IC ACCELERATOR I2C HOTSWAP 12DFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, |
| 针数 | 12 |
| 制造商包装代码 | DE/UE |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N12 |
| JESD-609代码 | e3 |
| 长度 | 4 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 12 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| LTC4309IDE#PBF | LTC4309IGN#PBF | LTC4309CDE#TRPBF | LTC4309CGN#TRPBF | LTC4309IDE#TRPBF | LTC4309IGN#TRPBF | LTC4309CDE#PBF | LTC4309CGN#PBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC ACCELERATOR I2C HOTSWAP 12DFN | IC ACCELERATR I2C HOTSWAP 16SSOP | IC ACCELERATOR I2C HOTSWAP 12DFN | IC ACCELERATR I2C HOTSWAP 16SSOP | IC ACCELERATOR I2C HOTSWAP 12DFN | IC ACCELERATR I2C HOTSWAP 16SSOP | IC ACCELERATOR I2C HOTSWAP 12DFN | IC ACCELERATR I2C HOTSWAP 16SSOP |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DFN | SSOP | DFN | SSOP | DFN | SSOP | DFN | SSOP |
| 包装说明 | HVSON, | SSOP, | HVSON, | SSOP, | HVSON, | SSOP, | HVSON, | SSOP, |
| 针数 | 12 | 16 | 12 | 16 | 12 | 16 | 12 | 16 |
| 制造商包装代码 | DE/UE | GN | DE/UE | GN | DE/UE | GN | DE/UE | GN |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N12 | R-PDSO-G16 | R-PDSO-N12 | R-PDSO-G16 | R-PDSO-N12 | R-PDSO-G16 | R-PDSO-N12 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4 mm | 4.8895 mm | 4 mm | 4.8895 mm | 4 mm | 4.8895 mm | 4 mm | 4.8895 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 12 | 16 | 12 | 16 | 12 | 16 | 12 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | SSOP | HVSON | SSOP | HVSON | SSOP | HVSON | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.75 mm | 0.8 mm | 1.75 mm | 0.8 mm | 1.75 mm | 0.8 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3 mm | 3.899 mm | 3 mm | 3.899 mm | 3 mm | 3.899 mm | 3 mm | 3.899 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
微控制器 MCU
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