IC EEPROM 8K I2C 1MHZ 4WLCSP
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | WLCSP-4 |
Reach Compliance Code | compliant |
最大时钟频率 (fCLK) | 1 MHz |
JESD-30 代码 | S-PBGA-B4 |
内存密度 | 8192 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 4 |
字数 | 1024 words |
字数代码 | 1000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 1KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
座面最大高度 | 0.355 mm |
串行总线类型 | I2C |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 0.4 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
最长写入周期时间 (tWC) | 5 ms |
AT24C08D-UUM0B-T | AT24C08D-PUM | AT24C08D-XHM-T | AT24C08D-MAHM-T | AT24C08D-CUM-T | AT24C08D-UUM0B-T-894 | AT24C08D-SSHM-B | AT24C08D-STUM-T | AT24C08D-UUM1B-T | AT24C08D-SSHM-T | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | IC EEPROM 8K I2C 1MHZ 4WLCSP | EEPROM SEEPROM, 8K, 2W - 1.7-3.6V, 1MHz, Ind Tmp, 8-PDIP | IC EEPROM 8K I2C 1MHZ 8TSSOP | IC EEPROM 8K I2C 1MHZ 8UDFN | IC EEPROM 8K I2C 1MHZ 8VFBGA | IC EEPROM 8K I2C 1MHZ 4WLCSP | IC EEPROM 8K I2C 1MHZ 8SOIC | IC EEPROM 8K I2C 1MHZ SOT23-5 | IC EEPROM 8K I2C 1MHZ 4WLCSP | 存储器接口类型:I2C 存储器容量:8Kb (1K x 8) 工作电压:1.7V ~ 3.6V 存储器类型:Non-Volatile 8Kbit,I2C,1.7V to 3.6V,超低活动电流<1mA,静态电流<0.8uA |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | EEPROM | CMOS | CMOS | CMOS | CMOS |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | WLCSP-4 | DIP-8 | TSSOP-8 | UDFN-8 | VFBGA-8 | - | SOIC-8 | SOT-23, 5 PIN | WLCSP-4 | SOIC-8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | - | compliant | compliant | compliant | compliant |
最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | - | 1 MHz | 1 MHz | 0.4 MHz | 1 MHz |
JESD-30 代码 | S-PBGA-B4 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-N8 | R-PBGA-B8 | - | R-PDSO-G8 | R-PDSO-G5 | X-PBGA-B4 | R-PDSO-G8 |
内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | - | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 4 | 8 | 8 | 8 | 8 | - | 8 | 5 | 4 | 8 |
字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | - | 1024 words | 1024 words | 1024 words | 1024 words |
字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | - | 1000 | 1000 | 1000 | 1000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | - | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VFBGA | DIP | TSSOP | HVSON | VFBGA | - | SOP | VSSOP | VFBGA | SOP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | 260 | 260 | NOT SPECIFIED | - | 260 | 260 | NOT SPECIFIED | 260 |
座面最大高度 | 0.355 mm | 5.334 mm | 1.2 mm | 0.6 mm | 0.85 mm | - | 1.75 mm | 1 mm | 0.33 mm | 1.75 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | - | I2C | I2C | I2C | I2C |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | NO | YES | YES | YES | - | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | THROUGH-HOLE | GULL WING | NO LEAD | BALL | - | GULL WING | GULL WING | BALL | GULL WING |
端子节距 | 0.4 mm | 2.54 mm | 0.65 mm | 0.5 mm | 0.5 mm | - | 1.27 mm | 0.95 mm | 0.4 mm | 1.27 mm |
端子位置 | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | - | DUAL | DUAL | BOTTOM | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | 40 | 40 | NOT SPECIFIED | - | 40 | 40 | NOT SPECIFIED | 40 |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms | 5 ms |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
Factory Lead Time | - | 7 weeks | 7 weeks | 7 weeks | - | - | 7 weeks | 14 weeks | - | 6 weeks |
JESD-609代码 | - | e3 | e4 | e4 | - | - | e4 | e3 | - | e4 |
长度 | - | 9.271 mm | 4.4 mm | 3 mm | 2 mm | - | 4.925 mm | 2.9 mm | - | 4.925 mm |
端子面层 | - | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
宽度 | - | 7.62 mm | 3 mm | 2 mm | 1.5 mm | - | 3.9 mm | 1.6 mm | - | 3.9 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved