IC CTLR SYNC DUAL 24-SSOP
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, LCC24,.16SQ,20 |
| 针数 | 24 |
| 制造商包装代码 | GN |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 最大输入电压 | 9.8 V |
| 最小输入电压 | 2.75 V |
| 标称输入电压 | 4.2 V |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e3 |
| 长度 | 8.649 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 最大输出电流 | 1 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | LCC24,.16SQ,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.727 mm |
| 表面贴装 | YES |
| 切换器配置 | PUSH-PULL |
| 最大切换频率 | 825 kHz |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.899 mm |

| LTC3776EGN#PBF | DC829A | LTC3776EUF#PBF | LTC3776EUF#TRPBF | LTC3776EGN#TRPBF | |
|---|---|---|---|---|---|
| 描述 | IC CTLR SYNC DUAL 24-SSOP | board eval for ltc3776euf | IC CNTRLR SYNC DUAL 24-QFN | IC CNTRLR SYNC DUAL 24-QFN | IC CNTRLR SYNC DUAL 24-SSOP |
| Brand Name | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | SSOP | - | QFN | QFN | SSOP |
| 包装说明 | SSOP, LCC24,.16SQ,20 | - | HVQCCN, SSOP24,.24 | HVQCCN, LCC24,.16SQ,20 | SSOP, SSOP24,.24 |
| 针数 | 24 | - | 24 | 24 | 24 |
| 制造商包装代码 | GN | - | UF | UF | GN |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER | - | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 最大输入电压 | 9.8 V | - | 9.8 V | 9.8 V | 9.8 V |
| 最小输入电压 | 2.75 V | - | 2.75 V | 2.75 V | 2.75 V |
| 标称输入电压 | 4.2 V | - | 4.2 V | 4.2 V | 4.2 V |
| JESD-30 代码 | R-PDSO-G24 | - | S-PQCC-N24 | S-PQCC-N24 | R-PDSO-G24 |
| JESD-609代码 | e3 | - | e3 | e3 | e3 |
| 长度 | 8.649 mm | - | 4 mm | 4 mm | 8.649 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 24 | - | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 最大输出电流 | 1 A | - | 1 A | 1 A | 1 A |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | HVQCCN | HVQCCN | SSOP |
| 封装等效代码 | LCC24,.16SQ,20 | - | SSOP24,.24 | LCC24,.16SQ,20 | SSOP24,.24 |
| 封装形状 | RECTANGULAR | - | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 250 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.727 mm | - | 0.8 mm | 0.8 mm | 1.727 mm |
| 表面贴装 | YES | - | YES | YES | YES |
| 切换器配置 | PUSH-PULL | - | PUSH-PULL | PUSH-PULL | PUSH-PULL |
| 最大切换频率 | 825 kHz | - | 825 kHz | 825 kHz | 825 kHz |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.635 mm | - | 0.5 mm | 0.5 mm | 0.635 mm |
| 端子位置 | DUAL | - | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | NOT SPECIFIED |
| 宽度 | 3.899 mm | - | 4 mm | 4 mm | 3.899 mm |
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