电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WCR0805-15R8FA

产品描述厚膜电阻器 - SMD
产品类别无源元件    电阻器    薄膜电阻器    厚膜电阻器 - SMD   
文件大小661KB,共4页
制造商Welwyn Components (TT Electronics)
下载文档 详细参数 全文预览

WCR0805-15R8FA概述

厚膜电阻器 - SMD

WCR0805-15R8FA规格参数

参数名称属性值
厂商名称Welwyn Components (TT Electronics)
产品种类厚膜电阻器 - SMD
系列WCR
电阻15.8 Ohms
功率额定值125 mW (1/8 W)
容差1 %
温度系数100 PPM / C
最小工作温度- 55 C
最大工作温度+ 155 C
电压额定值150 V
外壳代码 - in0805
外壳代码 - mm2012
特点Zero Ohm Jumpers
封装Reel
高度0.55 mm
长度2 mm
产品Thick Film Resistors SMD
技术Thick Film
端接类型SMD/SMT
宽度1.25 mm
安装风格PCB Mount
工厂包装数量5000

文档预览

下载PDF文档
General Purpose Surface
Resistors
Mounted Resistors
General Purpose Surface
Mounted Resistors
General Purpose Surface
WCR Series
Mounted Resistors
Excellent reliability
WCR Series
Excellent reliability
WCR Series
Wrap around terminations
Wide range of sizes and ohmic values
Inner electrode protection
Excellent reliability
Wrap
range of sizes and ohmic values
Wide
around terminations
Inner electrode protection
Wrap around terminations
Inner electrode protection
AEC-Q200 grade available
Wide range of sizes and ohmic values
Welwyn Components
Welwyn Components
Electrical Data
Electrical
rating @ 70°C
Data
Power
All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
0201
0402
0603
0805
1206
1210
2010
2512
0.1
0.125
0.25
0.5
1.0
0.05
0.25
0.063
watts
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
0603
0805
1206
2010
2512
1210
0402
0201
150
25
50
75
Limiting element votage
volts
200
0.1
0.125
0.25
0.5
1.0
0.05
0.063
Power ratingTCR*
@ 70°C
watts
100 0.25
200
250
ppm/°C
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
1
Resistance Tolerance
%
150
25
50
75
Limiting element votage
volts
200
E24 or E96
Standard values
100
200
250
TCR*
ppm/°C
-55 to 155
Ambient temperature range
°C
1
Resistance Tolerance Jumper Chip Rating %
Zero-ohm
amps
1.5
2
0.5
1
E24 or E96
Standard values
<50
Zero-ohm Jumper Chip Resistance milliohms
-55 to 155
Ambient temperature range
°C
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
Zero-ohm Jumper Chip Rating
amps
1.5
2
0.5
1
TCR for high values 3M3 to 10M: ±300ppm/º
<50
Zero-ohm Jumper Chip Resistance milliohms
Physical Data
Dimensions (mm)
Physical Data
L
Style
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
TCR for high values 3M3 to 10M: ±300ppm/º
The chips have a high alumina substrate (96% minimum) with
a ruthenium oxide resistance element and silver palladium,
Figure
Construction
and tin plated terminations. A glazed protection coat
1
nickel
The chips have a high alumina substrate (96% minimum) with
is applied to the resistive element (See Fig.1)
a ruthenium oxide resistance element and silver palladium,
Terminations
nickel and tin plated terminations. A glazed protection coat
Solderability
The terminations meet the requirements of
is applied to the resistive element (See Fig.1)
IEC 115-1, Clause 4.17.3.2.
Terminations
Strength
The terminations meet requirements of
Solderability
The terminations meet the requirements of
IEC 68.2.21.
IEC 115-1, Clause 4.17.3.2.
Strength
The terminations meet requirements of
IEC 68.2.21.
General Note
W
0.6 ± 0.03
