2.5-A, 2-A, high-efficient buck-boost converter with optimized load step response in tiny WCSP 15-DSBGA -40 to 125
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DSBGA-15 |
Reach Compliance Code | compliant |
Factory Lead Time | 6 weeks |
Samacsys Confidence | 3 |
Samacsys Status | Released |
Samacsys PartID | 4652962 |
Samacsys Pin Count | 15 |
Samacsys Part Category | Integrated Circuit |
Samacsys Package Category | BGA |
Samacsys Footprint Name | YFF0015 |
Samacsys Released Date | 2019-11-28 07:10:45 |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 5.5 V |
最小输入电压 | 1.8 V |
标称输入电压 | 3.6 V |
JESD-30 代码 | R-PBGA-B15 |
JESD-609代码 | e1 |
长度 | 2.255 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 15 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
最大输出电流 | 6.25 A |
最大输出电压 | 5.2 V |
最小输出电压 | 1.8 V |
标称输出电压 | 3.3 V |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA15,3X5,16 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
座面最大高度 | 0.625 mm |
标称供电电压 (Vsup) | 3.6 V |
表面贴装 | YES |
切换器配置 | BUCK-BOOST |
最大切换频率 | 2100 kHz |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.4 mm |
端子位置 | BOTTOM |
宽度 | 1.344 mm |
Base Number Matches | 1 |
TPS63806YFFR | TPS63805 | TPS63805YFFR | TPS63805YFFT | TPS63806 | |
---|---|---|---|---|---|
描述 | 2.5-A, 2-A, high-efficient buck-boost converter with optimized load step response in tiny WCSP 15-DSBGA -40 to 125 | 2-A, high-efficient, low quiescent current buck-boost converter with tiny solution size 15-DSBGA -40 to 125 | 2-A, high-efficient, low quiescent current buck-boost converter with tiny solution size 15-DSBGA -40 to 125 | 2-A, high-efficient, low quiescent current buck-boost converter with tiny solution size 15-DSBGA -40 to 125 | 2.5-A, 2-A, high-efficient buck-boost converter with optimized load step response in tiny WCSP 15-DSBGA -40 to 125 |
Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | - |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | - |
是否Rohs认证 | 符合 | - | 符合 | 符合 | - |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
包装说明 | DSBGA-15 | - | DSBGA-15 | BGA-15 | - |
Reach Compliance Code | compliant | - | compliant | compliant | - |
Factory Lead Time | 6 weeks | - | 6 weeks | 6 weeks | - |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR | - | SWITCHING REGULATOR | SWITCHING REGULATOR | - |
控制模式 | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE | - |
控制技术 | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - |
最大输入电压 | 5.5 V | - | 5.5 V | 5.5 V | - |
最小输入电压 | 1.8 V | - | 1.3 V | 1.3 V | - |
标称输入电压 | 3.6 V | - | 3.6 V | 3.6 V | - |
JESD-30 代码 | R-PBGA-B15 | - | R-XBGA-B15 | R-PBGA-B15 | - |
JESD-609代码 | e1 | - | e1 | e1 | - |
长度 | 2.255 mm | - | 2.255 mm | 2.255 mm | - |
湿度敏感等级 | 1 | - | 1 | 1 | - |
功能数量 | 1 | - | 1 | 1 | - |
端子数量 | 15 | - | 15 | 15 | - |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | - |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - |
最大输出电流 | 6.25 A | - | 5.75 A | 2 A | - |
最大输出电压 | 5.2 V | - | 5.2 V | 5.2 V | - |
最小输出电压 | 1.8 V | - | 1.8 V | 1.8 V | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | VFBGA | - | VFBGA | VFBGA | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
座面最大高度 | 0.625 mm | - | 0.625 mm | 0.625 mm | - |
表面贴装 | YES | - | YES | YES | - |
切换器配置 | BUCK-BOOST | - | BUCK-BOOST | BUCK-BOOST | - |
最大切换频率 | 2100 kHz | - | 2100 kHz | 2100 kHz | - |
温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | - |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
端子形式 | BALL | - | BALL | BALL | - |
端子节距 | 0.4 mm | - | 0.4 mm | 0.4 mm | - |
端子位置 | BOTTOM | - | BOTTOM | BOTTOM | - |
宽度 | 1.344 mm | - | 1.344 mm | 1.344 mm | - |
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