监控电路 MPU Supervisor
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e3 |
| 长度 | 19.175 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大供电电流 (Isup) | 0.3 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MAX697CPE+ | MAX696MJE+ | MAX696CPE+ | MAX697CWE+ | MAX696MJE/883B | MAX696C/D+ | MAX697MJE/883B | MAX696CWE+ | MAX194AEWE+ | MAX696CWE+T | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 监控电路 MPU Supervisor | 监控电路 | 监控电路 MPU Supervisor | 监控电路 MPU Supervisor | 监控电路 MPU Supervisor | 监控电路 | 监控电路 MPU Supervisor | 监控电路 MPU Supervisor | 模数转换器 - ADC 14-Bit, 85ksps ADC with 10 A Shutdown | 监控电路 MPU Supervisor |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 含铅 | - | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 不符合 | - | 不符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | - | DIP | SOIC | DIP | - | DIP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | SOP, SOP16,.4 | DIP, | - | DIP, DIP16,.3 | SOP, SOP16,.4 | SOP, SOP16,.3 | SOP, SOP16,.4 |
| 针数 | 16 | - | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | - | compliant | compliant | not_compliant | - | not_compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | - | NO | NO | NO | - | NO | NO | - | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 | - | R-PDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | - | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | - | e3 | e3 | e0 | - | e0 | e3 | e3 | e3 |
| 长度 | 19.175 mm | 21.34 mm (Max) | 19.175 mm | 10.3 mm | - | - | - | 10.3 mm | 10.3 mm | 10.3 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 125 °C | - | 125 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | SOP | DIP | - | DIP | SOP | SOP | SOP |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | SOP16,.4 | - | - | DIP16,.3 | SOP16,.4 | SOP16,.3 | SOP16,.4 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | SMALL OUTLINE | IN-LINE | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 245 | - | 245 | 260 | 260 | 260 |
| 电源 | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | - | - | 3.3/5 V | 3.3/5 V | +-5 V | 3.3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | - | 4.572 mm | 2.65 mm | 5.08 mm | - | 5.08 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 最大供电电流 (Isup) | 0.3 mA | - | 7 mA | 0.3 mA | - | - | 0.3 mA | 7 mA | - | 7 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | - | 3 V | 3 V | - | 3 V |
| 表面贴装 | NO | - | NO | YES | NO | - | NO | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | MILITARY | - | MILITARY | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.87 mm | 7.62 mm | 7.5 mm | 7.62 mm | - | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
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