1-1-4 Linear Regulator ICs
SI-3000LU Series
Surface-Mount, Low Current Consumption, Low Dropout Voltage
■Features
• Compact surface-mount package (SOT89-5)
• Output current: 250 mA
• Low current consumption lq (OFF)
≤
1
µ
A
(V
C
= 0 V)
• Low dropout voltage: V
DIF
≤
0.5 V
(at I
O
= 250 mA)
• Output voltage range (1.5V to 15V)
• Built-in drooping-type-overcurrent and thermal
protection circuits
■Absolute
Maximum Ratings
Parameter
DC Input Voltage
Output control terminal voltage
DC Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to Ambient Air)
Symbol
V
IN
V
C
I
O
P
D*1
T
j*2
T
stg*2
Ratings
18
V
IN
250
0.75
–40 to +135
–40 to +125
146
Unit
V
V
mA
W
°C
°C
°C/W
(T
a
=25°C)
θ
j-a*1
*1: When mounted on glass-epoxy board 40
×
40 mm (copper laminate area 2%).
*2: Thermal protection circuits may operate if the junction temperature exceeds 135°C.
■Applications
• Auxiliary power supplies for PC
• Battery-driven electronic equipment
■Recommended
Operating Conditions
Ratings
Parameter
Input Voltage
DC Output Current
Operating Ambient Temperature
Symbol
V
IN
I
O
T
op
min.
*2, *3
max.
V
O
+2
*1
250
85
Unit
V
mA
°C
0
–20
*1: V
IN
(max) and I
O
(max) are restricted by the relation P
D
= (V
IN
- V
O
)
×
I
O
.
Calculate these values referring to the reference data on page 69.
*2: Refer to the Dropout Voltage parameter.
*3: For the SI-3012LU, set the input voltage to Vin
≥
2.4 V, and secure the minimum voltage as explained in "Setting DC Input Voltage" section in Linear Regulator Application Note.
■Electrical
Characteristics
Ratings
Parameter
Symbol
min.
Reference Voltage
V
ADJ
Conditions
V
DIF
Dropout Voltage
Conditions
Conditions
∆V
LINE
Line Regulation
Conditions
∆V
LOAD
Load Regulation
Conditions
Temperature Coefficient of
Reference Voltage
Ripple Rejection
Conditions
Quiescent Circuit
Current
Circuit Current at Output OFF
Overcurrent Protection
Starting Current
*1
Control Voltage (Output ON)
*2
Control Voltage (Output OFF)
*2
V
C
Terminal
Control Current (Output ON)
Control Current (Output OFF)
I
q
Conditions
I
q
(OFF)
Conditions
I
S1
Conditions
V
C
, IH
V
C
, IL
I
C
, IH
Conditions
I
C
, IL
Conditions
V
C
=2V
0
V
C
=0V
2.0
260
V
IN
=V
O
+1V
V
IN
=V
O
+1V, V
C
=0V
V
IN
=V
O
+1V, I
O
=0mA
V
C
=2V, R2=100kΩ
∆V
O
/∆T
a
Conditions
R
REJ
V
IN
=V
O
+1V,
I
O
=1 to 250mA( V
O
=3.3V)
±0.3
T
j
=0 to 100°C
55
V
IN
=V
O
+1V ,
f=100 to 120H
Z
( V
O
=3.3V)
V
IN
=V
O
+1 to V
O
+5V,
I
O
=10mA( V
O
=3.3V)
I
O
=100mA(V
O
=3.3V)
1.210
SI-3012LU(Variable)
typ.
1.250
V
IN
=V
O
+1V, I
O
=10mA
(T
a
=25°C, V
C
=2V, unless otherwise specified)
Unit
max.
1.290
0.3
0.5
I
O
=250mA(V
O
=3.3V)
10
mV
20
mV
V
V
mV/
°C
dB
150
µ
A
1
µ
A
mA
V
0.8
40
–5
µ
A
µ
A
*1: Is
1
is specified at the 5% drop point of output voltage V
O
on the condition that V
IN
= 3.3 V, and I
O
= 10 mA.
*2: Output is OFF when the output control terminal (V
C
terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
68
ICs
SI-3000LU Series
■External
Dimensions (SOT89-5)
4.5
±0.05
1.6
±0.05
4.2
±0.05
t
4.2
±0.05
4.2
±0.05
r
0.4
±0.03
0.1
±0.05
(Unit : mm)
2.5
±0.05
4.3
±0.05
.0
(
φ
1
5
±
0.0
)
Pin Assignment
q
ADJ
w
GND
e
V
C
r
V
IN
t
V
O
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.05g
0.40
4.2
±0.05
q
w
e
4.2
±0.05
1.5
±0.05
1.5
±0.05
■Block
Diagram
SI-3012LU
V
IN
4
5 V
O
0.4
±0.05
1.5
±0.05
0.90
±0.1
4.7
±0.05
0.90
±0.1
V
C
3
TSD
+
–
1 ADJ
2 GND
REF
■Typical
Connection Diagram
SI-3012LU
V
IN
C
IN
4
3
1
2
GND
V
C
A
DJ
R
2
5
V
O
R
1
Load
+
V
IN
C
O
: Output capacitor (10
µ
F or larger)
For SI-3000LU series, Co has to be a low ESR capacitor such as a
ceramic capacitor.
C
IN
: Input capacitor (10
µ
F approx.)
Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)
R1 and R2: Resistors for output setting
The output voltage can be set by connecting R1 and R2 as shown in the
diagram on the left.
R2: 100 kΩ is recommended
R1=(V
O
–V
ADJ
)/(V
ADJ
/R2)
•
■Reference
Data
Copper Laminate Area vs Power Dissipation
T
j
=100°C PCB size 40×40
1
Ta=25°C
0.9
Ta=40°C
Ta=60°C
Ta=85°C
Power Dissipation P
D
(W)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
Case temperature Tc
measurement point
• A monolithic ICs mounts an inner frame stage that is connected to the GND
pin (pin 2). Therefore, enlarging the copper laminate area connected to the
GND pin improves heat radiation effect.
• Obtaining the junction temperature
Measure the temperature T
C
at the lead part of the GND pin (pin 2) with a
thermocouple, etc. Then, substitute this value in the following formula to
obtain the junction temperature.
T
j
=P
D
×θ
j–c+Tc (
θ
j–c=5
°
C/W)
100
1000
Copper Laminate Area (mm
2
)
ICs
69
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