0.3 ± 0.03
0201
Dimensions (mm)
1.0 ± 0.1
0.5 ± 0.05
0402
L
T
1.6 ± W
0.1
Style
0.8 ± 0.1
0603
0.6 ± 0.03
2.0 ± 0.15
0.3 ± 0.03 1.25 0.23 ± 0.03
0201
+ 0.15 -0.1
0805
1.0 ± 0.1
3.1 ± ± 0.05 1.55 0.35 ± 0.05
0.5 0.15
0402
+ 0.15 -0.1
1206
1.6 ± 0.1
0.45 ±
3.1 ± ±0.1
0.8 0.1
0603
2.6 ± 0.2 0.1
1210
2.0 ± 0.15
0.55 ±
5.0 ± 0.1
1.25 + 0.15 -0.1 2.5 ± 0.20.1
0805
2010
3.1 ± 0.15 1.55 + 0.15 -0.1 3.2 ± 0.20.1
0.55 ±
6.35 ± 0.1
1206
2512
3.1 ± 0.1
0.55 ± 0.1
2.6 ± 0.2
1210
5.0 ± 0.1
0.55 ± 0.1
2.5 ± 0.2
2010
Construction
± 0.2
6.35 ± 0.1
0.55 ± 0.1
3.2
2512
T
0.23 ± 0.03
0.35 ± 0.05
0.45 ±C
0.1
0.1 ± 0.05
0.55 ± 0.1
0.2 0.1
0.55 ± ± 0.1
0.3 0.2
0.55 ±±0.1
0.4 0.1
0.55 ± ± 0.2
0.45 ± 0.2
0.55 ± 0.1
0.5 ± 0.25
0.60 ± 0.25
0.60 ± 0.25
C
0.1 ± 0.05
0.2 ± 0.1
A
0.3 ± 0.2
0.15 ± 0.05
0.4 ± 0.2
0.25 ± 0.1
0.45 ± 0.2
0.3 ± 0.2
0.5 ± 0.25
0.4 ± 0.2
0.60 ± 0.25
0.45 ± 0.2
0.60 ± 0.25
0.5 ± 0.2
0.5 ± 0.2
0.5 ± 0.2
A
0.15 ± 0.05
0.25 ± 0.1
0.3 ± 0.2
0.4 ± 0.2
0.45 ± 0.2
0.5 ± 0.2
A
0.5 ± 0.2
0.5 ± 0.2
C
T
A
L
C
A T
W
L
Wrap-around terminations
(3 faces)
W
A
Figure 1
Wrap-around terminations
(3 faces)
Tin Plating
Epoxy Melamine
Protection
Nickel Barrier
Glass Dielectric
Silver
Dipped Conductor
Resistance Element
Palladium
Epoxy Melamine
Protection
Glass Dielectric
Silver
Resistance Element
Palladium
96% min Alumina Substrate
96% min Alumina Substrate
Tin Plating
Nickel Barrier
Dipped Conductor
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
General
Note
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
General
Note
Welwyn Components
the right to make changes in
changes
specification
specification without notice or liability.
Telephone: +44 (0) 1670 make
product
in product
without notice or
Email:
TT Electronics reserves
reserves the right to 822181 · Facsimile: +44 (0) 1670 829465 ·
liability.
info@welwyn-tt.com · Website: www.welwyn-tt.com
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
Iss 07.03
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
Iss 07.03
11.18
A subsidiary of
TT electronics plc
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
© TT Electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
筒仓中S型称重传感器 - 101BH的作用
筒仓,是储存松散固体的立式容器。仓底结构既承受物料的重量又需具有卸料功能,因此通常采用漏斗形。平板仓底虽构造简单,但需填坡,既耗料又增重,只适用于小型筒仓。在地震区,筒仓的支承结构应 ......
sensor123 工业自动化与控制
ucos-ii求助
在创建任务时调用OSTaskStkInit(),在有的处理器移植中将堆栈指针寄存器压入该任务栈中(此时的堆栈指针寄存器的值是什么呢?)。当系统开始多任务时OSStart()会调用OSStartHighRdy(),将 ......
cspwj 实时操作系统RTOS
不知道大家还记得TI的Hercules的LaunchPad吗?
不知道大家还记得TI的Hercules的LaunchPad吗? 下面给大家带来它的一些资源: Hercules的最小板官方资源.pdf Hercules_LaunchPad_SchLayout.zip...
Sur 微控制器 MCU
Fedora与Windows共享文件夹设置方法
VMware安装的Fedora系统中项目编辑工具较少,为了方便嵌入式系统调试,可以建立本地共享的路径。步骤1:在计算机的控制面板中,打开网络连接,双击VMnet8虚拟网卡。164199图1 计算机端网络连接 ......
有缘于你 嵌入式系统
想收一块Hercules LaunchPad板子
想收一块Hercules LaunchPad板子,有的可以转让一下:congratulate:...
jishuaihu 淘e淘
MSP430F4152基础时钟
#define SCFQ_2M (0x3F) 单片机外接时钟32.768KHZ,时钟初始化SCFQ_2M;///* fMCLK=64*fACLK * /,用是示波器查看输出主时钟频率2Mhz,但是会有0.5mhz左右的波动,这正常吗?可以通过什么语句 ......
郝英俊 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2739  1917  2620  1233  1626  19  13  27  18  15 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved