USB-C/PD 20V sink & 5V source power switch with 3.3V dead battery LDO 28-DSBGA -10 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | BGA, |
| Reach Compliance Code | compliant |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PBGA-B28 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.85 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | OTHER |
| 端子形式 | BALL |
| 端子位置 | BOTTOM |
| PTPS66020A0YBGR | PTPS66021A0YBGR | TPS66020 | TPS66021 | TPS66020YBGR | TPS66021YBGR | |
|---|---|---|---|---|---|---|
| 描述 | USB-C/PD 20V sink & 5V source power switch with 3.3V dead battery LDO 28-DSBGA -10 to 85 | USB-C/PD 20V sink & 5V source power switch with 5V dead battery LDO 28-DSBGA -10 to 85 | USB-C/PD 20V sink & 5V source power switch with 3.3V dead battery LDO 28-DSBGA -10 to 85 | USB-C/PD 20V sink & 5V source power switch with 5V dead battery LDO 28-DSBGA -10 to 85 | USB-C/PD 20V sink & 5V source power switch with 3.3V dead battery LDO 28-DSBGA -10 to 85 | USB-C/PD 20V sink & 5V source power switch with 5V dead battery LDO 28-DSBGA -10 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | - | - | Texas Instruments | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | BGA, | BGA, | - | - | BGA, | DSBGA-28 |
| Reach Compliance Code | compliant | compliant | - | - | compliant | compliant |
| 可调阈值 | YES | YES | - | - | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PBGA-B28 | R-PBGA-B28 | - | - | R-PBGA-B28 | R-PBGA-B28 |
| 信道数量 | 1 | 1 | - | - | 1 | 1 |
| 功能数量 | 1 | 1 | - | - | 1 | 1 |
| 端子数量 | 28 | 28 | - | - | 28 | 28 |
| 最高工作温度 | 85 °C | 85 °C | - | - | 85 °C | 85 °C |
| 最低工作温度 | -10 °C | -10 °C | - | - | -10 °C | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | - | - | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | - | - | GRID ARRAY | GRID ARRAY |
| 最大供电电压 (Vsup) | 3.6 V | 5.5 V | - | - | 3.6 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.85 V | 4.5 V | - | - | 2.85 V | 4.5 V |
| 标称供电电压 (Vsup) | 3.3 V | 5 V | - | - | 3.3 V | 5 V |
| 表面贴装 | YES | YES | - | - | YES | YES |
| 温度等级 | OTHER | OTHER | - | - | OTHER | OTHER |
| 端子形式 | BALL | BALL | - | - | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | - | - | BOTTOM | BOTTOM |
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