IC FLASH 256M PARALLEL 64EASYBGA
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | TBGA, BGA64,8X8,40 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 95 ns |
| 其他特性 | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE |
| 启动块 | BOTTOM |
| 命令用户界面 | YES |
| 通用闪存接口 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PBGA-B64 |
| JESD-609代码 | e1 |
| 长度 | 13 mm |
| 内存密度 | 268435456 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 部门数/规模 | 4,255 |
| 端子数量 | 64 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TBGA |
| 封装等效代码 | BGA64,8X8,40 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2.5/3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 部门规模 | 16K,64K |
| 最大待机电流 | 0.00021 A |
| 最大压摆率 | 0.031 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | NO |
| 类型 | NOR TYPE |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| PC28F256P33BFE | PC48F4400P0TB0EE | PC48F4400P0TB0EH | JS28F256P33BFE | JS28F256P33TFE | PC28F256P33BFR | PC28F256P33TFE | RC28F256P33BFE | RC28F256P33TFE | PC28F256P33BFF TR | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC FLASH 256M PARALLEL 64EASYBGA | IC FLASH 512M PARALLEL 64EASYBGA | IC FLASH 512M PARALLEL 64EASYBGA | IC FLASH 256M PARALLEL 56TSOP | IC FLASH 256M PARALLEL 56TSOP | IC FLASH 256M PARALLEL 64EASYBGA | IC FLASH 256M PARALLEL 64EASYBGA | IC FLASH 256M PARALLEL 64EASYBGA | IC FLASH 256M PARALLEL 64EASYBGA | IC FLASH 256M PARALLEL 64EASYBGA |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | FLASH - NOR |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 | - |
| 包装说明 | TBGA, BGA64,8X8,40 | TBGA, | TBGA, | TSSOP, TSSOP56,.8,20 | TSSOP, TSSOP56,.8,20 | TBGA, BGA64,8X8,40 | TBGA, BGA64,8X8,40 | BGA-64 | BGA-64 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | not_compliant | unknown | - |
| 最长访问时间 | 95 ns | 95 ns | 95 ns | 105 ns | 105 ns | 95 ns | 95 ns | 95 ns | 95 ns | - |
| 其他特性 | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE | - |
| 启动块 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | TOP | BOTTOM | TOP | BOTTOM | TOP | - |
| 命令用户界面 | YES | - | - | YES | YES | YES | YES | YES | YES | - |
| 通用闪存接口 | YES | - | - | YES | YES | YES | YES | YES | YES | - |
| 数据轮询 | NO | - | - | NO | NO | NO | NO | NO | NO | - |
| JESD-30 代码 | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | R-PDSO-G56 | R-PDSO-G56 | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | - |
| JESD-609代码 | e1 | e1 | e1 | e3 | e3 | e1 | e1 | e1 | e1 | - |
| 长度 | 13 mm | 13 mm | 13 mm | 18.4 mm | 18.4 mm | 13 mm | 13 mm | 13 mm | 13 mm | - |
| 内存密度 | 268435456 bit | 536870912 bit | 536870912 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | - |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | - |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 部门数/规模 | 4,255 | - | - | 4,255 | 4,255 | 4,255 | 4,255 | 4,255 | 4,255 | - |
| 端子数量 | 64 | 64 | 64 | 56 | 56 | 64 | 64 | 64 | 64 | - |
| 字数 | 16777216 words | 33554432 words | 33554432 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | - |
| 字数代码 | 16000000 | 32000000 | 32000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 16MX16 | 32MX16 | 32MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TBGA | TBGA | TBGA | TSSOP | TSSOP | TBGA | TBGA | TBGA | TBGA | - |
| 封装等效代码 | BGA64,8X8,40 | - | - | TSSOP56,.8,20 | TSSOP56,.8,20 | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | - |
| 电源 | 2.5/3.3 V | - | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - |
| 编程电压 | 3 V | 3 V | 3 V | 2.7 V | 3 V | 3 V | 3 V | 2.7 V | 3 V | - |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - |
| 部门规模 | 16K,64K | - | - | 16K,64K | 16K,64K | 16K,64K | 16K,64K | 16K,64K | 16K,64K | - |
| 最大待机电流 | 0.00021 A | - | - | 0.00021 A | 0.00021 A | 0.00021 A | 0.00021 A | 0.00021 A | 0.00021 A | - |
| 最大压摆率 | 0.031 mA | - | - | 0.031 mA | 0.031 mA | 0.031 mA | 0.031 mA | 0.031 mA | 0.031 mA | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Matte Tin (Sn) | TIN SILVER COPPER | Tin/Silver/Copper (Sn/Ag/Cu) | TIN SILVER COPPER | TIN SILVER COPPER | - |
| 端子形式 | BALL | BALL | BALL | GULL WING | GULL WING | BALL | BALL | BALL | BALL | - |
| 端子节距 | 1 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm | 1 mm | 1 mm | 1 mm | 1 mm | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | - |
| 切换位 | NO | - | - | NO | NO | NO | NO | NO | NO | - |
| 类型 | NOR TYPE | - | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - |
| 宽度 | 10 mm | 10 mm | 10 mm | 14 mm | 14 mm | 10 mm | 10 mm | 10 mm | 10 mm | - |
| 厂商名称 | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | - | Micron Technology | - | Micron Technology | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
