SMS05C, SMS12C, SMS15C,
SMS24C
5−Line Transient Voltage
Suppressor Array
This 5−line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in over−transient voltage and ESD sensitive
equipment such as computers, printers, automotive electronics,
networking communication and other applications. This device
features a monolithic common anode design which protects five
independent lines in a single SC−74 package.
Features
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SC−74 FIVE TRANSIENT
VOLTAGE SUPPRESSOR
350 W PEAK POWER
PIN ASSIGNMENT
1
6
1
SC−74
CASE 318F
STYLE 6
2
3
PIN 1.
2.
3.
4.
5.
6.
6
5
4
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
CATHODE
•
Protects up to 5 Lines in a Single SC−74 Package
•
Peak Power Dissipation − 350 W (8 20
ms
Waveform)
•
ESD Rating of Class 3B (Exceeding 8.0 kV) per Human Body Model
and Class C (Exceeding 400 V) per Machine Model
•
Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8.0 kV
(Contact)
•
Flammability Rating of UL 94 V−0
•
Pb−Free Package is Available
Applications
•
•
•
•
•
Hand−Held Portable Applications
Networking and Telecom
Automotive Electronics
Serial and Parallel Ports
Notebooks, Desktops, Servers
MARKING DIAGRAM
6x
M
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise specified)
Symbol
P
PK
1
Rating
Peak Power Dissipation
8
20
ms
Double Exponential Waveform
(Note 1)
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature (10 s)
Human Body Model ( HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
Value
350
Unit
W
x = SMS05C:J
= SMS12C:K
= SMS15C:L
= SMS24C:M
M
= Date Code
T
J
T
STG
T
L
ESD
−40 to 125
−55 to 150
260
>8000
>400
>15000
>8000
°C
°C
°C
V
ORDERING INFORMATION
Device
SMS05CT1
SMS12CT1
SMS15CT1
SMS15CT1G
SMS24CT1
Package
SC−74
SC−74
SC−74
SC−74
(Pb−Free)
SC−74
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Non−repetitive current pulse per Figure 3.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2005
1
February, 2005 − Rev. 5
Publication Order Number:
SMS05C/D
SMS05C, SMS12C, SMS15C, SMS24C
SMS05C ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Maximum Peak Pulse Current
Capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
J
(Note 2)
I
T
= 1.0 mA (Note 3)
V
RWM
= 5.0 V
I
PP
= 5.0 A (8
I
PP
= 24 A (8
8
20
ms
Waveform)
20
ms
Waveform)
6.2
Conditions
Min
Typ
Max
5.0
7.2
5.0
9.8
14.5
24
260
400
Unit
V
V
mA
V
V
A
pF
20
ms
Waveform
V
R
= 0 V, f = 1.0 MHz (Line to GND)
SMS12C ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Maximum Peak Pulse Current
Capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
J
(Note 2)
I
T
= 1.0 mA (Note 3)
V
RWM
= 12 V
I
PP
= 5.0 A (8
I
PP
= 15 A (8
8
20
ms
Waveform)
20
ms
Waveform)
13.3
0.001
Conditions
Min
Typ
Max
12
15
1.0
19
23
15
120
150
Unit
V
V
mA
V
V
A
pF
20
ms
Waveform
V
R
= 0 V, f = 1.0 MHz (Line to GND)
SMS15C ELECTRICAL CHARACTERISTICS
(T
J
= 25°C, unless otherwise specified) (See Note 4)
Parameter
Reverse Working Voltage
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Maximum Peak Pulse Current
Capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
J
(Note 2)
I
T
= 1.0 mA (Note 3)
V
RWM
= 15 V
I
PP
= 5.0 A (8
I
PP
= 12 A (8
8
20
ms
Waveform)
20
ms
Waveform)
17
0.05
Conditions
Min
Typ
Max
15
19
1.0
24
29
12
95
125
Unit
V
V
mA
V
V
A
pF
20
ms
Waveform
V
R
= 0 V, f = 1.0 MHz (Line to GND)
SMS24C ELECTRICAL CHARACTERISTICS
(T
J
= 25°C, unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Maximum Peak Pulse Current
Capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
J
(Note 2)
I
T
= 1.0 mA (Note 3)
V
RWM
= 24 V
I
PP
= 5.0 A (8
I
PP
= 8 A (8
8
20
ms
Waveform)
20
ms
Waveform)
26.7
0.001
Conditions
Min
Typ
Max
24
32
1.0
40
44
8.0
60
75
Unit
V
V
mA
V
V
A
pF
20
ms
Waveform
V
R
= 0 V, f = 1.0 MHz (Line to GND)
2. TVS devices are normally selected according to the working peak reverse voltage (V
RWM
), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. V
BR
is measured at pulse test current I
T
.
4. Parametrics are the same for the Pb−Free packages, which are suffixed with a “G’’.
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2
SMS05C, SMS12C, SMS15C, SMS24C
TYPICAL PERFORMANCE CURVES
(T
J
= 25°C unless otherwise specified)
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA = 25
°
C
100
% OF PEAK PULSE CURRENT
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175
200
100
90
80
70
60
50
40
30
20
10
0
0
20
40
t, TIME (ms)
60
80
t
P
t
r
PEAK VALUE I
RSM
@ 8
ms
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8
ms
HALF VALUE I
RSM
/2 @ 20
ms
T
A
, AMBIENT TEMPERATURE (°C)
Figure 1. Pulse Derating Curve
Figure 2. 8
×
20
ms
Pulse Waveform
300
JUNCTION CAPACITANCE (pF)
50
V
C
, CLAMPING VOLTAGE (V)
45
40
35
30
25
20
15
10
5
0
0
5
SMS24C
8 x 20
ms
PULSE WAVEFORM
f = 1.0 MHz
250
200
SMS05C
150
100
SMS12C
50
0
0
5
10
SMS15C
15
SMS24C
20
25
SMS15C
SMS12C
SMS05C
10
15
20
25
I
PP
, PEAK PULSE CURRENT (A)
V
BR
, REVERSE VOLTAGE (V)
Figure 3. Clamping Voltage vs. Peak Pulse Current
Figure 4. Junction Capacitance vs. Reverse Voltage
Figure 5. ESD Pulse IEC 61000−4−2
(8.0 kV Contact)
Figure 6. SMS15CT1 ESD Response for IEC
61000−4−2 (+8.0 kV Contact)
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3
SMS05C, SMS12C, SMS15C, SMS24C
TYPICAL COMMON ANODE APPLICATIONS
A 5 TVS junction common anode design in a SC-74
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. A simplified example of
SMS05C Series Device applications is illustrated below.
A
KEYBOARD
TERMINAL
PRINTER
ETC.
B
I/O
C
D
E
FUNCTIONAL
DECODER
GND
SMS05C SERIES DEVICE
Figure 7. Computer Interface Protection
V
DD
V
GG
ADDRESS BUS
RAM
ROM
DATA BUS
I/O
CPU
CLOCK
CONTROL BUS
GND
SMS05C SERIES DEVICE
Figure 8. Microprocessor Protection
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4
SMS05C, SMS12C, SMS15C, SMS24C
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM
LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
A
L
6
5
1
2
4
S
3
B
DIM
A
B
C
D
G
H
J
K
L
M
S
D
G
M
0.05 (0.002)
H
C
K
J
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0649
0
_
10
_
0.0985 0.1181
MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.65
0
_
10
_
2.50
3.00
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
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