Consumer Circuit, PDIP52, SHRINK, PLASTIC, DIP-52
| 参数名称 | 属性值 |
| 厂商名称 | TDK(株式会社) |
| 零件包装代码 | DIP |
| 包装说明 | , |
| 针数 | 52 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 商用集成电路类型 | CONSUMER CIRCUIT |
| JESD-30 代码 | R-PDIP-T52 |
| 端子数量 | 52 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MSP3430GPO | MSP3430GFH | MSP3430GPP | MSP3430GPS | PHR0603Y2943LBTD | |
|---|---|---|---|---|---|
| 描述 | Consumer Circuit, PDIP52, SHRINK, PLASTIC, DIP-52 | Consumer Circuit, CMOS, PQFP64, PLASTIC, LQFP-64 | Consumer Circuit, CMOS, PDIP64, SHRINK, PLASTIC, DIP-64 | Consumer Circuit, CMOS, PQCC68, PLASTIC, LCC-68 | Fixed Resistor, Thin Film, 0.1W, 294000ohm, 35V, 0.01% +/-Tol, 10ppm/Cel, Surface Mount, 0603, CHIP |
| 包装说明 | , | LFQFP, | SDIP, | QCCJ, | CHIP |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 端子数量 | 52 | 64 | 64 | 68 | 2 |
| 封装形式 | IN-LINE | FLATPACK, LOW PROFILE, FINE PITCH | IN-LINE, SHRINK PITCH | CHIP CARRIER | SMT |
| 表面贴装 | NO | YES | NO | YES | YES |
| 厂商名称 | TDK(株式会社) | TDK(株式会社) | TDK(株式会社) | TDK(株式会社) | - |
| 零件包装代码 | DIP | QFP | DIP | LCC | - |
| 针数 | 52 | 64 | 64 | 68 | - |
| Is Samacsys | N | N | N | N | - |
| 商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | - |
| JESD-30 代码 | R-PDIP-T52 | S-PQFP-G64 | R-PDIP-T64 | S-PQCC-J68 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND | - |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 是否Rohs认证 | - | 符合 | - | 符合 | 不符合 |
| 其他特性 | - | ALSO REQUIRES 8V SUPPLY | ALSO REQUIRES 8V SUPPLY | ALSO REQUIRES 8V SUPPLY | HIGH PRECISION |
| JESD-609代码 | - | e3 | - | e3 | e0 |
| 长度 | - | 10 mm | 57.7 mm | 24.2062 mm | - |
| 功能数量 | - | 1 | 1 | 1 | - |
| 最高工作温度 | - | 65 °C | 70 °C | 70 °C | 155 °C |
| 封装代码 | - | LFQFP | SDIP | QCCJ | - |
| 座面最大高度 | - | 1.6 mm | 4.9 mm | 4.9 mm | - |
| 最大压摆率 | - | 102 mA | 102 mA | 102 mA | - |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.25 V | 5.25 V | - |
| 最小供电电压 (Vsup) | - | 4.75 V | 4.75 V | 4.75 V | - |
| 技术 | - | CMOS | CMOS | CMOS | THIN FILM |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | - | MATTE TIN | - | MATTE TIN | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
| 端子节距 | - | 0.5 mm | 1.778 mm | 1.27 mm | - |
| 宽度 | - | 10 mm | 19.05 mm | 24.2062 mm | - |
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