A
Datasheet
LoRa/Bluetooth Low Energy (BLE) Module
Part Numbers: RM186 and RM191
Version 1.7
RM1xx LoRa/BLE Modules
Datasheet
R
EVISION
H
ISTORY
Version
1.0
1.1
1.2
1.3
1.4
1.5
Date
19 May 2016
20 May 2016
11 Aug 2016
2 Nov 2016
01 Feb 2017
17 Oct 2017
Notes
Initial version
Updated SIG section with URL to listing
Changed
Hardware Integration Guide
to
Datasheet
Updated section numbers
Updated to include BLE Peripheral Mode
Added section
RM1xx VSP Service and Modes.
Notes to
clarify that JTAG is required when flashing between
central and peripheral firmware.
Updated
Mechanical Details
to indicate pin 1.
Fix Pin 7 in Pin Definitions Table to Pull Down
Approver
Jonathan Kaye
Jonathan Kaye
Sue White
Sue White
Jonathan Kaye
Raj Khatri
1.6
1.7
3 Nov 2017
20 Mar 2018
Sue White
Raj Khatri
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
2
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
RM1xx LoRa/BLE Modules
Datasheet
C
ONTENTS
1
Overview and Key Features ............................................................................................................................... 5
1.1
1.2
2
3
Features and Benefits ................................................................................................................................ 5
Application Areas ....................................................................................................................................... 5
Specifications ..................................................................................................................................................... 6
Hardware Specifications .................................................................................................................................... 9
3.1
3.2
3.3
Block Diagram and Pin-out ........................................................................................................................ 9
Pin Definitions ......................................................................................................................................... 10
Electrical Specifications ........................................................................................................................... 12
Absolute Maximum Ratings............................................................................................................. 12
Recommended Operating Parameters ............................................................................................ 12
nAutoRUN Pin and Operating Modes .............................................................................................. 14
LoRa Output Power and Current Consumption vs Vcc .................................................................... 14
LoRa Receive Sensitivity vs Data Rate ............................................................................................. 15
BLE Power Consumption ................................................................................................................. 16
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
4
Functional Description..................................................................................................................................... 19
4.1
4.2
Power Management (includes brown-out and power on reset)............................................................. 19
Clocks and Timers .................................................................................................................................... 20
Clocks ............................................................................................................................................... 20
Timers .............................................................................................................................................. 20
4.2.1
4.2.2
4.3
4.4
4.5
4.6
4.7
RF ............................................................................................................................................................. 20
UART Interface......................................................................................................................................... 20
SPI Bus ..................................................................................................................................................... 21
I2C Interface ............................................................................................................................................ 22
General Purpose I/O, ADC and PWM/FREQ ............................................................................................ 22
GPIO ................................................................................................................................................. 22
ADC .................................................................................................................................................. 22
PWM and FREQ Signal Output on up to Two SIO Pins .................................................................... 22
4.7.1
4.7.2
4.7.3
4.8
4.9
4.10
4.11
4.12
nRESET Pin ............................................................................................................................................... 23
nAutoRUN Pin .......................................................................................................................................... 23
RM1xx VSP Service and Modes ............................................................................................................... 23
Two-Wire SWD Programming/Debug Interface ...................................................................................... 24
RM1xx on-board chip antenna characteristics ........................................................................................ 25
3
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
RM1xx LoRa/BLE Modules
Datasheet
5
Hardware Integration Suggestions .................................................................................................................. 25
5.1
5.2
Circuit....................................................................................................................................................... 25
PCB Layout on Host PCB
–
General.......................................................................................................... 27
BLE Chip Antenna Keep-out on Host PCB ........................................................................................ 27
Antenna Keep-out and Proximity to Metal or Plastic ...................................................................... 28
5.2.1
5.2.2
5.3
6
LoRa External Antenna Integration with RM1xx ..................................................................................... 29
Mechanical Details .......................................................................................................................................... 29
6.1
6.2
RM1xx Mechanical Details....................................................................................................................... 29
Host PCB Land Pattern and Antenna Keep-out for RM1xx...................................................................... 30
7
Application Note for Surface Mount Modules ................................................................................................ 31
7.1
Introduction ............................................................................................................................................. 31
Shipping ............................................................................................................................................................... 31
7.2
8
Reflow Parameters .................................................................................................................................. 32
FCC and IC Regulatory Statements .................................................................................................................. 33
8.1
Power Exposure Information................................................................................................................... 34
OEM Responsibilities ........................................................................................................................................... 34
9
CE Regulatory .................................................................................................................................................. 36
9.1
10
10.1
11
11.1
12
12.1
12.2
Antenna Information ............................................................................................................................... 36
EU Declarations of Conformity .................................................................................................................... 38
RM186-SM ............................................................................................................................................... 38
Ordering Information .................................................................................................................................. 39
General Comments .................................................................................................................................. 39
Bluetooth SIG Qualification ......................................................................................................................... 39
Overview .................................................................................................................................................. 39
Additional Assistance............................................................................................................................... 40
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
4
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
RM1xx LoRa/BLE Modules
Datasheet
1 O
VERVIEW AND
K
EY
F
EATURES
This Datasheet describes both the RM186 (868 MHz band for EU) and RM191 (915 MHz band for US). The
differences are outlined in the radio specifications.
Every RM1xx Series module is designed to enable OEMs to add a long range LoRa radio link and either Central
OR Peripheral mode Bluetooth Low Energy (BLE) to small, portable, power-conscious devices. The RM1xx
modules are enabled with Laird’s
smart
BASIC, an event-driven programming language that enables OEMs to
make their product development quicker and simpler, significantly reducing time to market.
smartBASIC
enables
customers to develop a complete embedded application inside the compact RM1xx hardware, connecting to a
wide array of external sensors via its I2C, SPI, UART, ADC, or GPIO interfaces.
Based on the world-leading Nordic Semiconductor nRF51822 (BLE) and Semtech Sx1272 (LoRa) chipsets, the
RM1xx modules provide
ultra-low
power consumption with outstanding wireless range using the LoRa radio link
and local BLE connections via three dBm of transmit power. This document should be read in conjunction with
the
smart
BASIC user manual.
Note:
This information in this document is subject to change. Please contact Laird to obtain the most recent
version of this document
–
http://ews-support.lairdtech.com.
1.1
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Features and Benefits
Bluetooth v4.0
–
Central OR Peripheral Mode
On-board BLE chip antenna
U.FL for external LoRa antenna
smartBASIC
programming language
Bluetooth SIG Listed
1.2
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Application Areas
Public or private networks
Irrigation/Agriculture
Parking
Lighting
Asset tracking
Tank monitoring
Smart Home
–
smoke alarms,
heating,
Access control
–
security
Industrial automation
–
factory
Any long range, battery
powered sensor application
Compact footprint
Long range
–
LoRa range up to 15 km
BLE Programmable TX power +3 dBm to -20 dBm
BLE TX whisper mode (-30 dBm, -55 dBm)
BLE RX sensitivity: -91 dBm
Ultra-low power consumption
BLE TX: 12.7 mA peak (at +3 dBm @Vcc=3.3V) (See Note 4 in
the
Power Consumption
section)
BLE RX: 11.9 mA peak (@Vcc=3.3V See Note 4 in the
Power
Consumption
section)
Standby Doze: 4.2 uA (typical)
Deep Sleep: 750 nA (See Note 4 in the
Power Consumption
section)
UART, GPIO, ADC, PWM FREQ output, TIMERS, I2C, and SPI
interfaces
Fast time-to-market
FCC/IC (RM191-SM), CE (RM186-SM)
No external components required
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
5
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610