3.3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | HLSSOP, |
Reach Compliance Code | compliant |
Factory Lead Time | 6 weeks |
Samacsys Description | 3.3V low-drift low-power small-footprint Enhanced Plastic series voltage reference |
模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE |
JESD-30 代码 | R-PDSO-G6 |
长度 | 2.9 mm |
湿度敏感等级 | 2 |
功能数量 | 1 |
输出次数 | 1 |
端子数量 | 6 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最大输出电压 | 3.30165 V |
最小输出电压 | 3.29835 V |
标称输出电压 | 3.3 V |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HLSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
座面最大高度 | 1.45 mm |
最大供电电压 (Vsup) | 12 V |
最小供电电压 (Vsup) | 3.35 V |
表面贴装 | YES |
技术 | CMOS |
最大电压温度系数 | 6 ppm/°C |
温度等级 | MILITARY |
端子形式 | GULL WING |
端子节距 | 0.95 mm |
端子位置 | DUAL |
微调/可调输出 | NO |
宽度 | 1.6 mm |
REF3433MDBVTEP | REF3430-EP | REF3430MDBVTEP | REF3433-EP | V62/18622-03XE | V62/18622-04XE | |
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描述 | 3.3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125 | 3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125 | 3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125 | 3.3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125 | 3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125 | 3.3V low-drift low-power small-footprint Enhanced Plastic series voltage reference 6-SOT-23 -55 to 125 |
Brand Name | Texas Instruments | - | Texas Instruments | - | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | - | 符合 | - | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | HLSSOP, | - | HLSSOP, | - | HLSSOP, | HLSSOP, |
Reach Compliance Code | compliant | - | compliant | - | compliant | compliant |
模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE | - | THREE TERMINAL VOLTAGE REFERENCE | - | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE |
JESD-30 代码 | R-PDSO-G6 | - | R-PDSO-G6 | - | R-PDSO-G6 | R-PDSO-G6 |
长度 | 2.9 mm | - | 2.9 mm | - | 2.9 mm | 2.9 mm |
湿度敏感等级 | 2 | - | 2 | - | 2 | 2 |
功能数量 | 1 | - | 1 | - | 1 | 1 |
输出次数 | 1 | - | 1 | - | 1 | 1 |
端子数量 | 6 | - | 6 | - | 6 | 6 |
最高工作温度 | 125 °C | - | 125 °C | - | 125 °C | 125 °C |
最低工作温度 | -55 °C | - | -55 °C | - | -55 °C | -55 °C |
最大输出电压 | 3.30165 V | - | 3.0015 V | - | 3.0015 V | 3.30165 V |
最小输出电压 | 3.29835 V | - | 2.9985 V | - | 2.9985 V | 3.29835 V |
标称输出电压 | 3.3 V | - | 3 V | - | 3 V | 3.3 V |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HLSSOP | - | HLSSOP | - | HLSSOP | HLSSOP |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
座面最大高度 | 1.45 mm | - | 1.45 mm | - | 1.45 mm | 1.45 mm |
最大供电电压 (Vsup) | 12 V | - | 12 V | - | 12 V | 12 V |
最小供电电压 (Vsup) | 3.35 V | - | 3.05 V | - | 3.05 V | 3.35 V |
表面贴装 | YES | - | YES | - | YES | YES |
技术 | CMOS | - | CMOS | - | CMOS | CMOS |
最大电压温度系数 | 6 ppm/°C | - | 6 ppm/°C | - | 6 ppm/°C | 6 ppm/°C |
温度等级 | MILITARY | - | MILITARY | - | MILITARY | MILITARY |
端子形式 | GULL WING | - | GULL WING | - | GULL WING | GULL WING |
端子节距 | 0.95 mm | - | 0.95 mm | - | 0.95 mm | 0.95 mm |
端子位置 | DUAL | - | DUAL | - | DUAL | DUAL |
微调/可调输出 | NO | - | NO | - | NO | NO |
宽度 | 1.6 mm | - | 1.6 mm | - | 1.6 mm | 1.6 mm |
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