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | TSSOP | TSSOP | DIP | DIP |
| 封装等效代码 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.19 | TSSOP8,.25 | DIP8,.3 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | NOT APPLICABLE | NOT APPLICABLE |
| 电源 | 3/5 V | 3/5 V | 2/5 V | 3/5 V | 2/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.2 mm | 1.1 mm | 1.2 mm | 5.334 mm | 5.334 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 1.8 V | 2.5 V | 1.8 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 2.5 V | 5 V | 2.5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | NOT APPLICABLE | NOT APPLICABLE |
| 宽度 | 3.9 mm | 3 mm | 3 mm | 3 mm | 7.62 mm | 7.62 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 3 | 1 | 1 | 1 | - | - |
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