TM
SMD2920 Surface Mount PTC Devices
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R.O.C. Patent#415624
The SMD2920 Series, a polymer-based Positive Temperature Coefficient (PTC) device to
protect electrical circuits against overcurrent conditions with resettable feature, is fully
compatible with current industrial standards.
The new designed SMD2920 Series provides surface mount overcurrent protection with
superior performance.
Application: The SMD2920 Series is ideal for computers and peripherals and can be applied to
almost anywhere there is a low voltage power supply and a load to be protected.
The solder plated termination is designed to meet or exceed solderability specifications and
provide excellent solder joint inspectability.
Agency Approval: UL File # E201431.
CSA File # CA115375-1
Maximum
Time To Trip
ELECTRICAL CHARACTERISTICS
Resistance
R
min
(Ω)
1.200
0.350
0.350
0.120
0.070
0.080
0.065
0.050
0.050
0.035
0.025
0.015
0.015
R
1max
(Ω)
4.800
1.400
1.000
0.410
0.250
0.230
0.150
0.125
0.125
0.085
0.075
0.048
0.048
I
hold
(A)
SMD2920P030TS
0.30
SMD2920P050TS
0.50
SMD2920P075TS
0.75
SMD2920P100TS
1.10
SMD2920P125TS
1.25
SMD2920P150TS
1.50
SMD2920P185TS
1.85
SMD2920P200TS
2.00
SMD2920P200TS/24 2.00
SMD2920P250TS
2.50
SMD2920P260TS
2.60
SMD2920P300TS
3.00
SMD2920P300TS/15 3.00
Part Number
I
trip
V
max
I
max
P
d max.
Current
(A) (Vdc) (A) (W)
(A)
0.60 60
10
1.5
1.50
1.00 60
10
1.5
2.50
1.50 30
40
1.5
8.00
2.20 33
40
1.5
8.00
2.50 15
40
1.5
8.00
3.00 33
40
1.5
8.00
3.70 33
40
1.5
8.00
4.00 15
40
1.5
8.00
4.00 24
40
1.5
8.00
5.00 15
40
1.5
8.00
5.20
6
40
1.5
8.00
6.00
6
40
1.5
8.00
6.00 15
40
1.5
8.00
Time
(Sec.)
3.00
4.00
0.30
0.50
2.00
2.00
2.50
5.00
5.00
10.00
10.00
20.00
20.00
Agency
Approval
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
UL CSA TÜV
Note:
I
hold
= Hold current: maximum current device will pass without tripping in 20℃ still air.
I
trip
= Trip current: minimum current at which the device will trip in 20℃ still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20℃ still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 20℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
◎Specifications
are subject to change without notice.
107
TM
SMD2920 Surface Mount PTC Devices
R.O.C. Patent#415624
How to Select a Polymer PTC fuse:
(1) Determine the following operating parameters for the circuits:
(A) Normal Operating Current (I hold)
(B) Maximum Circuit Voltage (V max)
(C) Maximum Interrupt Current (I max)
(D) Normal Operating Temperature (min℃/max℃)
(2) Select the device form factor and dimension suitable for the application:
Surface Mount Device (SMD Series)
Radial Leaded Device (RLD Series)
Axial Leaded Strap Device (STD Series)
Other Custom-designed Device (Disc/Chip)
(3) Compare the maximum ratings for V max and I max of the PTC device with
the circuit in application and make sure that the circuit’s requirement does
not exceed the device ratings.
(4) Check that the PTC device’s trip time (time-to-trip) will protect the circuit.
(5) Verify that the circuit operating temperatures are within the PTC device’s
normal operating temperature range.
(6) Verify the performance and suitability of the chosen PTC device in the
application.
