INTERCONNECTS
SERIES 714...00X • .100” GRID LOW PROFILE CARRIERS •
SINGLE AND DOUBLE ROW STRIPS
•
Low pro le receptacles sit .031” above the
board
•
Series 714 use MM #1401 and MM #1407 pin
receptacles. See pages 157 and 170 for details
.015-.025
.010 .018
.072 DIA.
.053 DIA.
.031
•
Hi-Rel, 4- nger BeCu #30 contact is used in
.096
.145
.165
the #1401 receptacle and a BeCu #11 contact
is used in the #1407. Both contacts are rated
at 3 amps. See pages 251 and 253 for details
•
Insulators are high temperature thermoplastic,
FIG. 1
.015-.021
.010 .018
.055 DIA.
.038 DIA.
.031
.083
.127
.146
suitable for all soldering operations
ORDERING INFORMATION
Single Row (.055” min. mounting hole)
FIG. 1
714 XX 1_ _ 41 001000
Specify number of pins
01-64
FIG. 2
Single Row (.039” min. mounting hole)
FIG. 2
714 XX 1_ _ 31 007000
Specify number of pins
01-64
Double Row (.055” min. mounting hole)
.015-.025
.010 .018
.072 DIA.
.053 DIA.
.031
FIG. 3
.096
.145
.165
714 XX 2_ _ 41 001000
Specify number of pins
04-64
Double Row (.039” min. mounting hole)
FIG. 4
.100
714 XX 2_ _ 31 007000
Specify number of pins
04-64
FIG. 3
PAGE 76 | INTERCONNECTS
.015-.021
.010 .018
.055 DIA.
.038 DIA.
.031
.083
.127
.146
2011/65/EU
RoHS - 2
XX=Plating Code
See Below
91
10
µ”
Au
For
Electrical, Mechanical
& Enviromental Data,
See page 264
SPECIFY PLATING CODE XX=
.100
93
30
µ”
Au
41
200
µ”
Sn
10
µ”
Au
43
200
µ”
Sn
30
µ”
Au
FIG. 4
Sleeve (Pin)
Contact (Clip)
200
µ”
Sn/Pb 200
µ”
Sn/Pb
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
NXP MCU
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