F-218 (Rev 13FEB18)
BTH–030–01–L–D–RA–WT
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
BTH–090–01–F–D–A
(0.50 mm) .0197"
BTH SERIES
BASIC BLADE & BEAM HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTH
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2.0 A per pin
(2 pins powered)
Flammability Rating:
UL 94 VO
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC
Max Cycles:
100
RoHS Compliant:
Yes
BTH
Mates with:
BSH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
–030, –050, –060,
–090, –120, –150
No. of Positions x (0.50) .01969
+ (5.00) .197
01
(3.94)
.155
02
= Gold Flash on contact,
Matte Tin on tail
–F
–L
= (7.00 mm) .276" DIA
Polyimide Film Pick
& Place Pad
–K
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
(5.97)
.235
= Tape & Reel
(120 positions maximum)
–TR
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
Vertical=
(0.10 mm) .004" max (030-090)
Vertical=
(0.15 mm) .006" max (120-150)*
Right-angle=
(0.15 mm) .006" max (030-090)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring more
than two connectors per board
or 90 positions or higher,
contact ipg@samtec.com
(0.50)
.01969
(0.20)
.008
(0.76)
.030
(4.27)
.168
= Electro-Polished Selective
50 µ" (1.27 µm) min Au
over 150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
Matte Tin over
50 µ" (1.27 µm) min Ni
on all solder tails
(0.89)
.035
DIA
–C*
POWER/SIGNAL
APPLICATION
MATED HEIGHT
LEAD STYLE MATED HEIGHT*
*Note:
–C Plating passes
10 year MFG testing
–01
(5.00) .197
*Processing conditions will
affect mated height.
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
BTH
Mates with:
BSH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
RA
WT
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–030, –060, –090
= Gold Flash on contact,
Matte Tin on tail
–F
–L
= (7.00 mm) .276" DIA
Polyimide Film Pick
& Place Pad
–K
ALSO AVAILABLE
(MOQ Required)
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
(11 mm, 16 mm, 19 mm
and 22 mm not available
with 50 positions)
Contact Samtec.
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
No. of Positions x (0.50) .01969 + (10.88) .428
(9.78)
.385
(3.05)
.120
01
(5.97)
.235
(1.32)
.052
DIA
02
(0.71)
.028
(0.50)
.01969
(0.20)
.008
(1.32) (1.10)
.052 x .043
(0.64)
.025
SQ
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
