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1-5-470

产品描述TAPE ELECTROPLATING TAN 1"X 5YDS
产品类别配件   
文件大小21KB,共2页
制造商3M
官网地址http://3M.com/esd
标准
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1-5-470概述

TAPE ELECTROPLATING TAN 1"X 5YDS

1-5-470规格参数

参数名称属性值
胶带类型电镀
粘合剂橡胶
底布,载体乙烯基
厚度0.0071"(7.1 mils,0.180mm)
厚度 - 粘合剂0.0008"(0.8 mils,0.021mm)
厚度 - 底布,载体0.0063"(6.3 mils,0.160mm)
宽度1.00"(25.40mm)
长度15'(4.6m)5 码
颜色褐色
使用遮蔽,保护,密封
温度范围170°F(77°C)
保质期起始日期制造日期
保质期18 个月

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Electroplating Tape
470
470L
Technical Data
February, 2011
Product Description
3M™ Electroplating Tape 470 is a conformable and abrasion-resistant vinyl tape
with excellent resistance to most chemicals used in typical electroplating processes.
3M™ Electroplating Tape 470L is a linered version of 3M vinyl tape 470 that may
be used for die-cutting or large area applications.
Product Construction
Backing
Pigmented
vinyl
Adhesive
Rubber
Liner
Tape 470 - none
Tape 470L - white paper
Color
Tan
Standard
Roll Length
36 yds. (33 m)
Typical Physical
Properties
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
ASTM Test Method
Adhesion to Steel:
Tensile Strength at Break:
Elongation at Break:
Backing Thickness:
Total Tape Thickness
(without liner)
:
Liner Thickness:
Temperature Use Range:
37 oz./in. width (40.4 N/100 mm)
20 lbs./in. width (350 N/100 mm)
180%
6.3 mils (0.16 mm)
7.1 mils (0.18 mm)
6.1 mils (0.15 mm)
Up to 250°F (121°C)
D-3330
D-3759
D-3759
D-3652
D-3652
D-3652
Features
• Excellent resistance to most chemicals used in typical electroplating operations.
• Prolonged exposure to elevated temperatures (above 250°F/121°C) and hot
caustics may cause weakening of the adhesive bond.
• Can be qualified to meet Federal Specification HH-T-0025 (GSA-FSS)
Ammendment 2.
• Resists most common solvents, care should be taken to avoid ketones, chlorinated
hydrocarbons, and esters, found in lacquer thinners, degreasers, paint strippers,
etc., which may cause the backing to swell or curl.
• Vinyl backing is conformable
• Backing accepts marker ink and is printable in using the thermal transfer process.

 
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