FIFO 1024x9x2 Asynch Bidir FIFO Mem
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP |
| 包装说明 | TFQFP, TQFP64,.47SQ |
| 针数 | 64 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 最长访问时间 | 45 ns |
| 其他特性 | BYPASS-XCVR |
| 最大时钟频率 (fCLK) | 16.7 MHz |
| 周期时间 | 60 ns |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e4 |
| 长度 | 10 mm |
| 内存密度 | 9216 bit |
| 内存集成电路类型 | BI-DIRECTIONAL FIFO |
| 内存宽度 | 9 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1KX9 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFQFP |
| 封装等效代码 | TQFP64,.47SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| SN74ACT2235-60PAG | SN74ACT2235-20PAG | SN74ACT2235-60FN | SN74ACT2235-40PAG | SN74ACT2235-40FN | SN74ACT2235-30PAG | |
|---|---|---|---|---|---|---|
| 描述 | FIFO 1024x9x2 Asynch Bidir FIFO Mem | FIFO 1024x9x2 Asynch Bidir FIFO Mem | FIFO 1024x9x2 ASynch Bi directional FIFO Mem | FIFO 1024x9x2 Asynch Bidir FIFO Mem | FIFO 1024x9x2 ASynch Bi directional FIFO Mem | FIFO 1024x9x2 Asynch Bidir FIFO Mem |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP | QFP | LCC | QFP | LCC | QFP |
| 包装说明 | TFQFP, TQFP64,.47SQ | TFQFP, TQFP64,.47SQ | QCCJ, LDCC44,.7SQ | TFQFP, TQFP64,.47SQ | QCCJ, LDCC44,.7SQ | TFQFP, TQFP64,.47SQ |
| 针数 | 64 | 64 | 44 | 64 | 44 | 64 |
| Reach Compliance Code | compliant | compli | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week |
| 最长访问时间 | 45 ns | 25 ns | 45 ns | 35 ns | 35 ns | 25 ns |
| 其他特性 | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR |
| 最大时钟频率 (fCLK) | 16.7 MHz | 50 MHz | 16.7 MHz | 25 MHz | 25 MHz | 33 MHz |
| 周期时间 | 60 ns | 20 ns | 60 ns | 40 ns | 40 ns | 30 ns |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQCC-J44 | S-PQFP-G64 | S-PQCC-J44 | S-PQFP-G64 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 10 mm | 10 mm | 16.585 mm | 10 mm | 16.585 mm | 10 mm |
| 内存密度 | 9216 bit | 9216 bi | 9216 bit | 9216 bi | 9216 bi | 9216 bi |
| 内存集成电路类型 | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 44 | 64 | 44 | 64 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | TFQFP | QCCJ | TFQFP | QCCJ | TFQFP |
| 封装等效代码 | TQFP64,.47SQ | TQFP64,.47SQ | LDCC44,.7SQ | TQFP64,.47SQ | LDCC44,.7SQ | TQFP64,.47SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER | FLATPACK, THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 4.57 mm | 1.2 mm | 4.57 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | J BEND | GULL WING | J BEND | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 10 mm | 16.585 mm | 10 mm | 16.585 mm | 10 mm |
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