Fast Recovery Rectifier Diode
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DO-5 |
| 包装说明 | DO-5, 1 PIN |
| 针数 | 1 |
| 制造商包装代码 | CASE E 10 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 其他特性 | LEAKAGE CURRENT IS TYPICAL |
| 应用 | FAST SOFT RECOVERY |
| 外壳连接 | CATHODE |
| 配置 | SINGLE |
| 二极管元件材料 | SILICON |
| 二极管类型 | RECTIFIER DIODE |
| 最大正向电压 (VF) | 1.8 V |
| JEDEC-95代码 | DO-203AB |
| JESD-30 代码 | O-MUPM-D1 |
| JESD-609代码 | e2 |
| 最大非重复峰值正向电流 | 670 A |
| 元件数量 | 1 |
| 相数 | 1 |
| 端子数量 | 1 |
| 最高工作温度 | 150 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 17 A |
| 封装主体材料 | METAL |
| 封装形状 | ROUND |
| 封装形式 | POST/STUD MOUNT |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大重复峰值反向电压 | 1000 V |
| 最大反向电流 | 400 µA |
| 最大反向恢复时间 | 0.6 µs |
| 表面贴装 | NO |
| 端子面层 | Tin/Silver (Sn/Ag) |
| 端子形式 | SOLDER LUG |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| SKR2F50/10UNF | SKR2F50 | SKR2F50/04 | SKR2F50/06 | SKR2F50/08 | SKR2F50/10 | SKR2F50/08UNF | SKR2F50/06UNF | SKR2F50/04UNF | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode | Fast Recovery Rectifier Diode |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DO-5 | - | DO-5 | DO-5 | DO-5 | DO-5 | DO-5 | DO-5 | DO-5 |
| 包装说明 | DO-5, 1 PIN | - | DO-5, 1 PIN | DO-5, 1 PIN | DO-5, 1 PIN | DO-5, 1 PIN | DO-5, 1 PIN | DO-5, 1 PIN | DO-5, 1 PIN |
| 针数 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 制造商包装代码 | CASE E 10 | - | CASE E 10 | CASE E 10 | CASE E 10 | CASE E 10 | CASE E 10 | CASE E 10 | CASE E 10 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | LEAKAGE CURRENT IS TYPICAL | - | LEAKAGE CURRENT IS TYPICAL | LEAKAGE CURRENT IS TYPICAL | LEAKAGE CURRENT IS TYPICAL | LEAKAGE CURRENT IS TYPICAL | LEAKAGE CURRENT IS TYPICAL | LEAKAGE CURRENT IS TYPICAL | LEAKAGE CURRENT IS TYPICAL |
| 应用 | FAST SOFT RECOVERY | - | FAST SOFT RECOVERY | FAST SOFT RECOVERY | FAST SOFT RECOVERY | FAST SOFT RECOVERY | FAST SOFT RECOVERY | FAST SOFT RECOVERY | FAST SOFT RECOVERY |
| 外壳连接 | CATHODE | - | CATHODE | CATHODE | CATHODE | CATHODE | CATHODE | CATHODE | CATHODE |
| 配置 | SINGLE | - | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 二极管元件材料 | SILICON | - | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| 二极管类型 | RECTIFIER DIODE | - | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| 最大正向电压 (VF) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| JEDEC-95代码 | DO-203AB | - | DO-203AB | DO-203AB | DO-203AB | DO-203AB | DO-203AB | DO-203AB | DO-203AB |
| JESD-30 代码 | O-MUPM-D1 | - | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 | O-MUPM-D1 |
| JESD-609代码 | e2 | - | e2 | e2 | e2 | e2 | e2 | e2 | e2 |
| 最大非重复峰值正向电流 | 670 A | - | 670 A | 670 A | 670 A | 670 A | 670 A | 670 A | 670 A |
| 元件数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 相数 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 150 °C | - | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 | 17 A | - | 17 A | 17 A | 17 A | 17 A | 17 A | 17 A | 17 A |
| 封装主体材料 | METAL | - | METAL | METAL | METAL | METAL | METAL | METAL | METAL |
| 封装形状 | ROUND | - | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | POST/STUD MOUNT | - | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大重复峰值反向电压 | 1000 V | - | 400 V | 600 V | 800 V | 1000 V | 800 V | 600 V | 400 V |
| 最大反向电流 | 400 µA | - | 400 µA | 400 µA | 400 µA | 400 µA | 400 µA | 400 µA | 400 µA |
| 最大反向恢复时间 | 0.6 µs | - | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs |
| 表面贴装 | NO | - | NO | NO | NO | NO | NO | NO | NO |
| 端子面层 | Tin/Silver (Sn/Ag) | - | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) |
| 端子形式 | SOLDER LUG | - | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG |
| 端子位置 | UPPER | - | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
WindowsCE
FPGA/CPLD
模拟电子
DSP 与 ARM 处理器
FPGA/CPLD
单片机
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