108
TM
SMD2920 Surface Mount PTC Devices
R.O.C. Patent#415624
THERMAL DERATING CURVE FOR SMD2920 SERIES
200.00
P rc n g o R te C rre t
e e ta e f a d u n
150.00
100.00
50.00
0.00
-40.00
0.00
40.00
80.00
120.00
Device Ambient Temperature (
℃
)
THERMAL DERATING CHART FOR SMD2920 SERIES – Ihold (Amps)
Model
SMD2920P030TS
SMD2920P050TS
SMD2920P075TS
SMD2920P100TS
SMD2920P125TS
SMD2920P150TS
SMD2920P185TS
SMD2920P200TS
SMD2920P200TS/24
SMD2920P250TS
SMD2920P260TS
SMD2920P300TS
SMD2920P300TS/15
-40℃
0.45
0.76
1.13
1.66
1.89
2.27
2.80
3.02
3.02
3.78
3.64
4.53
4.53
-20℃
0.40
0.67
1.01
1.47
1.68
2.01
2.47
2.68
2.68
3.35
3.25
4.02
4.02
Ambient Operation Temperature
0℃
23℃
40℃
50℃
60℃
0.35
0.30
0.25
0.23
0.20
0.59
0.50
0.42
0.38
0.33
0.88
0.75
0.62
0.56
0.50
1.29
1.10
0.91
0.83
0.73
1.46
1.25
1.04
0.94
0.83
1.76
1.50
1.25
1.13
1.00
2.17
1.85
1.54
1.39
1.22
2.34
2.00
1.66
1.50
1.32
2.34
2.00
1.66
1.50
1.32
2.93
2.50
2.08
1.88
1.65
2.91
2.60
2.26
2.08
1.95
3.51
3.00
2.52
2.26
1.99
3.51
3.00
2.52
2.26
1.99
70℃
0.17
0.29
0.44
0.64
0.73
0.87
1.07
1.16
1.16
1.45
1.74
1.75
1.75
85℃
0.14
0.23
0.34
0.50
0.56
0.74
0.85
0.90
0.90
1.13
1.48
1.34
1.34
109
TM
SMD2920 Surface Mount PTC Devices
J
E
C
D
10.00
R.O.C. Patent#415624
AVERAGE TIME-CURRENT CURVE FOR SMD2920 SERIES
100.00
B
K
HI
G
F
A:SMD2920P030TS
B:SMD2920P050TS
C:SMD2920P075TS
D:SMD2920P100TS
E:SMD2920P150TS
F
:SMD2920P200TS
G
:SMD2920P125TS
H
:SMD2920P185TS
I
:SMD2920P250TS
J
:SMD2920P260TS
K
:SMD2920P300TS
A
Time to Trip (Sec.)
1.00
0.10
0.01
0.10
1.00
10.00
100.00
Fault Current (Amp.)
SOLDER REFLOW
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Recommended reflow methods: IR, vapor phase oven, hot air oven
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Devices are not designed to be wave soldered to the bottom side of the board.
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Recommended maximum paste thickness is 0.25mm (0.010 inch)
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Devices can be cleaned using standard industry methods and solvents.
Note: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements.
110
TM
SMD2920 Surface Mount PTC Devices
FIGURE
R.O.C. Patent#415624
SOLDER PAD LAYOUTS
PHYSICAL DIMENSIONS (mm)
Part Number
SMD2920P030TS
SMD2920P050TS
SMD2920P075TS
SMD2920P100TS
SMD2920P125TS
SMD2920P150TS
SMD2920P185TS
SMD2920P200TS
SMD2920P250TS
SMD2920P260TS
SMD2920P300TS
SMD2920P300TS/15
A
Min.
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
Max.
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
Min.
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
B
Max.
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
Min.
0.75
0.75
0.75
0.55
0.55
0.75
0.75
0.75
0.75
0.55
0.75
0.75
C
Max.
1.25
1.25
1.25
1.00
1.00
1.25
1.25
1.25
1.25
1.00
1.25
1.25
D
Min.
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
E
Min.
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Max.
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
ENVIRONMENTAL SPECIFICATIONS
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
-40℃ to +85℃
125℃
+85℃, 1000 hours
+85℃, 85%R.H. 1000 hours
MIL-STD-202 Method 107G
+85℃/-40℃ 20 times
MIL-STD-202, Method 215
MIL-STD-883C, Method 2007.1, Condition A
±5% typical resistance change
±5% typical resistance change
-30% typical resistance change
No change
No change
PHYSICAL SPECIFICATIONS
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material: 63/37 SnPb)
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
16 mm tape on 7 inch reel per EIA-481-1 (equivalent to IEC286, part 3)
2000 devices per reel for P100TS, P125TS &P260
others : 1500 devices per reel
◎
Specifications are subject to change without notice.
111
FPGA/CPLD
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