IC ADC 12-BIT 135MSPS 64-QFN
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 |
针数 | 64 |
制造商包装代码 | UP |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.C.2 |
Is Samacsys | N |
最大模拟输入电压 | 1 V |
最小模拟输入电压 | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N64 |
JESD-609代码 | e3 |
长度 | 9 mm |
最大线性误差 (EL) | 0.0244% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
采样速率 | 135 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 0.8 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 9 mm |
Base Number Matches | 1 |
LTC2221IUP#TRPBF | LTC2220CUP#PBF | LTC2221CUP#TRPBF | LTC2221IUP#PBF | LTC2221CUP#PBF | LTC2220CUP#TRPBF | LTC2220IUP#PBF | LTC2220IUP#TRPBF | |
---|---|---|---|---|---|---|---|---|
描述 | IC ADC 12-BIT 135MSPS 64-QFN | IC ADC 12-BIT 170MSPS 64-QFN | IC ADC 12-BIT 135MSPS 64-QFN | IC ADC 12-BIT 135MSPS 64-QFN | IC ADC 12-BIT 135MSPS 64-QFN | IC ADC 12BIT 170MSPS 64-QFN | IC ADC 12BIT 170MSPS 64-QFN | IC ADC 12BIT 170MSPS 64-QFN |
Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 |
针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
制造商包装代码 | UP | UP | UP | UP | UP | UP | UP | UP |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 |
Is Samacsys | N | N | N | N | N | N | N | N |
最大模拟输入电压 | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
最小模拟输入电压 | -1 V | -1 V | -1 V | -1 V | -1 V | -1 V | -1 V | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm |
最大线性误差 (EL) | 0.0244% | 0.0366% | 0.0244% | 0.0244% | 0.0244% | 0.0366% | 0.0366% | 0.0366% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 135 MHz | 170 MHz | 135 MHz | 135 MHz | 135 MHz | 170 MHz | 170 MHz | 170 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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