The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Bridge Rectifier Diodes for rectification applications in compact chip package
0.23 ˝ x 0.20 ˝ size format, which offers PCB real estate savings and are considerably smaller
than standard parts. The Bridge Rectifier Diodes offer a forward current of 1 A with a choice
of repetitive peak reverse voltages between 200 V and 1000 V.
Absolute Maximum Ratings (@ T
A
= 25 °C Unless Otherwise Noted)
Parameter
Maximum Repetitive
Peak Reverse Voltage
Maximum RMS Voltage
Maximum Average Forward Rectified
Current (T
A
= 55 °C)
Symbol
VRRM
VRMS
IF(AV)
IFSM
TJ
CD-
MBL102S
200
140
MBL104S
400
280
MBL106S
600
420
1
30
-55 to +175
-55 to +175
MBL108S
800
560
~
3
~
2
MBL110S
1000
700
Unit
V
V
A
A
°C
°C
Peak Forward Surge Current 8.3 ms
Single Half Sine-Wave Superimposed
on Rated Load (JEDEC Method)
Operating Temperature Range
Storage Temperature Range
TSTG
Electrical Characteristics (@ T
A
= 25 °C Unless Otherwise Noted)
Parameter
Instantaneous Forward Voltage
Repetitive Peak Reverse Current
Junction Capacitance
Thermal Resistance, Junction to Air
(1)
Thermal Resistance, Junction to Lead
(1)
Symbol
VF
IRRM
CJ
CD-MBL1xxS
Test Conditions
IF = 1 A
VR = VRRM
TA = +25 °C
Min.
Typ.
0.95
Max.
1.0
5.0
200
25
95
20
Unit
V
µA
µA
pF
°C / W
°C / W
R
ΘJA
R
ΘJL
TA = +150 °C
VR = 4 V, f = 1.0 MHz
NOTE 1: Measured when mounted on PCB with 5.0 mm x 5.0 mm (0.2 “ x 0.2 “) copper pad areas.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
3312 - 2 mm SMD Trimming Potentiometer
CD-MBL1xxS Surface Mount Bridge Rectifier Diode
Rating and Characteristic Curves
Forward Current Derating Curve
1.2
Maximum Non-Repetitive Peak Forward Surge Current
40
35
30
25
20
15
10
5
0
1
10
100
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
Average Forward Rectified Current (Amps)
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
175
Ambient Temperature (°C)
60 Hz Resistive
or Inductive Load
Peak Forward Surge Current (Amps)
1.0
Number of Cycles at 60 Hz
Forward Characteristics
Reverse Characteristics
100
Instantaneous Forward Current (Amps)
1.00
Instantaneous Reverse Current (µA)
10.0
TJ = 100 °C
1.0
0.10
0.10
TJ = 25 °C
TJ = 25 °C
Pulse Width = 300 µS
0.01
0.0
0.01
0.2
0.4
0.6
0.8
1.0
1.2
1.3
0
20
40
60
80
100
120
140
Instantaneous Forward Voltage (Volts)
Percent of Rated Peak Reverse Voltage (%)
Typical Junction Capacitance
100
TJ = 25 °C
Junction Capacitance (pF)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different
applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
10
1
0.1
0.2
0.4
1
2
4
10
20
40
100
Reverse Voltage (Volts)
3312 - 2 mm SMD Trimming Potentiometer
CD-MBL1xxS Surface Mount Bridge Rectifier Diode
Product Dimensions
This is an RoHS2 compliant product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated (lead free) and
are solderable per MIL-STD-750, Method 2026. The package and dimensions are shown below.
A
B
Dimensions
A
B
F
5.20 - 5.40
(0.205 - 0.213)
4.10 - 4.30
(0.161 - 0.169)
5.70 - 5.90
(0.224 - 0.232)
1.00 - 1.20
(0.039 - 0.047)
0.85 - 0.95
(0.033 - 0.037)
0.86 - 1.16
(0.0338 - 0.0457)
TOP VIEW
C
D
C
MM
DIMENSIONS:
(INCHES)
E
F
D
E
Recommended Footprint
4.10 ± 0.1
(0.161 ± 0.004)
How to Order
CD - MBL 1 02 S
Common Code
Chip Diode
Model
MBL = MBL Bridge Series
Average Forward Current
1= 1A
Reverse Voltage
02 = 200 V
04 = 400 V
06 = 600 V
08 = 800 V
10 = 1000 V
5.72 ± 0.1
(0.225 ± 0.004)
Forward Voltage Suffix
S = Standard Forward Voltage
Typical Part Marking
1.5 ± 0.1
(0.059 ± 0.004)
MM
DIMENSIONS:
(INCHES)
1.10 ± 0.1
(0.043 ± 0.004)
MANUFACTURER'S
TRADEMARK
FORWARD
CURRENT
x 100 mA
V
RMS
= 800 V
DATE CODE
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD-MBL1xxS Surface Mount Bridge Rectifier Diode
Packaging Information
The surface mount product is packaged in a 12 mm x 8 mm tape and reel format per EIA-481 standard.
P
0
P
1
T
120 °
F
B
W
D2
D1 D
d
Index Hole
E
P
Trailer
A
Device
C
Leader
End
.......
.......
10 pitches (min.)
.......
.......
.......
.......
.......
.......
10 pitches (min.)
Start
W1
DIMENSIONS:
MM
(INCHES)
Direction of Feed
Item
Carrier Width
Carrier Length
Carrier Depth
Sprocket Hole
Reel Outside Diameter
Reel Inner Diameter
Feed Hole Diameter
Sprocket Hole Position
Punch Hole Position
Punch Hole Pitch
Sprocket Hole Pitch
Embossment Center
Overall Tape Thickness
Tape Width
Reel Width
Quantity per Reel
Symbol
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
--
CD-MBL1xxS
5.90 ± 0.10
(0.232 ± 0.004)
6.50 ± 0.10
(0.256 ± 0.004)
1.50 ± 0.10
(0.059 ± 0.004)
1.55 ± 0.05
(0.061 ± 0.002)
330
(12.992)
50.0
MIN.
(1.969)
13.0 ± 0.20
(0.512 ± 0.008)
1.75 ± 0.10
(0.069 ± 0.004)
5.50 ± 0.05
(0.217 ± 0.002)
8.00 ± 0.10
(0.315 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
12.00 ± 0.20
(0.472 ± 0.008)
18.7
MAX.
(0.736)
5,000
Asia-Pacific:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
REV. 02/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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