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AS8F512K32Q-120/XT

产品描述Flash Module, 512KX32, 120ns, CQFP68, CERAMIC, QFP-68
产品类别存储   
文件大小442KB,共22页
制造商Micross
官网地址https://www.micross.com
下载文档 详细参数 选型对比 全文预览

AS8F512K32Q-120/XT概述

Flash Module, 512KX32, 120ns, CQFP68, CERAMIC, QFP-68

AS8F512K32Q-120/XT规格参数

参数名称属性值
厂商名称Micross
零件包装代码QFP
包装说明QFP, QFP68,.99SQ,50
针数68
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
Is SamacsysN
最长访问时间120 ns
其他特性USER CONFIGURABLE AS 2M X 8
备用内存宽度16
数据轮询YES
JESD-30 代码S-CQFP-G68
长度22.352 mm
内存密度16777216 bit
内存集成电路类型FLASH MODULE
内存宽度32
功能数量1
部门数/规模32
端子数量68
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织512KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QFP
封装等效代码QFP68,.99SQ,50
封装形状SQUARE
封装形式FLATPACK
并行/串行PARALLEL
电源5 V
编程电压5 V
认证状态Not Qualified
座面最大高度5.08 mm
部门规模16K
最大待机电流0.0065 A
最大压摆率0.24 mA
最大供电电压 (Vsup)5.25 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式GULL WING
端子节距1.27 mm
端子位置QUAD
切换位YES
类型NOR TYPE
宽度22.352 mm
Base Number Matches1

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FLASH
Austin Semiconductor, Inc.
512K x 32 FLASH
FLASH MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
SMD 5962-94612
MIL-STD-883
Fast Access Times: 70, 90, 120 and 150ns
Operation with single 5V (±10%)
Theta JC= 1.00°
C
/w
User configurable as 512Kx32, 1Mx16, or 2Mx8
Eight Equal Sectors of 64K Bytes for each 512Kx8
Compatible with JEDEC EEPROM command set
Any Combination of Sectors can be Erased
Supports Full Chip Erase
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built in decoupling caps for low noise operation
Suspend Erase/Resume Function
Individual Byte Read/ Write Control
10,000 Program/Erase Cycles
AS8F512K32
PIN ASSIGNMENT
(Top View)
68 Lead CQFP (Q)
FEATURES
66 Lead PGA (P)
OPTIONS
Timing
70ns
90ns
120ns
150ns
Package
Ceramic Quad Flat pack
Pin Grid Array
MARKINGS
-70
-90
-120
-150
Q
P
No. 702
No. 904
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8F512K32 is a 16 Megabit
CMOS FLASH Memory Module organized as 512Kx32 bits. The
AS8F512K32 achieves high speed access (70 to 150 ns), low power
consumption and high reliability by employing advanced CMOS memory
technology.
An on-chip state machine controls the program and erase func-
tions. The embedded byte-program and sector/chip erase functions are
fully automatic. Data-protection of any sector combination is accom-
plished using a hardware sector-protection feature.
The
Erase/Resume function
allows the sector erase operation to
read data from, or program to a non-erasing sector, then resume the
erase operation.
Device operations are selected by using standard commands into
the command register using standard microprocessor write timings. The
command register acts as an input to an internal state machine that
interprets the commands, controls the erase and programming opera-
tions, outputs the status of the device, and outputs data stored in the
device. On initial power-up operation, the device defaults to the read
mode.
AS8F512K32
Rev. 4.0 6/01
For more products and information
please visit our web site at
www.austinsemiconductor.com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1

AS8F512K32Q-120/XT相似产品对比

AS8F512K32Q-120/XT AS8F512K32Q-150/CT AS8F512K32Q-150/XT AS8F512K32Q-150/IT AS8F512K32P-90/IT AS8F512K32P-70/IT AS8F512K32P-70/XT AS8F512K32P-150/IT
描述 Flash Module, 512KX32, 120ns, CQFP68, CERAMIC, QFP-68 Flash Module, 512KX32, 150ns, CQFP68, CERAMIC, QFP-68 Flash Module, 512KX32, 150ns, CQFP68, CERAMIC, QFP-68 Flash Module, 512KX32, 150ns, CQFP68, CERAMIC, QFP-68 Flash Module, 512KX32, 90ns, CPGA66, PGA-66 Flash Module, 512KX32, 70ns, CPGA66, PGA-66 Flash Module, 512KX32, 70ns, CPGA66, PGA-66 Flash Module, 512KX32, 150ns, CPGA66, PGA-66
零件包装代码 QFP QFP QFP QFP PGA PGA PGA PGA
包装说明 QFP, QFP68,.99SQ,50 QFP, QFP68,.99SQ,50 QFP, QFP68,.99SQ,50 QFP, QFP68,.99SQ,50 PGA, PGA66,11X11 PGA, PGA66,11X11 PGA, PGA66,11X11 PGA, PGA66,11X11
针数 68 68 68 68 66 66 66 66
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A001.A.2.C EAR99 3A001.A.2.C EAR99 EAR99 EAR99 3A001.A.2.C EAR99
最长访问时间 120 ns 150 ns 150 ns 150 ns 90 ns 70 ns 70 ns 150 ns
其他特性 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8 USER CONFIGURABLE AS 2M X 8
备用内存宽度 16 16 16 16 16 16 16 16
数据轮询 YES YES YES YES YES YES YES YES
JESD-30 代码 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CPGA-P66 S-CPGA-P66 S-CPGA-P66 S-CPGA-P66
长度 22.352 mm 22.352 mm 22.352 mm 22.352 mm 27.305 mm 27.305 mm 27.305 mm 27.305 mm
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE
内存宽度 32 32 32 32 32 32 32 32
功能数量 1 1 1 1 1 1 1 1
部门数/规模 32 32 32 32 32 32 32 32
端子数量 68 68 68 68 66 66 66 66
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 70 °C 125 °C 85 °C 85 °C 85 °C 125 °C 85 °C
最低工作温度 -55 °C - -55 °C -40 °C -40 °C -40 °C -55 °C -40 °C
组织 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QFP QFP QFP QFP PGA PGA PGA PGA
封装等效代码 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 PGA66,11X11 PGA66,11X11 PGA66,11X11 PGA66,11X11
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
编程电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 5.08 mm 5.08 mm 5.08 mm 4.953 mm 4.953 mm 4.953 mm 4.953 mm
部门规模 16K 16K 16K 16K 16K 16K 16K 16K
最大待机电流 0.0065 A 0.0065 A 0.0065 A 0.0065 A 0.0065 A 0.0065 A 0.0065 A 0.0065 A
最大压摆率 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA
最大供电电压 (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY COMMERCIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING PIN/PEG PIN/PEG PIN/PEG PIN/PEG
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 QUAD QUAD QUAD QUAD PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
切换位 YES YES YES YES YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 22.352 mm 22.352 mm 22.352 mm 22.352 mm 27.305 mm 27.305 mm 27.305 mm 27.305 mm
厂商名称 Micross - - - Micross Micross Micross Micross
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